Insulating particles having an electrically conductive coating

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CPC
H05K2201/0221

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0221Insulating particles having an electrically conductive coating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Process of fabricating a beaded path on the surface of a substrate,...
- Patent number 11,856,709
- Issue date Dec 26, 2023
- AGNIESZKA MAGDZIARZ CADENAS
- Zbigniew Rozynek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processor interposer and electronic system including the processor...
- Patent number 11,683,889
- Issue date Jun 20, 2023
- Infineon Technologies Austria AG
- Danny Clavette
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded power device module, processor substrate and electronic sy...
- Patent number 11,552,049
- Issue date Jan 10, 2023
- Infineon Technologies Austria AG
- Danny Clavette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer circuit board with traces thicker than a circuit board
- Patent number 11,406,024
- Issue date Aug 2, 2022
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication process for flip chip bump bonds using nano-LEDs and co...
- Patent number 11,166,384
- Issue date Nov 2, 2021
- Konica Minolta Laboratory U.S.A., Inc.
- Karsten Bruening
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system and interposer having an embedded power device mo...
- Patent number 11,147,165
- Issue date Oct 12, 2021
- Infineon Technologies Austria AG
- Danny Clavette
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic system and processor substrate having an embedded power...
- Patent number 11,071,206
- Issue date Jul 20, 2021
- Infineon Technologies Austria AG
- Danny Clavette
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure
- Patent number 11,057,992
- Issue date Jul 6, 2021
- Mikuni Electron Corporation
- Sakae Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer circuit board with traces thicker than a circuit board...
- Patent number 11,039,540
- Issue date Jun 15, 2021
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting body manufacturing method and anisotropic conductive film
- Patent number 10,887,999
- Issue date Jan 5, 2021
- Dexerials Corporation
- Yasunobu Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bio-electrode composition, bio-electrode, and method for manufactur...
- Patent number 10,864,366
- Issue date Dec 15, 2020
- Shin-Etsu Chemical Co., Ltd.
- Jun Hatakeyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 10,412,837
- Issue date Sep 10, 2019
- Dexerials Corporation
- Kouichi Sato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 10,368,449
- Issue date Jul 30, 2019
- Dexerials Corporation
- Kouichi Sato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 10,306,771
- Issue date May 28, 2019
- Dexerials Corporation
- Kouichi Sato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Connection body, method for manufacturing a connection body, connec...
- Patent number 10,175,544
- Issue date Jan 8, 2019
- Dexerials Corporation
- Seiichiro Shinohara
- G02 - OPTICS
Information Patent Grant
Ball grid array system
- Patent number 9,867,295
- Issue date Jan 9, 2018
- Dell Products L.P.
- Bhavesh Patel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
UV-curable anisotropic conductive adhesive
- Patent number 9,777,197
- Issue date Oct 3, 2017
- Sunray Scientific, LLC
- S. Kumar Khanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component-mounted structure
- Patent number 9,756,728
- Issue date Sep 5, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via in a printed circuit board
- Patent number 9,706,667
- Issue date Jul 11, 2017
- Sierra Circuits, Inc.
- Konstantine Karavakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via in a printed circuit board
- Patent number 9,674,967
- Issue date Jun 6, 2017
- Sierra Circuits, Inc.
- Konstantine Karavakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive material and connected structure
- Patent number 9,490,046
- Issue date Nov 8, 2016
- Sekisui Chemical Co., Ltd.
- Hideaki Ishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroconductive microparticles, anisotropic electroconductive mat...
- Patent number 9,478,326
- Issue date Oct 25, 2016
- Sekisui Chemical Co., Ltd.
- Hiroya Ishida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via in a printed circuit board
- Patent number 9,398,703
- Issue date Jul 19, 2016
- Sierra Circuits, Inc.
- Konstantine Karavakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermoplastic resin composition, resin article, and method of manuf...
- Patent number 9,365,693
- Issue date Jun 14, 2016
- Mitsubishi Engineering-Plastics Corporation
- Takahiro Takano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conductive particles and method of preparing the same
- Patent number 9,093,196
- Issue date Jul 28, 2015
- Nisshinbo Holdings, Inc.
- Toshifumi Hashiba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive microparticle, anisotropic electrically con...
- Patent number 8,981,226
- Issue date Mar 17, 2015
- Sekisui Chemical Co., Ltd.
- Taku Sasaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conductive particles comprising complex metal layer with density gr...
- Patent number 8,828,543
- Issue date Sep 9, 2014
- Cheil Industries Inc.
- Tae Sub Bae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible display device
- Patent number 8,780,568
- Issue date Jul 15, 2014
- Panasonic Corporation
- Takashi Osako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroconductive fine particles, anisotropic electroconductive mat...
- Patent number 8,609,246
- Issue date Dec 17, 2013
- Sekisui Chemical Co., Ltd.
- Ren-de Sun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, method of manufacturing printed wiring board,...
- Patent number 8,604,354
- Issue date Dec 10, 2013
- Fujikura Ltd.
- Shoji Ito
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
PROCESSOR INTERPOSER AND ELECTRONIC SYSTEM INCLUDING THE PROCESSOR...
- Publication number 20220007512
- Publication date Jan 6, 2022
- Danny Clavette
