Patent Grant
12224100
This application claims benefit of priority to Korean Patent Application No. 10-2019-0162560 filed on Dec. 9, 2019 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety.
The present disclosure relates to a coil component.
An inductor, a coil component, is a typical passive electronic component used in electronic devices, along with a resistor and a capacitor.
In the case of a thin film type inductor, a magnetic composite sheet including magnetic metal powder particles is stacked and cured on a substrate on which a coil portion is formed using a plating process, to form a body, and external electrodes are formed on a surface of the body.
In the case of a thin film type coil component which may be one of coil components, a coil portion may be formed on a support substrate by a thin film process such as a plating process or the like, one or more magnetic composite sheets may be stacked on the support substrate on which the coil portion is formed to form a body, and an external electrode may be formed on the body.
The coil portion of the thin film type coil component may form a seed layer on the support substrate, and may form a plating layer by an electroplating process. Specifically, the coil portion may be formed by first forming a seed layer having a shape corresponding to the coil portion on one surface of the support substrate, forming a plating resist, and performing an electroplating process. Alternatively, the coil portion may be formed by forming a seed layer on the entire surface of the support substrate, forming a plating resist, performing an electroplating process, removing the plating resist, and removing a region, except for a region in which an electroplating layer is formed.
In the latter method, a post-process for removing the plating resist and the seed layer is generally performed, but there may be a problem that poor insulation may occur due to a seed layer remaining between the coil portions.
An aspect of the present disclosure is to provide a coil component capable of preventing poor insulation between coil portions, and securing fixing force with a support substrate without a seed layer.
According to an aspect of the present disclosure, a coil component includes a support substrate having one surface including at least one groove portion; a coil portion disposed to contact the one surface of the support substrate; and a body embedding the support substrate and the coil portion, wherein the coil portion has an anchor portion disposed in the at least one groove portion, and a pattern portion disposed on the anchor portion and spaced apart from the one surface of the support substrate. Aline width of the anchor portion is narrower than a line width of the pattern portion.
The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description, taken in conjunction with the accompanying drawings, in which:
The terms used in the description of the present disclosure are used to describe a specific embodiment, and are not intended to limit the present disclosure. A singular term includes a plural form unless otherwise indicated. The terms “include,” “comprise,” “is configured to,” etc. of the description of the present disclosure are used to indicate the presence of features, numbers, steps, operations, elements, parts, or combination thereof, and do not exclude the possibilities of combination or addition of one or more additional features, numbers, steps, operations, elements, parts, or combination thereof. Also, the terms “disposed on,” “positioned on,” and the like, may indicate that an element is positioned on or beneath an object, and does not necessarily mean that the element is positioned above the object with reference to a gravity direction.
The term “coupled to,” “combined to,” and the like, may not only indicate that elements are directly and physically in contact with each other, but also include the configuration in which another element is interposed between the elements such that the elements are also in contact with the other component.
Sizes and thicknesses of elements illustrated in the drawings are indicated as examples for ease of description, and the present disclosure are not limited thereto.
A value used to describe a parameter such as a 1-D dimension of an element including, but not limited to, “length,” “width,” “thickness,” diameter,” “distance,” “gap,” and/or “size,” a 2-D dimension of an element including, but not limited to, “area” and/or “size,” a 3-D dimension of an element including, but not limited to, “volume” and/or “size”, and a property of an element including, not limited to, “roughness,” “density,” “weight,” “weight ratio,” and/or “molar ratio” may be obtained by the method(s) and/or the tool(s) described in the present disclosure. The present disclosure, however, is not limited thereto. Other methods and/or tools appreciated by one of ordinary skill in the art, even if not described in the present disclosure, may also be used.
In the drawings, an X direction is a first direction or a length direction, a Y direction is a second direction or a width direction, and a Z direction is a third direction or a thickness direction.
Hereinafter, a coil component according to an embodiment of the present disclosure will be described in detail with reference to the accompanying drawings. Referring to the accompanying drawings, the same or corresponding components may be denoted by the same reference numerals, and overlapped descriptions will be omitted.
In electronic devices, various types of electronic components may be used, and various types of coil components may be used between the electronic components to remove noise, or for other purposes.
In other words, in electronic devices, a coil component may be used as a power inductor, a high frequency (HF) inductor, a general bead, a high frequency (GHz) bead, a common mode filter, and the like.
Referring to
The body 100 may form an exterior of the coil component 1000 according to this embodiment, and may embed the support substrate 200 and the coil portion 300 therein.
The body 100 may be formed to have a hexahedral shape overall.
