involving a partial via etch

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H01L21/76813

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/76813involving a partial via etch

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Metal interconnect structure having cap layer with different thickn...
- Patent number 12,183,626
- Issue date Dec 31, 2024
- United Microelectronics Corp.
- Yi-How Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hardened interlayer dielectric layer
- Patent number 12,087,692
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap formation method
- Patent number 12,087,616
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Chih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes for reducing line-end spacing
- Patent number 12,068,168
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front-end-of-line (FEOL) through semiconductor-on-substrate via (TSV)
- Patent number 12,046,537
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Hsiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet etching chemistry and method of forming semiconductor device us...
- Patent number 12,046,476
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Hsien Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure of semiconductor device
- Patent number 11,996,325
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 11,990,365
- Issue date May 21, 2024
- Winbond Electronics Corp.
- Chang-Ju Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an interconnection structure having a bott...
- Patent number 11,984,355
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Kuan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure with anti-adhesion layer
- Patent number 11,948,835
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of a protective layer to reduce interconnect s...
- Patent number 11,942,364
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vias for cobalt-based interconnects and methods of fabrication thereof
- Patent number 11,908,735
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating interconnection using graphene
- Patent number 11,876,050
- Issue date Jan 16, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Ming Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully aligned via integration with selective catalyzed vapor phase...
- Patent number 11,705,363
- Issue date Jul 18, 2023
- Samsung Electronics Co., Ltd.
- Ming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective ILD deposition for fully aligned via with airgap
- Patent number 11,676,854
- Issue date Jun 13, 2023
- TESSERA LLC
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Raised via for terminal connections on different planes
- Patent number 11,646,220
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via structure and methods for forming the same
- Patent number 11,551,967
- Issue date Jan 10, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Meng-Pei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field effect transistor (FinFET) device structure with intercon...
- Patent number 11,532,512
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front-end-of-line (FEOL) through semiconductor-on-substrate via (TSV)
- Patent number 11,521,915
- Issue date Dec 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Hsiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of a protective layer to reduce interconnect s...
- Patent number 11,521,896
- Issue date Dec 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning method
- Patent number 11,476,155
- Issue date Oct 18, 2022
- Imec VZW
- Victor M. Blanco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 11,476,194
- Issue date Oct 18, 2022
- Samsung Electronics Co., Ltd.
- Seok Han Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal interconnect structure and method for fabricating the same
- Patent number 11,450,558
- Issue date Sep 20, 2022
- United Microelectronics Corp.
- Yi-How Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,450,566
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of manufacture
- Patent number 11,443,991
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yao-Te Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including multi-tier moat isolation...
- Patent number 11,404,427
- Issue date Aug 2, 2022
- SanDisk Technologies LLC
- Yoshitaka Otsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming the same
- Patent number 11,348,828
- Issue date May 31, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jye-Yen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,335,589
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure of semiconductor device including barrier la...
- Patent number 11,335,593
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Jhih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating CU interconnection using graphene
- Patent number 11,328,994
- Issue date May 10, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Ming Zhou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESSES FOR REDUCING LINE-END SPACING
- Publication number 20240355633
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT-END-OF-LINE (FEOL) THROUGH SEMICONDUCTOR-ON-SUBSTRATE VIA (TSV)
- Publication number 20240355711
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Hsiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE USING WET ETCHING CHEMISTRY
- Publication number 20240339327
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsien Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTERCONNECTION STRUCTURE
- Publication number 20240282625
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Kuan HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure of Semiconductor Device
- Publication number 20240274467
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE WITH ANTI-ADHESION LAYER
- Publication number 20240258162
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che-Cheng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20240222189
- Publication date Jul 4, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Kuo Hsiung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF A PROTECTIVE LAYER TO REDUCE INTERCONNECT S...
- Publication number 20240194523
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vias for Cobalt-Based Interconnects and Methods of Fabrication Thereof
- Publication number 20240194525
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING THROUGH-VIA STRUCTURE
- Publication number 20240178131
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- Sunoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP
- Publication number 20240096693
- Publication date Mar 21, 2024
- TESSERA LLC
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transistor Contacts and Methods of Forming the Same
- Publication number 20240021476
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gallium Nitride Device with Field Plate Structure and Method of Man...
- Publication number 20230377952
- Publication date Nov 23, 2023
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY ALIGNED VIA INTEGRATION WITH SELECTIVE CATALYZED VAPOR PHASE...
- Publication number 20230317513
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- Ming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ETCHING CHEMISTRY AND METHOD OF FORMING SEMICONDUCTOR DEVICE US...
- Publication number 20230307240
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsien Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR GAP FORMATION METHOD
- Publication number 20230238275
- Publication date Jul 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING COMPOSITION FOR REMOVING SILICON AND METHOD FOR REMOVING SI...
- Publication number 20230193132
- Publication date Jun 22, 2023
- LCY Chemical Corp.
- Shang-Chen HUANG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Fin Field Effect Transistor (FinFET) Device Structure with Intercon...
- Publication number 20230116545
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che-Cheng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INTERCONNECT STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20220384254
- Publication date Dec 1, 2022
- UNITED MICROELECTRONICS CORP.
- Yi-How Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HARDENED INTERLAYER DIELECTRIC LAYER
- Publication number 20220367380
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Joung-Wei LIOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT-END-OF-LINE (FEOL) THROUGH SEMICONDUCTOR-ON-SUBSTRATE VIA (TSV)
- Publication number 20220359346
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Hsiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE AND METHODS FOR FORMING THE SAME
- Publication number 20220352012
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Meng-Pei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure and Method of Manufacture
- Publication number 20220352043
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Te Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF A PROTECTIVE LAYER TO REDUCE INTERCONNECT S...
- Publication number 20220352017
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY ALIGNED VIA INTEGRATION WITH SELECTIVE CATALYZED VAPOR PHASE...
- Publication number 20220301924
- Publication date Sep 22, 2022
- Samsung Electronics Co., Ltd.
- Ming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20220277989
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure of Semiconductor Device and Method of Formin...
- Publication number 20220254682
- Publication date Aug 11, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Jhih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING INTERCONNECTION USING GRAPHENE
- Publication number 20220223537
- Publication date Jul 14, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- MING ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220172986
- Publication date Jun 2, 2022
- WINBOND ELECTRONICS CORP.
- Chang-Ju HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D BONDED SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20220165618
- Publication date May 26, 2022
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS

involving a partial via etch

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal interconnect structure having cap layer with different thickn...

Hardened interlayer dielectric layer

Air gap formation method

Processes for reducing line-end spacing

Front-end-of-line (FEOL) through semiconductor-on-substrate via (TSV)

Wet etching chemistry and method of forming semiconductor device us...

Interconnect structure of semiconductor device

Method for manufacturing semiconductor device

Method for manufacturing an interconnection structure having a bott...

Interconnection structure with anti-adhesion layer

Selective deposition of a protective layer to reduce interconnect s...

Vias for cobalt-based interconnects and methods of fabrication thereof

Method for fabricating interconnection using graphene

Fully aligned via integration with selective catalyzed vapor phase...

Selective ILD deposition for fully aligned via with airgap

Raised via for terminal connections on different planes

Via structure and methods for forming the same

Fin field effect transistor (FinFET) device structure with intercon...

Front-end-of-line (FEOL) through semiconductor-on-substrate via (TSV)

Selective deposition of a protective layer to reduce interconnect s...

Patterning method

Method for fabricating semiconductor device

Metal interconnect structure and method for fabricating the same

Semiconductor device and manufacturing method thereof

Semiconductor structure and method of manufacture

Three-dimensional memory device including multi-tier moat isolation...

Interconnect structure and method of forming the same

Semiconductor device and method of manufacture

Interconnect structure of semiconductor device including barrier la...

Method for fabricating CU interconnection using graphene

Patents Applicationslast 30 patents

PROCESSES FOR REDUCING LINE-END SPACING

FRONT-END-OF-LINE (FEOL) THROUGH SEMICONDUCTOR-ON-SUBSTRATE VIA (TSV)

METHOD OF FORMING SEMICONDUCTOR DEVICE USING WET ETCHING CHEMISTRY

INTERCONNECTION STRUCTURE

Interconnect Structure of Semiconductor Device

INTERCONNECTION STRUCTURE WITH ANTI-ADHESION LAYER

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

SELECTIVE DEPOSITION OF A PROTECTIVE LAYER TO REDUCE INTERCONNECT S...

Vias for Cobalt-Based Interconnects and Methods of Fabrication Thereof

SEMICONDUCTOR DEVICE HAVING THROUGH-VIA STRUCTURE

SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP

Transistor Contacts and Methods of Forming the Same

Gallium Nitride Device with Field Plate Structure and Method of Man...

FULLY ALIGNED VIA INTEGRATION WITH SELECTIVE CATALYZED VAPOR PHASE...

WET ETCHING CHEMISTRY AND METHOD OF FORMING SEMICONDUCTOR DEVICE US...

AIR GAP FORMATION METHOD

ETCHING COMPOSITION FOR REMOVING SILICON AND METHOD FOR REMOVING SI...

Fin Field Effect Transistor (FinFET) Device Structure with Intercon...

METAL INTERCONNECT STRUCTURE AND METHOD FOR FABRICATING THE SAME

HARDENED INTERLAYER DIELECTRIC LAYER

FRONT-END-OF-LINE (FEOL) THROUGH SEMICONDUCTOR-ON-SUBSTRATE VIA (TSV)

VIA STRUCTURE AND METHODS FOR FORMING THE SAME

Semiconductor Structure and Method of Manufacture

SELECTIVE DEPOSITION OF A PROTECTIVE LAYER TO REDUCE INTERCONNECT S...

FULLY ALIGNED VIA INTEGRATION WITH SELECTIVE CATALYZED VAPOR PHASE...

Semiconductor Device and Method of Manufacture

Interconnect Structure of Semiconductor Device and Method of Formin...

METHOD FOR FABRICATING INTERCONNECTION USING GRAPHENE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

3D BONDED SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME