Integral adaptations of a component or an auxiliary PCB for mounting

Industry

CPC
H05K2201/10568

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10568Integral adaptations of a component or an auxiliary PCB for mounting

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Inductors including electrically conductive standoffs
- Patent number 12,198,844
- Issue date Jan 14, 2025
- Maxim Integrated Products, Inc.
- Alexandr Ikriannikov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaged battery
- Patent number 12,156,338
- Issue date Nov 26, 2024
- The Johns Hopkins University
- Konstantinos Gerasopoulos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for underfilling using spacers
- Patent number 11,948,809
- Issue date Apr 2, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Whei Sheng Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric compressor with inverter circuit section and filter circui...
- Patent number 11,936,251
- Issue date Mar 19, 2024
- SANDEN AUTOMOTIVE COMPONENTS CORPORATION
- Mikio Kobayashi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method for fabricating carrier structure
- Patent number 11,792,938
- Issue date Oct 17, 2023
- Silicon Precision Industries Co., Ltd.
- Yu-Lung Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier for arranging electrical components on a circuit...
- Patent number 11,770,896
- Issue date Sep 26, 2023
- HARTING AG
- Thomas Hess
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,562,970
- Issue date Jan 24, 2023
- Fuji Electric Co., Ltd.
- Tadahiko Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic foil
- Patent number 11,388,815
- Issue date Jul 12, 2022
- Teknologian tutkimuskeskus VTT Oy
- Vesa Pentikäinen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bracket, input/output assembly and terminal
- Patent number 11,330,090
- Issue date May 10, 2022
- Guangdong Oppo Mobile Telecommunications Corp., Ltd.
- Yuhu Jia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrical junction box and wire harness
- Patent number 11,304,301
- Issue date Apr 12, 2022
- Yazaki Corporation
- Keisuke Kimura
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Reliable interconnect for camera image sensors
- Patent number 11,206,732
- Issue date Dec 21, 2021
- Waymo LLC
- Matthew Last
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip-on-board modular lighting system and method of manufacture
- Patent number 11,092,321
- Issue date Aug 17, 2021
- Lumileds LLC
- Ronald Bonne
- F21 - LIGHTING
Information Patent Grant
Electronic component and method for producing an electronic component
- Patent number 11,058,005
- Issue date Jul 6, 2021
- VITESCO TECHNOLOGIES GERMANY GMBH
- Helmut Karrer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Switching device and electronic device
- Patent number 10,917,972
- Issue date Feb 9, 2021
- Kabushiki Kaisha Toshiba
- Hiroshi Ota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package carrier structure thereof, and method for fabric...
- Patent number 10,863,626
- Issue date Dec 8, 2020
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting structure
- Patent number 10,827,616
- Issue date Nov 3, 2020
- Kyocera Corporation
- Seiji Hattori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a component embedded package carrier
- Patent number 10,798,822
- Issue date Oct 6, 2020
- Subtron Technology Co., Ltd.
- Jing-Cyuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-board modular lighting system and method of manufacture
- Patent number 10,670,250
- Issue date Jun 2, 2020
- Lumileds LLC
- Ronald Bonne
- F21 - LIGHTING
Information Patent Grant
Electronic component with two substrates enclosing functional eleme...
- Patent number 10,659,003
- Issue date May 19, 2020
- Taiyo Yuden Co., Ltd.
- Hidetaro Nakazawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Ceramic electronic component and mounting structure therefor
- Patent number 10,614,954
- Issue date Apr 7, 2020
- Murata Manufacturing Co., Ltd.
- Teppei Akiyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bracket for electronic component, electronic component assembly and...
- Patent number 10,517,175
- Issue date Dec 24, 2019
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD
- Zeshuo Qiu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bracket for electronic component, electronic component assembly and...
- Patent number 10,356,905
- Issue date Jul 16, 2019
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD
- Zeshuo Qiu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thinned and flexible semiconductor elements on three dimensional su...
- Patent number 10,310,294
- Issue date Jun 4, 2019
- Johnson & Johnson Vision Care, Inc.
- Randall B. Pugh
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Device for the orientation of contact terminals on an electrical co...
- Patent number 10,292,272
- Issue date May 14, 2019
- Epcos AG
- Florian Velden
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 10,211,135
- Issue date Feb 19, 2019
- JTEKT Corporation
- Naoki Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective housing for flexible fixation of components and circuit...
- Patent number 10,187,992
- Issue date Jan 22, 2019
- ZF Friedrichshafen AG
- Thomas Wittig
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mountable, toroid magnetic device
- Patent number 9,875,838
- Issue date Jan 23, 2018
- Rolls-Royce PLC
- David Brookes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lens for illuminating device and illuminating device having said lens
- Patent number 9,629,247
- Issue date Apr 18, 2017
- Xiongjie Cheng
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Dam structure for enhancing joint yield in bonding processes
- Patent number 9,343,431
- Issue date May 17, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ching Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual side staggered surface mount dual in-line memory module
- Patent number 9,265,152
- Issue date Feb 16, 2016
- Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Larry G. Pymento
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE COMPRISING PLURALITY OF PRINTED CIRCUIT BOARDS
- Publication number 20240334588
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Jichul KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ELECTRONICS MODULE, ELECTRICAL SYSTEM HAVING SUCH A MODULE, C...
- Publication number 20230274994
- Publication date Aug 31, 2023
- Valeo eAutomotive France SAS
- Aurelien POUILLY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGED BATTERY
- Publication number 20230262899
- Publication date Aug 17, 2023
- The Johns Hopkins University
- Konstantinos Gerasopoulos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR UNDERFILLING USING SPACERS
- Publication number 20230082626
- Publication date Mar 16, 2023
- DELPHI TECHNOLOGIES IP LIMITED
- Whei Sheng TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT CARRIER FOR ARRANGING ELECTRICAL COMPONENTS ON A CIRCUIT...
- Publication number 20230061125
- Publication date Mar 2, 2023
- HARTING AG
- Thomas HESS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interposer For Printed Circuit Boards
- Publication number 20220104361
- Publication date Mar 31, 2022
- SoftIron Limited
- Robert Drury
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INDUCTORS INCLUDING ELECTRICALLY CONDUCTIVE STANDOFFS
- Publication number 20210391113
- Publication date Dec 16, 2021
- Maxim Integrated Products, Inc.
- Alexandr Ikriannikov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210358869
- Publication date Nov 18, 2021
- Fuji Electric Co., Ltd.
- Tadahiko SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bracket, Input/Output Assembly and Terminal
- Publication number 20210329108
- Publication date Oct 21, 2021
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
- Yuhu Jia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR FABRICATING CARRIER STRUCTURE
- Publication number 20210068260
- Publication date Mar 4, 2021
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reliable Interconnect for Camera Image Sensors
- Publication number 20210007216
- Publication date Jan 7, 2021
- WAYMO LLC
- Matthew Last
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SWITCHING DEVICE AND ELECTRONIC DEVICE
- Publication number 20200267840
- Publication date Aug 20, 2020
- Kabushiki Kaisha Toshiba
- Hiroshi Ota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC FOIL
- Publication number 20200260567
- Publication date Aug 13, 2020
- Teknologian Tutkimuskeskus VTT Oy
- Vesa PENTIKÄINEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING STRUCTURE
- Publication number 20200245464
- Publication date Jul 30, 2020
- Kyocera Corporation
- Seiji HATTORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT
- Publication number 20200100364
- Publication date Mar 26, 2020
- Vitesco Technologies Germany GmbH
- Helmut Karrer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THINNED AND FLEXIBLE SEMICONDUCTOR ELEMENTS ON THREE DIMENSIONAL SU...
- Publication number 20200004048
- Publication date Jan 2, 2020
- Johnson & Johnson Vision Care, Inc.
- Randall B Pugh
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ELECTRICAL JUNCTION BOX AND WIRE HARNESS
- Publication number 20190380206
- Publication date Dec 12, 2019
- YAZAKI CORPORATION
- Keisuke Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BRACKET FOR ELECTRONIC COMPONENT, ELECTRONIC COMPONENT ASSEMBLY AND...
- Publication number 20190289720
- Publication date Sep 19, 2019
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
- Zeshuo Qiu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP-ON-BOARD MODULAR LIGHTING SYSTEM AND METHOD OF MANUFACTURE
- Publication number 20190195479
- Publication date Jun 27, 2019
- Lumileds LLC
- Ronald BONNE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT EMBEDDED PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
- Publication number 20180352658
- Publication date Dec 6, 2018
- Subtron Technology Co., Ltd.
- Jing-Cyuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRACKET FOR ELECTRONIC COMPONENT, ELECTRONIC COMPONENT ASSEMBLY AND...
- Publication number 20180343743
- Publication date Nov 29, 2018
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LT D.
- Zeshuo QIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL MODULE CONNECTOR AND PRINTED BOARD ASSEMBLY
- Publication number 20170068055
- Publication date Mar 9, 2017
- Fujitsu Limited
- Yasushi Masuda
- G02 - OPTICS
Information Patent Application
LENS FOR ILLUMINATING DEVICE AND ILLUMINATING DEVICE HAVING SAID LENS
- Publication number 20160143146
- Publication date May 19, 2016
- Xiongjie Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CONNECTOR APPARATUS AND METHODS
- Publication number 20140377996
- Publication date Dec 25, 2014
- Victor H. Renteria
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELAY ASSEMBLY WITH FASTENING CLIP
- Publication number 20140232495
- Publication date Aug 21, 2014
- JOHNSON ELECTRIC S.A.
- Joerg GASSMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING SYSTEM OF CIRCUIT BOARDS
- Publication number 20140198471
- Publication date Jul 17, 2014
- Fujitsu Limited
- Naohiko Kajio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANTENNA MOUNTED ON A CIRCUIT BOARD
- Publication number 20140159990
- Publication date Jun 12, 2014
- OPTICON SENSORS EUROPE B.V.
- Alexander Azhari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL MODULE FOR BEING RECEIVED BY AUTOMATIC PLACEMENT MACHINE...
- Publication number 20130343006
- Publication date Dec 26, 2013
- EPCOS AG
- Claus Reitlinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECTS IN AN ELECTRONIC CONTACT LENS
- Publication number 20130135578
- Publication date May 30, 2013
- Randall Braxton Pugh
- G02 - OPTICS
Information Patent Application
ARRANGEMENT COMPRISING AN ELECTRIC AND/OR ELECTRONIC MODULE AND A C...
- Publication number 20130063903
- Publication date Mar 14, 2013
- ROBERT BOSCH GmbH
- Michael Heim
- H01 - BASIC ELECTRIC ELEMENTS