Referring to
The body 100 may be formed such that the coil component 1000 according to this embodiment in which the external electrodes 500 and 600 to be described later are formed has a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.65 mm, but is not limited thereto. Alternatively, the body 100 may be formed such that the coil component 1000 according to this embodiment in which the external electrodes 500 and 600 to be described later are formed has a length of 2.0 mm, a width of 1.6 mm, and a thickness of 0.55 mm. Alternatively, the body 100 may be formed such that the coil component 1000 according to this embodiment in which the external electrodes 500 and 600 to be described later are formed has a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.55 mm. Alternatively, the body 100 may be formed such that the coil component 1000 according to this embodiment in which the external electrodes 500 and 600 to be described later are formed has a length of 1.2 mm, a width of 1.0 mm, and a thickness of 0.55 mm. Since the above-described sizes of the coil component 1000 according to this embodiment are merely illustrative, cases in which sizes are other than the above-mentioned sizes may be not excluded from the scope of the present disclosure.
The body 100 may include a magnetic powder particle and an insulating resin. Specifically, the body 100 may be formed by stacking one or more magnetic composite sheets including the insulating resin and the magnetic powder particle dispersed in the insulating resin, and then curing the magnetic composite sheets. The body 100 may have a structure other than the structure in which the magnetic powder particle may be dispersed in the insulating resin. For example, the body 100 may be made of a magnetic material such as ferrite.
The magnetic powder particle may be, for example, a ferrite powder particle or a metal magnetic powder particle.
Examples of the ferrite powder particle may include at least one or more of spinel type ferrites such as Mg—Zn-based ferrite, Mn—Zn-based ferrite, Mn—Mg-based ferrite, Cu—Zn-based ferrite, Mg—Mn—Sr-based ferrite, Ni—Zn-based ferrite, and the like, hexagonal ferrites such as Ba—Zn-based ferrite, Ba—Mg-based ferrite, Ba—Ni-based ferrite, Ba—Co-based ferrite, Ba—Ni—Co-based ferrite, and the like, garnet type ferrites such as Y-based ferrite, and the like, and Li-based ferrites.
The metal magnetic powder particle may include one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the metal magnetic powder particle may be at least one or more of a pure iron powder, a Fe—Si-based alloy powder, a Fe—Si—Al-based alloy powder, a Fe—Ni-based alloy powder, a Fe—Ni—Mo-based alloy powder, a Fe—Ni—Mo—Cu-based alloy powder, a Fe—Co-based alloy powder, a Fe—Ni—Co-based alloy powder, a Fe—Cr-based alloy powder, a Fe—Cr—Si-based alloy powder, a Fe—Si—Cu—Nb-based alloy powder, a Fe—Ni—Cr-based alloy powder, and a Fe—Cr—Al-based alloy powder.
The metallic magnetic powder particle may be amorphous or crystalline. For example, the metal magnetic powder particle may be a Fe—Si—B—Cr-based amorphous alloy powder, but is not limited thereto.
The ferrite powder and the metal magnetic powder particle may have an average diameter of about 0.1 μm to 30 μm, respectively, but are not limited thereto.
The body 100 may include two or more types of magnetic powder particles dispersed in an insulating resin. In this case, the term “different types of magnetic powder particle” means that the magnetic powder particles dispersed in the insulating resin are distinguished from each other by diameter, composition, crystallinity, and a shape. For example, the body 100 may include two or more magnetic powder particles of different diameters.
The insulating resin may include an epoxy, a polyimide, a liquid crystal polymer, or the like, in a single form or in combined forms, but is not limited thereto.
The body 100 may include a core 110 passing through the support substrate 200 and the coil portion 300 to be described later. The core 110 may be formed by filling at least a portion of the magnetic composite sheet with through-holes of the coil portion 300 in operations of stacking and curing the magnetic composite sheet, but is not limited thereto.
The support substrate 200 may have one surface and the other surface opposing each other, and may be embedded in the body 100, together with the coil portion 300 to be described later. The support substrate 200 may be configured to support the coil portion 300. In this embodiment, for convenience of description, the one surface of the support substrate 200 may be described, but the present disclosure is not limited thereto, and the description of the one surface of the support substrate 200 may be similarly applied to the other surface of the support substrate 200.
The support substrate 200 may be formed of an insulating material including a thermosetting insulating resin such as an epoxy resin, a thermoplastic insulating resin such as polyimide, or a photosensitive insulating resin, or may be formed of an insulating material in which a reinforcing material such as a glass fiber or an inorganic filler is impregnated with such an insulating resin. For example, the support substrate 200 may be formed of an insulating material such as a copper clad laminate (CCL), prepreg, Ajinomoto Build-up Film (ABF), FR-4, a bismaleimide triazine (BT) film, a photoimageable dielectric (PID) film, and the like, but are not limited thereto.
As the inorganic filler, at least one or more selected from a group consisting of silica (SiO2), alumina (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, mud, a mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3), and calcium zirconate (CaZrO3) may be used.