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED POWER DEVICE MODULE, PROCESSOR SUBSTRATE AND ELECTRONIC SY...
- Publication number 20210321519
- Publication date Oct 14, 2021
- Infineon Technologies Austria AG
- Danny Clavette
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION STRUCTURE
- Publication number 20210289623
- Publication date Sep 16, 2021
- Mikuni Electron Corporation
- SAKAE TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic System and Interposer Having an Embedded Power Device Mo...
- Publication number 20210120676
- Publication date Apr 22, 2021
- Infineon Technologies Austria AG
- Danny Clavette
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic System and Processor Substrate Having an Embedded Power...
- Publication number 20210120675
- Publication date Apr 22, 2021
- Danny Clavette
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATION PROCESS FOR FLIP CHIP BUMP BONDS USING NANO-LEDS AND CO...
- Publication number 20200305288
- Publication date Sep 24, 2020
- KONICA MINOLTA LABORATORY U.S.A., INC.
- Karsten Bruening
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE
- Publication number 20200128665
- Publication date Apr 23, 2020
- Mikuni Electron Corporation
- SAKAE TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE AGENT, AND METHOD FOR CONNECTING ELECTRONIC COMPONENT
- Publication number 20190085211
- Publication date Mar 21, 2019
- DEXERIALS CORPORATION
- Ryosuke ODAKA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONNECTION BODY, METHOD FOR MANUFACTURING A CONNECTION BODY, CONNEC...
- Publication number 20160327826
- Publication date Nov 10, 2016
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- G02 - OPTICS
Information Patent Application
MOUNTING BODY MANUFACTURING METHOD AND ANISOTROPIC CONDUCTIVE FILM
- Publication number 20160316569
- Publication date Oct 27, 2016
- DEXERIALS CORPORATION
- Yasunobu YAMADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VIA IN A PRINTED CIRCUIT BOARD
- Publication number 20160295708
- Publication date Oct 6, 2016
- SIERRA CIRCUITS, INC.
- Konstantine Karavakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE MATERIAL AND CONNECTED STRUCTURE
- Publication number 20160086687
- Publication date Mar 24, 2016
- Sekisui Chemical Co., Ltd.
- Hideaki Ishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND METHOD OF PRODUCING THE SAME
- Publication number 20150319867
- Publication date Nov 5, 2015
- DEXERIALS CORPORATION
- Kouichi SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE PASTE AND METHOD FOR PRODUCING CONDUCTIVE PATTERN
- Publication number 20140360763
- Publication date Dec 11, 2014
- TORAY INDUSTRIES, INC.
- Tsukuru Mizuguchi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE AGENT, AND METHOD FOR CONNECTING ELECTRONIC COMPONENT
- Publication number 20140352888
- Publication date Dec 4, 2014
- Ryosuke Odaka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING SOLDER BALL
- Publication number 20140319681
- Publication date Oct 30, 2014
- Samsung Electronics Co., Ltd.
- Du MAOHUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY APPARATUS HAVING THE SAME
- Publication number 20140254117
- Publication date Sep 11, 2014
- SAMSUNG DISPLAY CO., LTD.
- Moon-Seok Roh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOPLASTIC RESIN COMPOSITION, RESIN ARTICLE, AND METHOD OF MANUF...
- Publication number 20140147682
- Publication date May 29, 2014
- Takahiro Takano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FLEXIBLE DISPLAY DEVICE
- Publication number 20140055964
- Publication date Feb 27, 2014
- PANASONIC CORPORATION
- Takashi Osako
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CONDUCTIVE CIRCUIT
- Publication number 20130092423
- Publication date Apr 18, 2013
- Yoshitaka HAMADA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LED-Based Light Source Utilizing Asymmetric Conductors
- Publication number 20120112215
- Publication date May 10, 2012
- Yan Chai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COATED CONDUCTIVE PARTICLES AND METHOD FOR PRODUCING SAME
- Publication number 20120104333
- Publication date May 3, 2012
- Hitachi Chemical Company, Ltd.
- Kenji Takai
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CIRCUIT CONNECTION MATERIAL, AND CONNECTION STRUCTURE OF CIRCUIT ME...
- Publication number 20110267791
- Publication date Nov 3, 2011
- Hitachi Chemical Company, Ltd.
- Katsuhiko Tomisaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CONDUCTIVE PASTE CONTAINING SILVER-DECORATED CARBON NANOTUBES
- Publication number 20110247866
- Publication date Oct 13, 2011
- LS CABLE & SYSTEM, LTD
- Yoon-Jin Kim
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POLYMER PARTICLE, CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE MATER...
- Publication number 20110127068
- Publication date Jun 2, 2011
- Takuya Wada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE FILM, JOINED STRUCTURE,...
- Publication number 20110088935
- Publication date Apr 21, 2011
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Tomoyuki ISHIMATSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive paste and method of manufacturing printed circuit board...
- Publication number 20110073252
- Publication date Mar 31, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Jun Oh Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE
- Publication number 20110068346
- Publication date Mar 24, 2011
- Samsung Mobile Display Co., Ltd.
- Jung-Min Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE HARNESS AND ELECTRICAL CONNECTOR CABLE USING SAME
- Publication number 20110051381
- Publication date Mar 3, 2011
- HITACHI CABLE, LTD.
- Takahiro Sugiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE PARTICLE AND METHOD FOR PRODUCING CONDUCTIVE PARTICLE
- Publication number 20100327237
- Publication date Dec 30, 2010
- Hitachi Chemical Company, Ltd.
- Kenji Takai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Insulating particles having an electrically conductive coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Process of fabricating a beaded path on the surface of a substrate,...

