involving guiding structures

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CPC
H01L2021/6009

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

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H01L2021/6009involving guiding structures

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic component module, and method of manufacturing electronic...
- Patent number 12,177,990
- Issue date Dec 24, 2024
- Murata Manufacturing Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,051,668
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress relief for flip-chip packaged devices
- Patent number 11,930,590
- Issue date Mar 12, 2024
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate chuck for self-assembling semiconductor light emitting di...
- Patent number 11,901,208
- Issue date Feb 13, 2024
- LG Electronics Inc.
- Inbum Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,699,674
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages for sensor chips
- Patent number 11,670,521
- Issue date Jun 6, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with flip chip solder joint capsules
- Patent number 11,600,498
- Issue date Mar 7, 2023
- Texas Instruments Incorporated
- James Raymond Maliclic Baello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal film, power conversion device with...
- Patent number 11,557,531
- Issue date Jan 17, 2023
- Mitsubishi Electric Corporation
- Shohei Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,476,128
- Issue date Oct 18, 2022
- Advanced Semiconductor Engineering, Inc.
- Jenchun Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flipchip package with an IC having a covered cavity comprising meta...
- Patent number 11,362,020
- Issue date Jun 14, 2022
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for constructing micro-LED display module
- Patent number 11,177,157
- Issue date Nov 16, 2021
- LUMENS CO., LTD.
- Kihyun An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Input/output pins for chip-embedded substrate
- Patent number 11,101,221
- Issue date Aug 24, 2021
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,101,236
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,069,673
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,861,713
- Issue date Dec 8, 2020
- Denso Corporation
- Takanori Kawashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heating of a substrate for epoxy deposition
- Patent number 10,861,714
- Issue date Dec 8, 2020
- ASM Technology Singapore Pte. Ltd.
- Pak Lun Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,672,752
- Issue date Jun 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming joint structures for surface mount packages
- Patent number 10,573,622
- Issue date Feb 25, 2020
- Intel Corporation
- Lilia May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,134,719
- Issue date Nov 20, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated spacers for field-effect transistors
- Patent number 10,008,456
- Issue date Jun 26, 2018
- GLOBALFOUNDRIES Inc.
- Tao Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 9,978,716
- Issue date May 22, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,978,723
- Issue date May 22, 2018
- Olympus Corporation
- Naohiro Takazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Input/output pins for chip-embedded substrate
- Patent number 9,966,341
- Issue date May 8, 2018
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of attaching components to printed cirucuit board with reduc...
- Patent number 9,865,479
- Issue date Jan 9, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Wei-Shun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip alignment mark exposing method enabling wafer level under...
- Patent number 9,824,925
- Issue date Nov 21, 2017
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically integrated wafers with thermal dissipation
- Patent number 9,812,428
- Issue date Nov 7, 2017
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Zhijiong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically integrated wafers with thermal dissipation
- Patent number 9,508,685
- Issue date Nov 29, 2016
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Zhijiong Luo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING LAYER BETWEEN STACKED INTEGRATED CIRCUITS
- Publication number 20240347386
- Publication date Oct 17, 2024
- Honeywell International Inc.
- James L. Tucker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240250035
- Publication date Jul 25, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Se Hwan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES
- Publication number 20240224415
- Publication date Jul 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20230299033
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH FLIP CHIP SOLDER JOINT CAPSULES
- Publication number 20230187223
- Publication date Jun 15, 2023
- TEXAS INSTRUMENTS INCORPORATED
- James Raymond Maliclic Baello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES
- Publication number 20220210911
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MODULE, AND METHOD OF MANUFACTURING ELECTRONIC...
- Publication number 20220192032
- Publication date Jun 16, 2022
- Murata Manufacturing Co., Ltd.
- Takahiro KITAZUME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIPCHIP PACKAGE WITH AN IC HAVING A COVERED CAVITY COMPRISING META...
- Publication number 20220157698
- Publication date May 19, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220068665
- Publication date Mar 3, 2022
- Advanced Semiconductor Engineering, Inc.
- Jenchun CHEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Package and Method of Forming the Same
- Publication number 20210384154
- Publication date Dec 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
- Publication number 20210313253
- Publication date Oct 7, 2021
- MITSUBISHI ELECTRIC CORPORATION
- Shohei OGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH FLIP CHIP SOLDER JOINT CAPSULES
- Publication number 20210202269
- Publication date Jul 1, 2021
- TEXAS INSTRUMENTS INCORPORATED
- James Raymond Maliclic Baello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SEMICONDUCTOR PACKAGES
- Publication number 20210193483
- Publication date Jun 24, 2021
- UTAC Headquarters Pte. Ltd.
- IL Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CHUCK FOR SELF-ASSEMBLING SEMICONDUCTOR LIGHT EMITTING DI...
- Publication number 20210090929
- Publication date Mar 25, 2021
- LG ELECTRONICS INC.
- Inbum YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ASSEMBLING A SEMICONDUCTOR POWER MODULE COMPONENT AND A S...
- Publication number 20210013175
- Publication date Jan 14, 2021
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATING OF A SUBSTRATE FOR EPOXY DEPOSITION
- Publication number 20200227281
- Publication date Jul 16, 2020
- ASM Technology Singapore Pte Ltd
- Pak Lun CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Forming the Same
- Publication number 20200075527
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200066546
- Publication date Feb 27, 2020
- Toyota Jidosha Kabushiki Kaisha
- Takanori Kawashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190043849
- Publication date Feb 7, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INPUT/OUTPUT PINS FOR CHIP-EMBEDDED SUBSTRATE
- Publication number 20180233453
- Publication date Aug 16, 2018
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INPUT/OUTPUT PINS FOR CHIP-EMBEDDED SUBSTRATE
- Publication number 20180122745
- Publication date May 3, 2018
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180006005
- Publication date Jan 4, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170317054
- Publication date Nov 2, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ATTACHING COMPONENTS TO PRINTED CIRUCUIT BOARD WITH REDUC...
- Publication number 20170301559
- Publication date Oct 19, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Wei-Shun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ALIGNMENT MARK EXPOSING METHOD ENABLING WAFER LEVEL UNDER...
- Publication number 20160365281
- Publication date Dec 15, 2016
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS

