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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/823871interconnection or wiring or contact manufacturing related aspects

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit and manufacturing method of the same
- Patent number 12,170,277
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kam-Tou Sio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual contact process with stacked metal layers
- Patent number 12,170,319
- Issue date Dec 17, 2024
- Intel Corporation
- Kevin Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,165,929
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with buried power rail, integrated circuit...
- Patent number 12,165,927
- Issue date Dec 10, 2024
- Mediatek Inc.
- Po-Chao Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with power control circuit having various...
- Patent number 12,166,029
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jui Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure for semiconductor device and method
- Patent number 12,166,078
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Ming Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,159,938
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Hyojin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 12,159,834
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Jungho Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and forming method thereof
- Patent number 12,159,870
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hung-Shu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiplexer cell and semiconductor device having camouflage design,...
- Patent number 12,154,867
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Lien Linus Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 12,154,823
- Issue date Nov 26, 2024
- Renesas Electronics Corporation
- Katsuhiko Hotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device and a semiconductor device
- Patent number 12,154,832
- Issue date Nov 26, 2024
- Imec VZW
- Boon Teik Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tiered-profile contact for semiconductor
- Patent number 12,148,663
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Kisik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with transistor local interconnects
- Patent number 12,148,702
- Issue date Nov 19, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Mahbub Rashed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated hybrid standard cell structure with gate-all-around device
- Patent number 12,148,745
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hao Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Replacement contact process
- Patent number 12,142,534
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Sankuei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor gate structures and methods of forming the same
- Patent number 12,142,659
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,142,607
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor gate structures and methods of forming the same
- Patent number 12,142,655
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures for advanced integrated circuit...
- Patent number 12,142,667
- Issue date Nov 12, 2024
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact CMOS
- Patent number 12,136,661
- Issue date Nov 5, 2024
- James D. Welch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked device with backside power distribution network and method...
- Patent number 12,131,996
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,132,047
- Issue date Oct 29, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kui Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit, system and method of forming same
- Patent number 12,131,998
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Hsin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra dense 3D routing for compact 3D designs
- Patent number 12,131,956
- Issue date Oct 29, 2024
- Tokyo Electron Limited
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 12,119,349
- Issue date Oct 15, 2024
- SOCIONEXT INC.
- Hideyuki Komuro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked device structures and methods for forming the same
- Patent number 12,119,348
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside gate contact, backside gate etch stop layer, and methods o...
- Patent number 12,119,271
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Bo Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless plating method for metal gate fill
- Patent number 12,107,150
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yi Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device structure with cap layer
- Patent number 12,107,165
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Ching Chu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED TRANSISTOR STRUCTURES WITH HYBRID GATE PITCH
- Publication number 20240421156
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DISTRIBUTION WITH BACKSIDE POWER PLANES
- Publication number 20240421088
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE/DRAIN PROTECTION USING A BACKSIDE PLACEHOLDER
- Publication number 20240421037
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Lijuan Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240413158
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- SUNGMIN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS
- Publication number 20240413016
- Publication date Dec 12, 2024
- Intel Corporation
- Sridhar GOVINDARAJU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CFETS AND THE METHODS OF FORMING THE SAME
- Publication number 20240413019
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Yun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FETs WITH BACKSIDE ANGLE CUT
- Publication number 20240413084
- Publication date Dec 12, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device-Level Interconnects for Stacked Transistor Structures and Me...
- Publication number 20240413211
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH BUTTED-CONTACT AND METHODS OF F...
- Publication number 20240413217
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240413252
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Seungmin SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TRANSISTORS WITH METAL VIAS
- Publication number 20240413085
- Publication date Dec 12, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TRANSISTOR PHYSICALLY UNCLONABLE FUNCTION
- Publication number 20240413100
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Chen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CFETs and the Methods of Forming the Same
- Publication number 20240413156
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Yun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240405021
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Ting Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PASSIVE DEVICE INTEGRATION FOR SILICON-ON-INSULATOR S...
- Publication number 20240395664
- Publication date Nov 28, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240395899
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cherng-Rong HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure and Method for Forming the Same
- Publication number 20240395665
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240395793
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kam-Tou SIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF FORMING SAME
- Publication number 20240395821
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yu LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS HAVING STACKED TRANSISTORS AND BACKSIDE POWER N...
- Publication number 20240395718
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yu LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240395712
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Dong Hoon Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-LIMITING MANUFACTURING TECHNIQUES TO PREVENT ELECTRICAL SHORTS...
- Publication number 20240395630
- Publication date Nov 28, 2024
- Synopsys, Inc.
- Xi-Wei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT INTEGRATION IN COMPLEMENTARY FIELD EFFECT TRANSISTOR (CFET)...
- Publication number 20240395879
- Publication date Nov 28, 2024
- Applied Materials, Inc.
- San-Kuei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING INTEGRATED CIRCUIT
- Publication number 20240395716
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yu LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLEMENTARY FIELD EFFECT TRANSISTOR
- Publication number 20240395667
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET DEVICE AND METHOD OF FORMING SAME
- Publication number 20240387237
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Cyuan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387327
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroless Plating Method for Metal Gate Fill
- Publication number 20240387690
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yi Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF MANUFACTURING FLIP-FLOP WITH TRANSISTORS HAVING DIFFEREN...
- Publication number 20240388280
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xing Chao YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multigate Devices with Varying Channel Layers
- Publication number 20240387743
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuan-Lun Cheng
- H01 - BASIC ELECTRIC ELEMENTS

interconnection or wiring or contact manufacturing related aspects

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit and manufacturing method of the same

Dual contact process with stacked metal layers

Semiconductor device and method

Semiconductor structure with buried power rail, integrated circuit...

Integrated circuit device with power control circuit having various...

Contact structure for semiconductor device and method

Semiconductor device

Semiconductor devices

Semiconductor structure and forming method thereof

Multiplexer cell and semiconductor device having camouflage design,...

Semiconductor device and a method of manufacturing the same

Method for forming a semiconductor device and a semiconductor device

Tiered-profile contact for semiconductor

Semiconductor device with transistor local interconnects

Integrated hybrid standard cell structure with gate-all-around device

Replacement contact process

Transistor gate structures and methods of forming the same

Semiconductor device

Transistor gate structures and methods of forming the same

Contact over active gate structures for advanced integrated circuit...

Compact CMOS

Stacked device with backside power distribution network and method...

Semiconductor device and method for manufacturing semiconductor device

Integrated circuit, system and method of forming same

Ultra dense 3D routing for compact 3D designs

Semiconductor integrated circuit device

Stacked device structures and methods for forming the same

Backside gate contact, backside gate etch stop layer, and methods o...

Electroless plating method for metal gate fill

Semiconductor device structure with cap layer

Patents Applicationslast 30 patents

STACKED TRANSISTOR STRUCTURES WITH HYBRID GATE PITCH

POWER DISTRIBUTION WITH BACKSIDE POWER PLANES

SOURCE/DRAIN PROTECTION USING A BACKSIDE PLACEHOLDER

SEMICONDUCTOR DEVICE

TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS

CFETS AND THE METHODS OF FORMING THE SAME

STACKED FETs WITH BACKSIDE ANGLE CUT

Device-Level Interconnects for Stacked Transistor Structures and Me...

SEMICONDUCTOR DEVICE STRUCTURE WITH BUTTED-CONTACT AND METHODS OF F...

SEMICONDUCTOR DEVICE

STACKED TRANSISTORS WITH METAL VIAS

STACKED TRANSISTOR PHYSICALLY UNCLONABLE FUNCTION

CFETs and the Methods of Forming the Same

TRANSISTOR ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PASSIVE DEVICE INTEGRATION FOR SILICON-ON-INSULATOR S...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

Semiconductor Structure and Method for Forming the Same

INTEGRATED CIRCUIT AND MANUFACTURING METHOD OF THE SAME

INTEGRATED CIRCUIT AND METHOD OF FORMING SAME

INTEGRATED CIRCUITS HAVING STACKED TRANSISTORS AND BACKSIDE POWER N...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SELF-LIMITING MANUFACTURING TECHNIQUES TO PREVENT ELECTRICAL SHORTS...

CONTACT INTEGRATION IN COMPLEMENTARY FIELD EFFECT TRANSISTOR (CFET)...

METHOD OF MANUFACTURING INTEGRATED CIRCUIT

COMPLEMENTARY FIELD EFFECT TRANSISTOR

FINFET DEVICE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Electroless Plating Method for Metal Gate Fill

METHODS OF MANUFACTURING FLIP-FLOP WITH TRANSISTORS HAVING DIFFEREN...

Multigate Devices with Varying Channel Layers