When the support substrate 200 is formed of an insulating material including a reinforcing material, the support substrate 200 may provide better rigidity. When the support substrate 200 is formed of an insulating material not containing glass fibers, the support substrate 200 may be advantageous for reducing a thickness of the overall coil portion 300. When the support substrate 200 is formed of an insulating material containing a photosensitive insulating resin, the number of processes for forming the coil portion 300 may be reduced. Therefore, it may be advantageous in reducing production costs, and a fine via may be formed.
Referring to
When the average roughness (Ra) is less than 1 μm, an anchor portion 310 to be described below may not be formed to a sufficient size. Therefore, fixing force between the support substrate 200 and the coil portion 300 may be relatively weakened. When the average roughness (Ra) is greater than 5 μm, rigidity of the support substrate 200 may be relatively weakened, which may be disadvantageous to formation of the coil portion 300 having a relatively high aspect ratio. In general, a roughness having a numerical range of 0.05 μm to 0.5 μm may be formed on the support substrate in order to strengthen the fixing force between the support substrate and the coil portion. For example, by forming the groove portion 210 having a relatively larger average roughness (Ra) than in the related art, fixing force between the coil portion 300 and the support substrate 200 may be secured, without a seed layer described later. The groove portion 210 may be formed by disposing a copper foil layer (not illustrated) on at least the one surface of the support substrate 200, and then removing the copper foil layer (not illustrated). For example, a copper foil layer (not illustrated) having a surface with a roughness of a predetermined size or more may be attached to the one surface of the support substrate 200. Thereafter, by removing the copper foil layer (not illustrated), the groove portion 210 having the above-described average roughness (Ra) may be formed on the one surface of the support substrate 200. In this embodiment, the surface roughness of the copper foil layer (not illustrated) is not limited, but in order to form the groove portion 210, a thickness of the copper foil layer (not illustrated) may be sufficiently thick. Referring to
A thickness of the support substrate 200 may be 10 μm or more and 60 μm or less, and more preferably 20 μm or more and 60 μm or less. The thickness of the supporting substrate 200 may be measured, for example, by measuring a thickness of the cross section of the copper clad laminate (CCL) through an optical microscope. As an example, the magnification of the optical microscope may be set to 200 times. The thickness of the supporting substrate 200 may be, for example, a median value of 10 μm or more and 60 μm or less. The thickness of the supporting substrate may be measured by measuring the maximum and minimum values of the thickness of the supporting substrate and calculating the median of these values. When the thickness of the support substrate 200 is less than 20 μm, it may be difficult to secure rigidity of the support substrate 200. Therefore, it may be difficult to support the coil portion 300 to be described later in the manufacturing process. When the thickness of the support substrate 200 is greater than 60 μm, it may be disadvantageous to make the coil portion thinner, and it may be disadvantageous in realizing relatively high inductance, since a volume occupied by the support substrate 200 in the body of the same volume increases.
The coil portion 300 may be disposed to have a planar spiral shape, to contact at least the one surface of the support substrate 200, and may be embedded in the body 100, to manifest the characteristics of the coil component. For example, when the coil component 1000 of this embodiment is used as a power inductor, the coil portion 300 may function to stabilize the power supply of an electronic device by storing an electric field as a magnetic field and maintaining an output voltage.
Referring to
The coil portion 300 may include first and second coil patterns 331 and 332, and a via 340. Based on the direction of
Referring to
End portions of the coil portion 300 may be connected to the first and second external electrodes 500 and 600, which will be described later. Referring to
Referring to
Referring to
In this embodiment, a seed layer (not illustrated) may be first formed on one surface and the other surface of a support substrate 200 in which a groove portion 210 is formed. The seed layer may not remain in a final structure of a coil component 1000 of this embodiment, but may be formed to fabricate lower and upper plating layers 3201 and 3202 by an electrolytic plating process. The seed layer may be formed by performing a sputtering process or an electroless plating process on the support substrate 200. The seed layer may not be completely disposed on the one surface of the support substrate 200. For example, the seed layer may not be completely disposed in the groove portion 210, depending on a depth of the groove portion 210 formed in the support substrate 200 or strength of the sputtering process. As a result, referring to
The lower plating layer 3201 may be formed by forming a plating resist having an opening in the seed layer, and then filling the opening of the plating resist with a conductive material by an electrolytic plating process. The plating resist may be formed in a form including an insulating wall disposed between the opening formed in a planar spiral shape having a plurality of turns and an adjacent opening, by forming a plating resist forming material on the seed layer and then performing a photolithography process thereon. The plating resist may be formed by applying a liquid photosensitive material to the seed layer or stacking a sheet type photosensitive material to the seed layer. A width of the opening of the plating resist (or a separation distance between adjacent insulating walls) may correspond to a width of the pattern portion 320, and a width of the insulating wall may correspond to a separation distance between turns of the pattern portion 320 described above. A thickness of the insulating wall may correspond to a height of the pattern portion 320 described above. The plating resist may include a photosensitive insulating material (a photo imageable dielectric (PID)) that may be peeled off by a stripper. For example, the plating resist may include a photosensitive material including as a main component a cyclic ketone compound, and an ether compound having a hydroxy group, wherein the cyclic ketone compound is, for example, cyclopentanone or the like, and the ether compound having a hydroxy group is, for example, polypropylene glycol monomethyl ether or the like.
