Insulating particles having an insulating coating

Industry

CPC
H05K2201/0227

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0227Insulating particles having an insulating coating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board substrate comprising a coated boron nitride
- Patent number 11,895,768
- Issue date Feb 6, 2024
- ROGERS CORPORATION
- Eui Kyoon Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Prepreg, metal-clad laminated board, and printed wiring board
- Patent number 11,647,583
- Issue date May 9, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shimpei Obata
- B32 - LAYERED PRODUCTS
Information Patent Grant
Metal-clad laminate and printed wiring board
- Patent number 11,638,349
- Issue date Apr 25, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Dai Sasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, and pre-preg, metal-clad laminate and printed ci...
- Patent number 11,339,258
- Issue date May 24, 2022
- Taiwan Union Technology Corporation
- Chih-Wei Liao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed circuit board and insulating film used therein
- Patent number 11,337,305
- Issue date May 17, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Dong Joo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board using non-catalytic laminate with catalytic adhesive...
- Patent number 10,959,329
- Issue date Mar 23, 2021
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Catalytic circuit board with traces and vias
- Patent number 10,806,029
- Issue date Oct 13, 2020
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin fluxed solder paste, and mount structure
- Patent number 10,440,834
- Issue date Oct 8, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hirohisa Hino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with catalytic adhesive
- Patent number 10,306,756
- Issue date May 28, 2019
- Sierra Circuits, Inc.
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Epoxy resin composite and printed circuit board comprising insulati...
- Patent number 10,280,289
- Issue date May 7, 2019
- LG Innotek Co., Ltd
- Jina Gu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Landless via concept
- Patent number 10,182,494
- Issue date Jan 15, 2019
- Flex Ltd.
- Henrik Jacobbson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board apparatus and method
- Patent number 9,942,981
- Issue date Apr 10, 2018
- Sierra Circuits, Inc.
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inorganic filler, resin composition comprising the same and heat ra...
- Patent number 9,902,841
- Issue date Feb 27, 2018
- LG Innotek Co., Ltd
- Sang A Ju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, prepreg, metal foil-clad laminate and printed wi...
- Patent number 9,832,870
- Issue date Nov 28, 2017
- Mitsubishi Gas Chemical Company, Inc.
- Hiroaki Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, printed circuit board using the composition, and...
- Patent number 9,733,565
- Issue date Aug 15, 2017
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Young Kwan Seo
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Catalytic laminate apparatus and method
- Patent number 9,706,650
- Issue date Jul 11, 2017
- Sierra Circuits, Inc.
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical component resin, semiconductor device, and substrate
- Patent number 9,265,144
- Issue date Feb 16, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Masanori Minamio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Epoxy resin composition for prepreg, prepreg, and multilayer printe...
- Patent number 9,206,308
- Issue date Dec 8, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tomoaki Iwami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal base circuit board
- Patent number 8,449,143
- Issue date May 28, 2013
- Denki Kagaku Kogyo Kabushiki Kaisha
- Takeshi Miyakawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METAL-CLAD LAMINATE AND PRINTED WIRING BOARD
- Publication number 20220353988
- Publication date Nov 3, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Dai SASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD SUBSTRATE COMPRISING A COATED BORON NITRIDE
- Publication number 20220322517
- Publication date Oct 6, 2022
- ROGERS CORPORATION
- Eui Kyoon Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED CIRCUIT BOARD AND INSULATING FILM USED THEREIN
- Publication number 20220183155
- Publication date Jun 9, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Dong Joo SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Board using non-catalytic laminate with catalytic adhesive...
- Publication number 20200404785
- Publication date Dec 24, 2020
- CATLAM, LLC
- Kenneth S. BAHL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Catalytic Laminate Apparatus and Method
- Publication number 20190239349
- Publication date Aug 1, 2019
- SIERRA CIRCUITS, INC.
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, AND PRE-PREG, METAL-CLAD LAMINATE AND PRINTED CI...
- Publication number 20190203003
- Publication date Jul 4, 2019
- Taiwan Union Technology Corporation
- CHIH-WEI LIAO
- B32 - LAYERED PRODUCTS
Information Patent Application
PREPREG, METAL-CLAD LAMINATED BOARD, AND PRINTED WIRING BOARD
- Publication number 20190150279
- Publication date May 16, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- Shimpei OBATA
- B32 - LAYERED PRODUCTS
Information Patent Application
Circuit board with Catalytic Adhesive
- Publication number 20180168036
- Publication date Jun 14, 2018
- SIERRA CIRCUITS, INC.
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board Apparatus and Method
- Publication number 20180054889
- Publication date Feb 22, 2018
- Sierra Circuits, Inc.
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INORGANIC FILLER, RESIN COMPOSITION COMPRISING THE SAME AND HEAT RA...
- Publication number 20170233554
- Publication date Aug 17, 2017
- LG Innotek Co., Ltd.
- Sang A JU
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
INORGANIC FILLER, RESIN COMPOSITION COMPRISING THE SAME AND HEAT RA...
- Publication number 20170058107
- Publication date Mar 2, 2017
- LG Innotek Co., Ltd.
- Sang A Ju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITE AND PRINTED CIRCUIT BOARD COMPRISING INSULATI...
- Publication number 20170051133
- Publication date Feb 23, 2017
- LG Innotek Co., Ltd.
- Jina Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE-MODIFIED INORGANIC FILLER, METHOD OF PREPARING THE SAME, BU...
- Publication number 20140290994
- Publication date Oct 2, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Ki Seok Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRICAL COMPONENT RESIN, SEMICONDUCTOR DEVICE, AND SUBSTRATE
- Publication number 20140054077
- Publication date Feb 27, 2014
- PANASONIC CORPORATION
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR PREPREG, PREPREG, AND MULTILAYER PRINTE...
- Publication number 20130096233
- Publication date Apr 18, 2013
- PANASONIC CORPORATION
- Tomoaki Iwami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOSETTING COMPOSITION
- Publication number 20120305295
- Publication date Dec 6, 2012
- Showa Denko K.K.
- Kazuya Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL BASE CIRCUIT BOARD
- Publication number 20100164362
- Publication date Jul 1, 2010
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Takeshi Miyakawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Insulating particles having an insulating coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board substrate comprising a coated boron nitride