Integral adaptations of a component or an auxiliary PCB for mounting

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Inductors including electrically conductive standoffs

Chip packaged battery

Method for underfilling using spacers

Electric compressor with inverter circuit section and filter circui...

Method for fabricating carrier structure

Component carrier for arranging electrical components on a circuit...

Semiconductor device and manufacturing method thereof

Electronic foil

Bracket, input/output assembly and terminal

Electrical junction box and wire harness

Reliable interconnect for camera image sensors

Chip-on-board modular lighting system and method of manufacture

Electronic component and method for producing an electronic component

Switching device and electronic device

Electronic package carrier structure thereof, and method for fabric...

Mounting structure

Method of manufacturing a component embedded package carrier

Chip-on-board modular lighting system and method of manufacture

Electronic component with two substrates enclosing functional eleme...

Ceramic electronic component and mounting structure therefor

Bracket for electronic component, electronic component assembly and...

Bracket for electronic component, electronic component assembly and...

Thinned and flexible semiconductor elements on three dimensional su...

Device for the orientation of contact terminals on an electrical co...

Semiconductor device

Protective housing for flexible fixation of components and circuit...

Surface mountable, toroid magnetic device

Lens for illuminating device and illuminating device having said lens

Dam structure for enhancing joint yield in bonding processes

Dual side staggered surface mount dual in-line memory module

Patents Applicationslast 30 patents

ELECTRONIC DEVICE COMPRISING PLURALITY OF PRINTED CIRCUIT BOARDS

POWER ELECTRONICS MODULE, ELECTRICAL SYSTEM HAVING SUCH A MODULE, C...

CHIP PACKAGED BATTERY

METHOD FOR UNDERFILLING USING SPACERS

COMPONENT CARRIER FOR ARRANGING ELECTRICAL COMPONENTS ON A CIRCUIT...

Interposer For Printed Circuit Boards

INDUCTORS INCLUDING ELECTRICALLY CONDUCTIVE STANDOFFS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Bracket, Input/Output Assembly and Terminal

METHOD FOR FABRICATING CARRIER STRUCTURE

Reliable Interconnect for Camera Image Sensors

SWITCHING DEVICE AND ELECTRONIC DEVICE

ELECTRONIC FOIL

MOUNTING STRUCTURE

ELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT

THINNED AND FLEXIBLE SEMICONDUCTOR ELEMENTS ON THREE DIMENSIONAL SU...

ELECTRICAL JUNCTION BOX AND WIRE HARNESS

BRACKET FOR ELECTRONIC COMPONENT, ELECTRONIC COMPONENT ASSEMBLY AND...

CHIP-ON-BOARD MODULAR LIGHTING SYSTEM AND METHOD OF MANUFACTURE

COMPONENT EMBEDDED PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF

BRACKET FOR ELECTRONIC COMPONENT, ELECTRONIC COMPONENT ASSEMBLY AND...

OPTICAL MODULE CONNECTOR AND PRINTED BOARD ASSEMBLY

LENS FOR ILLUMINATING DEVICE AND ILLUMINATING DEVICE HAVING SAID LENS

INTEGRATED CONNECTOR APPARATUS AND METHODS

RELAY ASSEMBLY WITH FASTENING CLIP

CONNECTING SYSTEM OF CIRCUIT BOARDS

ANTENNA MOUNTED ON A CIRCUIT BOARD

ELECTRICAL MODULE FOR BEING RECEIVED BY AUTOMATIC PLACEMENT MACHINE...

ELECTRICAL INTERCONNECTS IN AN ELECTRONIC CONTACT LENS

ARRANGEMENT COMPRISING AN ELECTRIC AND/OR ELECTRONIC MODULE AND A C...