Alternatively, the plating resist may include a photosensitive material including a bisphenol-based epoxy resin as a main component, wherein the bisphenol-based epoxy resin is, for example, bisphenol A novolac epoxy resin, bisphenol A diglycidyl ether bisphenol A polymer resin, or the like. However, the scope of the present disclosure is not limited thereto, and the plating resist may be applied to any one as long as it may be peeled off by the stripper.
The lower and upper plating layers 3201 and 3202 may include copper (Cu). For example, the lower and upper plating layers 3201 and 3202 may be made of copper (Cu) by an electrolytic copper plating process, but the scope of the present disclosure is not limited thereto. As a result, both the anchor portion 310 and the pattern portion 320 may include copper (Cu), and the lower plating layer 3201 may be integrally formed. The lower and upper plating layers 3201 and 3202 and the seed layer may be made of different metals. The lower and upper plating layers 3201 and 3202 may be formed as a single layer by a single electroplating process, or may be formed as a plurality of layers by a plurality of electroplating processes. For example, the anchor portion 310 and the pattern portion 320 may be formed as a single metal layer without an interface between each other.
In this embodiment, after forming the lower plating layer 3201 on the seed layer, the plating resist may be chemically removed using a stripper, and the seed layer may be removed using a seed etching solution. The stripper may include a high concentration of strong acid, and the seed etching solution may selectively react with the seed layer. The seed etching solution may react with the seed layer, and may not react with the electroplating layer, which may be the lower plating layer 3201. As a result, in this embodiment, the seed layer remaining around the lower plating layer 3201 may be removed.
A via 340 may include at least one plating layer. For example, when a via 340 is formed by an electroplating process, the via 340 may include a seed layer formed on an inner wall of a via hole penetrating the support substrate 200, and an electroplating layer filling the via hole on which the seed layer is formed. The seed layer of the via 340, and the seed layer for forming the coil portion 300 may be formed together in the same process to be integrally formed, or may be formed in different processes to forma boundary between them. The via 340 may include a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), chromium (Cr), molybdenum (Mo), or alloys thereof. In this embodiment, since the lower plating layer 3201 is formed on the seed layer, the plating resist is chemically removed using a stripper, and the seed layer is removed using a seed etching solution, the seed layer of the via 340 may not also remain.
The external electrodes 500 and 600 may have a single-layer structure or a multilayer structure. For example, the first external electrode 500 may include a first layer (not illustrated) including copper (Cu), a second layer (not illustrated) disposed on the first layer (not illustrated) and including nickel (Ni), and a third layer (not illustrated) disposed on the second layer (not illustrated) and including tin (Sn). In this case, the first to third layers (not illustrated) may be formed by a plating process, respectively, but are not limited thereto. As another example, the first external electrode 500 may include a resin electrode including a conductive powder particle such as silver (Ag) or the like, and a resin, and a nickel (Ni)/tin (Sn) plating layer plated on the resin electrode.
The external electrodes 500 and 600 may be formed of a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof, but are not limited thereto.
The insulating layer 400 may insulate between the coil portion 300 and the body 100. For example, the insulating layer 400 may be formed to surround the support substrate 200 and the coil portion 300. Referring to
The insulating layer 400 may be provided to insulate the coil portion 300 from the body 100, and may include a known insulating material such as parylene, and the like. An insulating material included in the insulating layer 400 may be any insulating material, and is not particularly limited thereto. The insulating layer 400 may be formed using a vapor deposition process or the like, but not limited thereto, and may be formed using stacking an insulation film on both surfaces of the support substrate 200. In the former case, the insulating layer 400 may be formed in the form of a conformal film along the surfaces of the support substrate 200 and the coil portion 300. In the latter case, the insulating layer 400 may be formed to fill a space between neighboring pattern portions 320, and a space between the anchor portion 310 and the support substrate 200. The insulating layer 400 in the present disclosure may be an optional configuration, and the insulating layer 400 may be omitted, when the body 100 secures sufficient insulation resistance under operating conditions of the coil component 1000 according to this embodiment.
According to the present disclosure, poor insulation between the coil portions may be prevented and fixing force with the support substrate without the seed layer may be secured.
While embodiments have been illustrated and described above, it will be apparent to those skilled in the art that modifications and variations could be made without departing from the scope of the present disclosure as defined by the appended claims.
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| Number | Date | Country | |
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| 20210175004 A1 | Jun 2021 | US |