Prepreg, metal-clad laminated board, and printed wiring board

Metal-clad laminate and printed wiring board

Resin composition, and pre-preg, metal-clad laminate and printed ci...

Printed circuit board and insulating film used therein

Circuit board using non-catalytic laminate with catalytic adhesive...

Catalytic circuit board with traces and vias

Resin fluxed solder paste, and mount structure

Circuit board with catalytic adhesive

Epoxy resin composite and printed circuit board comprising insulati...

Landless via concept

Circuit board apparatus and method

Inorganic filler, resin composition comprising the same and heat ra...

Resin composition, prepreg, metal foil-clad laminate and printed wi...

Resin composition, printed circuit board using the composition, and...

Catalytic laminate apparatus and method

Electrical component resin, semiconductor device, and substrate

Epoxy resin composition for prepreg, prepreg, and multilayer printe...

Metal base circuit board

Patents Applicationslast 30 patents

METAL-CLAD LAMINATE AND PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD SUBSTRATE COMPRISING A COATED BORON NITRIDE

PRINTED CIRCUIT BOARD AND INSULATING FILM USED THEREIN

Circuit Board using non-catalytic laminate with catalytic adhesive...

Catalytic Laminate Apparatus and Method

RESIN COMPOSITION, AND PRE-PREG, METAL-CLAD LAMINATE AND PRINTED CI...

PREPREG, METAL-CLAD LAMINATED BOARD, AND PRINTED WIRING BOARD

Circuit board with Catalytic Adhesive

Circuit Board Apparatus and Method

INORGANIC FILLER, RESIN COMPOSITION COMPRISING THE SAME AND HEAT RA...

INORGANIC FILLER, RESIN COMPOSITION COMPRISING THE SAME AND HEAT RA...

EPOXY RESIN COMPOSITE AND PRINTED CIRCUIT BOARD COMPRISING INSULATI...

SURFACE-MODIFIED INORGANIC FILLER, METHOD OF PREPARING THE SAME, BU...

ELECTRICAL COMPONENT RESIN, SEMICONDUCTOR DEVICE, AND SUBSTRATE

EPOXY RESIN COMPOSITION FOR PREPREG, PREPREG, AND MULTILAYER PRINTE...

THERMOSETTING COMPOSITION

METAL BASE CIRCUIT BOARD