involving guiding structures

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic component module, and method of manufacturing electronic...

Semiconductor package and method of forming the same

Stress relief for flip-chip packaged devices

Substrate chuck for self-assembling semiconductor light emitting di...

Semiconductor package and method of forming the same

Reliable semiconductor packages for sensor chips

Semiconductor package with flip chip solder joint capsules

Semiconductor device with metal film, power conversion device with...

Semiconductor device package and method of manufacturing the same

Flipchip package with an IC having a covered cavity comprising meta...

Method for constructing micro-LED display module

Input/output pins for chip-embedded substrate

Semiconductor package and method of forming the same

Semiconductor package and manufacturing method thereof

Semiconductor device

Heating of a substrate for epoxy deposition

Semiconductor package and manufacturing method thereof

Methods of forming joint structures for surface mount packages

Semiconductor package and manufacturing method thereof

Laminated spacers for field-effect transistors

Package structure and method for manufacturing the same

Semiconductor device

Input/output pins for chip-embedded substrate

Method of attaching components to printed cirucuit board with reduc...

Flip chip alignment mark exposing method enabling wafer level under...

Vertically integrated wafers with thermal dissipation

Vertically integrated wafers with thermal dissipation

Patents Applicationslast 30 patents

BONDING LAYER BETWEEN STACKED INTEGRATED CIRCUITS

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE WITH FLIP CHIP SOLDER JOINT CAPSULES

STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES

ELECTRONIC COMPONENT MODULE, AND METHOD OF MANUFACTURING ELECTRONIC...

FLIPCHIP PACKAGE WITH AN IC HAVING A COVERED CAVITY COMPRISING META...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Package and Method of Forming the Same

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...

SEMICONDUCTOR PACKAGE WITH FLIP CHIP SOLDER JOINT CAPSULES

RELIABLE SEMICONDUCTOR PACKAGES

SUBSTRATE CHUCK FOR SELF-ASSEMBLING SEMICONDUCTOR LIGHT EMITTING DI...

METHOD OF ASSEMBLING A SEMICONDUCTOR POWER MODULE COMPONENT AND A S...

HEATING OF A SUBSTRATE FOR EPOXY DEPOSITION

Semiconductor Package and Method of Forming the Same

SEMICONDUCTOR DEVICE

SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF

INPUT/OUTPUT PINS FOR CHIP-EMBEDDED SUBSTRATE

INPUT/OUTPUT PINS FOR CHIP-EMBEDDED SUBSTRATE

SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF ATTACHING COMPONENTS TO PRINTED CIRUCUIT BOARD WITH REDUC...

FLIP CHIP ALIGNMENT MARK EXPOSING METHOD ENABLING WAFER LEVEL UNDER...