involving intermediate temporary filling with material

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CPC
H01L21/76808

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76808involving intermediate temporary filling with material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 12,154,823
- Issue date Nov 26, 2024
- Renesas Electronics Corporation
- Katsuhiko Hotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming large chips through stitching
- Patent number 12,148,719
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Landing metal etch process for improved overlay control
- Patent number 12,125,712
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Min Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chamfer-less via integration scheme
- Patent number 11,987,876
- Issue date May 21, 2024
- Lam Research Corporation
- Sivananda Krishnan Kanakasabapathy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 11,990,365
- Issue date May 21, 2024
- Winbond Electronics Corp.
- Chang-Ju Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch damage and ESL free dual damascene metal interconnect
- Patent number 11,955,376
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-stage bake photoresist with releasable quencher
- Patent number 11,955,343
- Issue date Apr 9, 2024
- Intel Corporation
- Robert L. Bristol
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Via connection to a partially filled trench
- Patent number 11,929,258
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via interconnects including super vias
- Patent number 11,916,013
- Issue date Feb 27, 2024
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,881,430
- Issue date Jan 23, 2024
- Samsung Electronics Co., Ltd.
- Sung Jin Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 11,817,351
- Issue date Nov 14, 2023
- SK hynix Inc.
- Ki-Hong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via cut fill process for line extension reduction
- Patent number 11,804,406
- Issue date Oct 31, 2023
- International Business Machines Corporation
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Landing metal etch process for improved overlay control
- Patent number 11,798,812
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Min Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned interconnect structure
- Patent number 11,798,910
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming terminations in stacked memory arrays
- Patent number 11,756,826
- Issue date Sep 12, 2023
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,749,565
- Issue date Sep 5, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical device having conductive lines with air gaps therebetwee...
- Patent number 11,735,524
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement metal COB integration process for embedded DRAM
- Patent number 11,723,188
- Issue date Aug 8, 2023
- Intel Corporation
- Uygar Avci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming metal interconnection
- Patent number 11,715,689
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully self-aligned via with selective bilayer dielectric regrowth
- Patent number 11,705,369
- Issue date Jul 18, 2023
- Tokyo Electron Limited
- Kandabara Tapily
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective ILD deposition for fully aligned via with airgap
- Patent number 11,676,854
- Issue date Jun 13, 2023
- TESSERA LLC
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gap fill void and connection structures
- Patent number 11,651,992
- Issue date May 16, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Haigou Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for interconnection with self-alignment
- Patent number 11,640,924
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 11,600,522
- Issue date Mar 7, 2023
- Renesas Electronics Corporation
- Katsuhiko Hotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming bonding structures by using template layer as templates
- Patent number 11,594,484
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scaled gate contact and source/drain cap
- Patent number 11,569,356
- Issue date Jan 31, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Hui Zang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,495,490
- Issue date Nov 8, 2022
- Tokyo Electron Limited
- Koichi Yatsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 11,476,194
- Issue date Oct 18, 2022
- Samsung Electronics Co., Ltd.
- Seok Han Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming large chips through stitching
- Patent number 11,444,038
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned contact and contact over active gate structures
- Patent number 11,437,273
- Issue date Sep 6, 2022
- Micromaterials LLC
- Yuriy Shusterman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HOMOGENEOUS SOURCE/DRAIN CONTACT STRUCTURE
- Publication number 20240379412
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Ching Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LANDING METAL ETCH PROCESS FOR IMPROVED OVERLAY CONTROL
- Publication number 20240371653
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Min HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE INTERCONNECT PATTERNING AND FRONT SIDE METAL INTERCONNECT...
- Publication number 20240332064
- Publication date Oct 3, 2024
- Intel Corporation
- Ehren MANNEBACH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20240282571
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Lin Tsai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHAMFER-LESS VIA INTEGRATION SCHEME
- Publication number 20240263301
- Publication date Aug 8, 2024
- LAM RESEARCH CORPORATION
- Sivananda Krishnan Kanakasabapathy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20240222189
- Publication date Jul 4, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Kuo Hsiung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENABLING COPPER RECESS FLATTENING THROUGH A DFR PATTERNING PROCESSES
- Publication number 20240222137
- Publication date Jul 4, 2024
- Intel Corporation
- Shaojiang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA CONNECTION TO A PARTIALLY FILLED TRENCH
- Publication number 20240213034
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240112949
- Publication date Apr 4, 2024
- Samsung Electronics Co., Ltd.
- Sung Jin KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVES LINES AND VIAS WITH WRAP-AROUND CONTACT
- Publication number 20240096786
- Publication date Mar 21, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP
- Publication number 20240096693
- Publication date Mar 21, 2024
- TESSERA LLC
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR MAXIMIZING AIR GAP IN BACK END OF THE LINE...
- Publication number 20240014133
- Publication date Jan 11, 2024
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LANDING METAL ETCH PROCESS FOR IMPROVED OVERLAY CONTROL
- Publication number 20230377900
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Min HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED INTERCONNECT STRUCTURE
- Publication number 20230369281
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CONDUCTIVE FEATURE
- Publication number 20230343640
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- KUAN WEI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE AND REWORKING PROCESS
- Publication number 20230317512
- Publication date Oct 5, 2023
- NANYA TECHNOLOGY CORPORATION
- WEI-CHEN PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20230282570
- Publication date Sep 7, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20230187275
- Publication date Jun 15, 2023
- RENESAS ELECTRONICS CORPORATION
- Katsuhiko HOTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT CONDUCTIVE MATERIAL FOR INTERCONNECT FEATURES
- Publication number 20230163024
- Publication date May 25, 2023
- Intel Corporation
- Prashant Majhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA INTERCONNECTS INCLUDING SUPER VIAS
- Publication number 20230065078
- Publication date Mar 2, 2023
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230066256
- Publication date Mar 2, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE, SEMICONDUCTOR DEVICE WITH INTERCONNECTIO...
- Publication number 20230046051
- Publication date Feb 16, 2023
- SK HYNIX INC.
- Jong Su KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP VIA CUT FILL PROCESS FOR LINE EXTENSION REDUCTION
- Publication number 20230024306
- Publication date Jan 26, 2023
- International Business Machines Corporation
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING SELF-ALIGNED VIAS AND AIR-GAPS IN SEMICONDUCTOR FABRICATION
- Publication number 20220406658
- Publication date Dec 22, 2022
- TESSERA LLC
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED CONTACT AND CONTACT OVER ACTIVE GATE STRUCTURES
- Publication number 20220367270
- Publication date Nov 17, 2022
- Micromaterials LLC.
- Yuriy Shusterman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY SELF-ALIGNED VIA
- Publication number 20220359289
- Publication date Nov 10, 2022
- Micromaterials LLC.
- Regina Freed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Large Chips Through Stitching
- Publication number 20220359433
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOMOGENEOUS SOURCE/DRAIN CONTACT STRUCTURE
- Publication number 20220336269
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Ching Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220285207
- Publication date Sep 8, 2022
- Samsung Electronics Co., Ltd.
- Sung Jin KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LANDING METAL ETCH PROCESS FOR IMPROVED OVERLAY CONTROL
- Publication number 20220262647
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Min HSIAO
- H01 - BASIC ELECTRIC ELEMENTS

