involving multiple stacked pre-patterned masks

Industry

CPC
H01L21/76811

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76811involving multiple stacked pre-patterned masks

Industries

Patents Grantslast 30 patents

Information Patent Grant
Interconnection structure with anti-adhesion layer
- Patent number 11,948,835
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor structure, and a semiconduc...
- Patent number 11,935,785
- Issue date Mar 19, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Shuai Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming interconnect structure
- Patent number 11,842,922
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming openings in conductive layers and using the same
- Patent number 11,798,837
- Issue date Oct 24, 2023
- Micron Technology, Inc.
- Tsuyoshi Tomoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with resistive element
- Patent number 11,798,848
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Sheh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor structure
- Patent number 11,764,062
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ping-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ALD (atomic layer deposition) liner for via profile control and rel...
- Patent number 11,742,241
- Issue date Aug 29, 2023
- Tokyo Electron Limited
- Xinghua Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical device having conductive lines with air gaps therebetwee...
- Patent number 11,735,524
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization stop region for use with low pattern density intercon...
- Patent number 11,637,036
- Issue date Apr 25, 2023
- International Business Machines Corporation
- Cornelius Brown Peethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Skip-via proximity interconnect
- Patent number 11,600,519
- Issue date Mar 7, 2023
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 11,600,522
- Issue date Mar 7, 2023
- Renesas Electronics Corporation
- Katsuhiko Hotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via cleaning to reduce resistance
- Patent number 11,557,507
- Issue date Jan 17, 2023
- International Business Machines Corporation
- Yann A. M. Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field effect transistor (FinFET) device structure with intercon...
- Patent number 11,532,512
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via and plug architectures for integrated circuit interconnects and...
- Patent number 11,527,433
- Issue date Dec 13, 2022
- Intel Corporation
- Leonard P. Guler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,495,490
- Issue date Nov 8, 2022
- Tokyo Electron Limited
- Koichi Yatsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an interconnect structure having a selecti...
- Patent number 11,488,861
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Kuan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an integrated chip having a cavity between metal...
- Patent number 11,482,447
- Issue date Oct 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning method
- Patent number 11,476,155
- Issue date Oct 18, 2022
- Imec VZW
- Victor M. Blanco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor having improved gate structures
- Patent number 11,476,154
- Issue date Oct 18, 2022
- Raytheon Company
- Jeffrey R. LaRoche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure of semiconductor device including barrier la...
- Patent number 11,335,593
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Jhih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming trenches
- Patent number 11,232,979
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up fill dielectric materials for semiconductor structure fab...
- Patent number 11,232,980
- Issue date Jan 25, 2022
- Intel Corporation
- Florian Gstrein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device structure with fine line pi...
- Patent number 11,217,458
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device with resistive element
- Patent number 11,217,482
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Sheh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an interconnect structure of a semiconductor device
- Patent number 11,217,476
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-Yen Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having a graphene layer
- Patent number 11,205,617
- Issue date Dec 21, 2021
- Semiconductor Manufacturing International (Shanghai) Corporation
- Ming Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices and structures thereof
- Patent number 11,183,392
- Issue date Nov 23, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jiann-Horng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removing polymer through treatment
- Patent number 11,171,040
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stair step structures including insulative materials, and related d...
- Patent number 11,088,017
- Issue date Aug 10, 2021
- Micron Technology, Inc.
- John B. Matovu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of interconnection structure of semi...
- Patent number 11,088,020
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING INTERCONNECT STRUCTURE
- Publication number 20240071815
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TUNABLE THRESHOLD VOLTAGE AND METHOD FOR...
- Publication number 20240021709
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chansyun David YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR MAXIMIZING AIR GAP IN BACK END OF THE LINE...
- Publication number 20240014133
- Publication date Jan 11, 2024
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...
- Publication number 20230420293
- Publication date Dec 28, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Zhaopei CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP-DOWN SELF-ALIGNMENT OF VIAS IN A SEMICONDUCTOR DEVICE FOR SUB-2...
- Publication number 20230352343
- Publication date Nov 2, 2023
- TOKYO ELECTRON LIMITED
- Jeffrey SMITH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE HAVING BIT LINE WITH STEPPED PROFILE
- Publication number 20230345707
- Publication date Oct 26, 2023
- NANYA TECHNOLOGY CORPORATION
- TZU-CHING TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH RESISTIVE ELEMENT
- Publication number 20230326795
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Sheh HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING PLASMA GENERATING CELLS FOR A PLASMA SOURCE
- Publication number 20230319971
- Publication date Oct 5, 2023
- Applied Materials, Inc.
- David John Jorgensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230307354
- Publication date Sep 28, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Yuanhao GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING PHOTOMASK AND METHOD FOR FABRICATING SEMICON...
- Publication number 20230298932
- Publication date Sep 21, 2023
- NANYA TECHNOLOGY CORPORATION
- CHIH-HSUAN YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Patterning with Self-Assembled Monolayer
- Publication number 20230253250
- Publication date Aug 10, 2023
- TOKYO ELECTRON LIMITED
- Dina H. Triyoso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Patterning a Substrate Using Photolithography
- Publication number 20230197505
- Publication date Jun 22, 2023
- TOKYO ELECTRON LIMITED
- Katie Lutker-Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20230187275
- Publication date Jun 15, 2023
- RENESAS ELECTRONICS CORPORATION
- Katsuhiko HOTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOF
- Publication number 20230170252
- Publication date Jun 1, 2023
- Samsung Electronics Co., LTD
- Jong Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fin Field Effect Transistor (FinFET) Device Structure with Intercon...
- Publication number 20230116545
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che-Cheng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING OPENINGS IN CONDUCTIVE LAYERS AND USING THE SAME
- Publication number 20230107365
- Publication date Apr 6, 2023
- Micron Technology, Inc.
- TSUYOSHI TOMOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR (MIMCAP) AND METHODS OF FORMING THE...
- Publication number 20230069830
- Publication date Mar 9, 2023
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Kwang Sing YEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING INTERCONNECT STRUCTURE
- Publication number 20230050514
- Publication date Feb 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR STRUCTURE, AND A SEMICONDUC...
- Publication number 20230017390
- Publication date Jan 19, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Shuai Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20230012447
- Publication date Jan 12, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Guangsu SHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING SEMICONDUCTOR DEVICE
- Publication number 20220367477
- Publication date Nov 17, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Sheng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP WITH CAVITY STRUCTURE
- Publication number 20220336263
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND PREPARATION METHOD THEREOF
- Publication number 20220320108
- Publication date Oct 6, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Jingwen LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20220301871
- Publication date Sep 22, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Kai CAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING INTERCONNECTION STRUCTURE
- Publication number 20220293465
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Kuan HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20220293426
- Publication date Sep 15, 2022
- Samsung Electronics Co., Ltd.
- Hyunki Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure of Semiconductor Device and Method of Formin...
- Publication number 20220254682
- Publication date Aug 11, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Jhih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A THREE-DIMENSIONAL MEMORY DEVICE USING COMPOSITE...
- Publication number 20220208600
- Publication date Jun 30, 2022
- SANDISK TECHNOLOGIES LLC
- Roshan Jayakhar TIRUKKONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLORED GRATINGS IN MICROELECTRONIC STRUCTURES
- Publication number 20220199420
- Publication date Jun 23, 2022
- Intel Corporation
- Gurpreet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...
- Publication number 20220139923
- Publication date May 5, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Xinman CAO
- H01 - BASIC ELECTRIC ELEMENTS

involving multiple stacked pre-patterned masks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interconnection structure with anti-adhesion layer

Method of manufacturing a semiconductor structure, and a semiconduc...

Method for forming interconnect structure

Methods for forming openings in conductive layers and using the same

Semiconductor device structure with resistive element

Method of forming semiconductor structure

ALD (atomic layer deposition) liner for via profile control and rel...

Electrical device having conductive lines with air gaps therebetwee...

Planarization stop region for use with low pattern density intercon...

Skip-via proximity interconnect

Semiconductor device and a method of manufacturing the same

Via cleaning to reduce resistance

Fin field effect transistor (FinFET) device structure with intercon...

Via and plug architectures for integrated circuit interconnects and...

Semiconductor device manufacturing method

Method for manufacturing an interconnect structure having a selecti...

Method of forming an integrated chip having a cavity between metal...

Patterning method

Field effect transistor having improved gate structures

Interconnect structure of semiconductor device including barrier la...

Method of forming trenches

Bottom-up fill dielectric materials for semiconductor structure fab...

Method for forming semiconductor device structure with fine line pi...

Method for forming semiconductor device with resistive element

Method of forming an interconnect structure of a semiconductor device

Interconnect structure having a graphene layer

Method for manufacturing semiconductor devices and structures thereof

Removing polymer through treatment

Stair step structures including insulative materials, and related d...

Structure and formation method of interconnection structure of semi...

Patents Applicationslast 30 patents

METHOD FOR FORMING INTERCONNECT STRUCTURE

SEMICONDUCTOR DEVICE WITH TUNABLE THRESHOLD VOLTAGE AND METHOD FOR...

STRUCTURE AND METHOD FOR MAXIMIZING AIR GAP IN BACK END OF THE LINE...

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...

TOP-DOWN SELF-ALIGNMENT OF VIAS IN A SEMICONDUCTOR DEVICE FOR SUB-2...

MEMORY DEVICE HAVING BIT LINE WITH STEPPED PROFILE

SEMICONDUCTOR DEVICE STRUCTURE WITH RESISTIVE ELEMENT

METHODS OF MANUFACTURING PLASMA GENERATING CELLS FOR A PLASMA SOURCE

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME

METHOD FOR FABRICATING PHOTOMASK AND METHOD FOR FABRICATING SEMICON...

Patterning with Self-Assembled Monolayer

Method for Patterning a Substrate Using Photolithography

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOF

Fin Field Effect Transistor (FinFET) Device Structure with Intercon...

METHODS FOR FORMING OPENINGS IN CONDUCTIVE LAYERS AND USING THE SAME

METAL-INSULATOR-METAL CAPACITOR (MIMCAP) AND METHODS OF FORMING THE...

METHOD FOR FORMING INTERCONNECT STRUCTURE

METHOD OF MANUFACTURING A SEMICONDUCTOR STRUCTURE, AND A SEMICONDUC...

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING SEMICONDUCTOR DEVICE

INTEGRATED CHIP WITH CAVITY STRUCTURE

SEMICONDUCTOR STRUCTURE AND PREPARATION METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

METHOD FOR MANUFACTURING INTERCONNECTION STRUCTURE

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

Interconnect Structure of Semiconductor Device and Method of Formin...

METHOD OF MAKING A THREE-DIMENSIONAL MEMORY DEVICE USING COMPOSITE...

COLORED GRATINGS IN MICROELECTRONIC STRUCTURES

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...