Processor interposer and electronic system including the processor...

Embedded power device module, processor substrate and electronic sy...

Multi-layer circuit board with traces thicker than a circuit board

Fabrication process for flip chip bump bonds using nano-LEDs and co...

Electronic system and interposer having an embedded power device mo...

Electronic system and processor substrate having an embedded power...

Connection structure

Multi-layer circuit board with traces thicker than a circuit board...

Mounting body manufacturing method and anisotropic conductive film

Bio-electrode composition, bio-electrode, and method for manufactur...

Anisotropic conductive film and method of producing the same

Anisotropic conductive film and method of producing the same

Anisotropic conductive film and method of producing the same

Connection body, method for manufacturing a connection body, connec...

Ball grid array system

UV-curable anisotropic conductive adhesive

Component-mounted structure

Via in a printed circuit board

Via in a printed circuit board

Conductive material and connected structure

Electroconductive microparticles, anisotropic electroconductive mat...

Via in a printed circuit board

Thermoplastic resin composition, resin article, and method of manuf...

Conductive particles and method of preparing the same

Electrically conductive microparticle, anisotropic electrically con...

Conductive particles comprising complex metal layer with density gr...

Flexible display device

Electroconductive fine particles, anisotropic electroconductive mat...

Printed wiring board, method of manufacturing printed wiring board,...

Patents Applicationslast 30 patents

PROCESSOR INTERPOSER AND ELECTRONIC SYSTEM INCLUDING THE PROCESSOR...

EMBEDDED POWER DEVICE MODULE, PROCESSOR SUBSTRATE AND ELECTRONIC SY...

CONNECTION STRUCTURE

Electronic System and Interposer Having an Embedded Power Device Mo...

Electronic System and Processor Substrate Having an Embedded Power...

FABRICATION PROCESS FOR FLIP CHIP BUMP BONDS USING NANO-LEDS AND CO...

CONNECTION STRUCTURE

ADHESIVE AGENT, AND METHOD FOR CONNECTING ELECTRONIC COMPONENT

CONNECTION BODY, METHOD FOR MANUFACTURING A CONNECTION BODY, CONNEC...

MOUNTING BODY MANUFACTURING METHOD AND ANISOTROPIC CONDUCTIVE FILM

VIA IN A PRINTED CIRCUIT BOARD

CONDUCTIVE MATERIAL AND CONNECTED STRUCTURE

ANISOTROPIC CONDUCTIVE FILM AND METHOD OF PRODUCING THE SAME

CONDUCTIVE PASTE AND METHOD FOR PRODUCING CONDUCTIVE PATTERN

ADHESIVE AGENT, AND METHOD FOR CONNECTING ELECTRONIC COMPONENT

SEMICONDUCTOR PACKAGE INCLUDING SOLDER BALL

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY APPARATUS HAVING THE SAME

THERMOPLASTIC RESIN COMPOSITION, RESIN ARTICLE, AND METHOD OF MANUF...

FLEXIBLE DISPLAY DEVICE

METHOD FOR FORMING CONDUCTIVE CIRCUIT

LED-Based Light Source Utilizing Asymmetric Conductors

COATED CONDUCTIVE PARTICLES AND METHOD FOR PRODUCING SAME

CIRCUIT CONNECTION MATERIAL, AND CONNECTION STRUCTURE OF CIRCUIT ME...

CONDUCTIVE PASTE CONTAINING SILVER-DECORATED CARBON NANOTUBES

POLYMER PARTICLE, CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE MATER...

CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE FILM, JOINED STRUCTURE,...

Conductive paste and method of manufacturing printed circuit board...

DISPLAY DEVICE

FLEXIBLE HARNESS AND ELECTRICAL CONNECTOR CABLE USING SAME

CONDUCTIVE PARTICLE AND METHOD FOR PRODUCING CONDUCTIVE PARTICLE