involving intermediate temporary filling with material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and a method of manufacturing the same

Forming large chips through stitching

Landing metal etch process for improved overlay control

Chamfer-less via integration scheme

Method for manufacturing semiconductor device

Etch damage and ESL free dual damascene metal interconnect

Two-stage bake photoresist with releasable quencher

Via connection to a partially filled trench

Via interconnects including super vias

Semiconductor device

Method for fabricating semiconductor device

Top via cut fill process for line extension reduction

Landing metal etch process for improved overlay control

Self-aligned interconnect structure

Forming terminations in stacked memory arrays

Semiconductor device and manufacturing method thereof

Electrical device having conductive lines with air gaps therebetwee...

Replacement metal COB integration process for embedded DRAM

Method of forming metal interconnection

Fully self-aligned via with selective bilayer dielectric regrowth

Selective ILD deposition for fully aligned via with airgap

Gap fill void and connection structures

Structure and method for interconnection with self-alignment

Semiconductor device and a method of manufacturing the same

Forming bonding structures by using template layer as templates

Scaled gate contact and source/drain cap

Semiconductor device manufacturing method

Method for fabricating semiconductor device

Forming large chips through stitching

Self-aligned contact and contact over active gate structures

Patents Applicationslast 30 patents

HOMOGENEOUS SOURCE/DRAIN CONTACT STRUCTURE

LANDING METAL ETCH PROCESS FOR IMPROVED OVERLAY CONTROL

BACK SIDE INTERCONNECT PATTERNING AND FRONT SIDE METAL INTERCONNECT...

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

CHAMFER-LESS VIA INTEGRATION SCHEME

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

ENABLING COPPER RECESS FLATTENING THROUGH A DFR PATTERNING PROCESSES

VIA CONNECTION TO A PARTIALLY FILLED TRENCH

SEMICONDUCTOR DEVICE

SUBTRACTIVES LINES AND VIAS WITH WRAP-AROUND CONTACT

SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP

STRUCTURE AND METHOD FOR MAXIMIZING AIR GAP IN BACK END OF THE LINE...

LANDING METAL ETCH PROCESS FOR IMPROVED OVERLAY CONTROL

SELF-ALIGNED INTERCONNECT STRUCTURE

METHOD FOR FORMING CONDUCTIVE FEATURE

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE AND REWORKING PROCESS

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

REPLACEMENT CONDUCTIVE MATERIAL FOR INTERCONNECT FEATURES

VIA INTERCONNECTS INCLUDING SUPER VIAS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

INTERCONNECTION STRUCTURE, SEMICONDUCTOR DEVICE WITH INTERCONNECTIO...

TOP VIA CUT FILL PROCESS FOR LINE EXTENSION REDUCTION

FORMING SELF-ALIGNED VIAS AND AIR-GAPS IN SEMICONDUCTOR FABRICATION

SELF-ALIGNED CONTACT AND CONTACT OVER ACTIVE GATE STRUCTURES

FULLY SELF-ALIGNED VIA

Forming Large Chips Through Stitching

HOMOGENEOUS SOURCE/DRAIN CONTACT STRUCTURE

SEMICONDUCTOR DEVICE

LANDING METAL ETCH PROCESS FOR IMPROVED OVERLAY CONTROL