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Involving several components

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  • CPC
  • H05K2201/10507
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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/10507Involving several components
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    CIRCUIT MODULE
    • Publication number 20240237211
    • Publication date Jul 11, 2024
    • Murata Manufacturing Co., Ltd.
    • Yoshihito OTSUBO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT MODULE
    • Publication number 20240138066
    • Publication date Apr 25, 2024
    • Murata Manufacturing Co., Ltd.
    • Yoshihito OTSUBO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE
    • Publication number 20230269864
    • Publication date Aug 24, 2023
    • MURATA MANUFACTURING CO., LTD.
    • Yuji TAKEMATSU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DOUBLE-SIDED FLEXIBLE CIRCUIT BOARD
    • Publication number 20230044473
    • Publication date Feb 9, 2023
    • Chipbond Technology Corporation
    • Yin-Chen Lin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    TRANSMISSION BOARD TO CARRY ELECTROMAGNETIC WAVE WITHOUT LEAKAGE AN...
    • Publication number 20230025696
    • Publication date Jan 26, 2023
    • BOARDTEK ELECTRONICS CORPORATION
    • CHUNG-HSING LIAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MODULE
    • Publication number 20220418089
    • Publication date Dec 29, 2022
    • Murata Manufacturing Co., Ltd.
    • Tadashi NOMURA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD
    • Publication number 20210378105
    • Publication date Dec 2, 2021
    • AUTONETWORKS TECHNOLOGIES, LTD.
    • Akira Haraguchi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    POWER SOURCE DEVICE
    • Publication number 20210328513
    • Publication date Oct 21, 2021
    • Sony Interactive Entertainment Inc.
    • Kazuki Sasao
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    POWER SEMICONDUCTOR MODULE AND COMPOSITE MODULE
    • Publication number 20210257342
    • Publication date Aug 19, 2021
    • Mitsubishi Electric Corporation
    • Shigeto FUJITA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THERMALLY INSULATED PRINTED CIRCUIT BOARD
    • Publication number 20210029817
    • Publication date Jan 28, 2021
    • BORGWARNER, INC.
    • Lathom Alexander LOUCO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLEXIBLE CIRCUIT STRUCTURES INCLUDING CONNECTION ARRANGEMENT CONNEC...
    • Publication number 20200137875
    • Publication date Apr 30, 2020
    • KARDIUM INC.
    • Daniel Robert Weinkam
    • A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
  • Information Patent Application

    INTEGRATED CIRCUIT CAPABLE OF CONTROLLING IMPEDANCE AND ELECTRONIC...
    • Publication number 20200092983
    • Publication date Mar 19, 2020
    • Samsung Electronics Co., Ltd.
    • Cheolho LEE
    • H03 - BASIC ELECTRONIC CIRCUITRY
  • Information Patent Application

    Expanding Thermal Device and System for Effecting Heat Transfer wit...
    • Publication number 20190261502
    • Publication date Aug 22, 2019
    • Raytheon Company
    • Brian W. Johansen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    IN-VEHICLE ELECTRONIC DEVICE
    • Publication number 20190223287
    • Publication date Jul 18, 2019
    • Mitsubishi Electric Corporation
    • Mitsunori NISHIDA
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    CIRCUITS FOR FLEXIBLE STRUCTURES
    • Publication number 20180310398
    • Publication date Oct 25, 2018
    • KARDIUM INC.
    • Daniel Robert Weinkam
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR
    • Publication number 20180231821
    • Publication date Aug 16, 2018
    • Omron Corporation
    • Wakahiro KAWAI
    • G02 - OPTICS
  • Information Patent Application

    CIRCUITS FOR FLEXIBLE STRUCTURES
    • Publication number 20180146540
    • Publication date May 24, 2018
    • KARDIUM INC.
    • Daniel Robert Weinkam
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    KEYBOARD
    • Publication number 20180122596
    • Publication date May 3, 2018
    • Primax Electronics Ltd.
    • CHIEN-HUNG LIU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    EMI SHIELDING STRUCTURE AND MANUFACTURING METHOD THEREOF
    • Publication number 20180042147
    • Publication date Feb 8, 2018
    • Samsung Electronics Co., Ltd.
    • Il-ju MUN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Expanding Thermal Device and System for Effecting Heat Transfer wit...
    • Publication number 20170339779
    • Publication date Nov 23, 2017
    • Raytheon Company
    • Brian W. Johansen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC CIRCUIT CARD WITH CONNECTOR EDGE HAVING ALTERNATED TX AN...
    • Publication number 20170256874
    • Publication date Sep 7, 2017
    • International Business Machines Corporation
    • Francois Abel
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    CIRCUITS FOR FLEXIBLE STRUCTURES
    • Publication number 20170164464
    • Publication date Jun 8, 2017
    • KARDIUM INC.
    • Daniel Robert Weinkam
    • G01 - MEASURING TESTING
  • Information Patent Application

    CIRCUIT ASSEMBLY FOR AN ELECTRONIC DEVICE
    • Publication number 20170094796
    • Publication date Mar 30, 2017
    • Apple Inc.
    • Jason Lor
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RESIN-SEALED MODULE
    • Publication number 20170048982
    • Publication date Feb 16, 2017
    • MURATA MANUFACTURING CO., LTD.
    • Shota ISHIHARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CONVERTER MOUNTING BOARD
    • Publication number 20160352243
    • Publication date Dec 1, 2016
    • Fujitsu Limited
    • Kazuya OKAMOTO
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    ELECTRIC MOTOR CONTROLLER
    • Publication number 20160329774
    • Publication date Nov 10, 2016
    • Mitsubishi Electric Corporation
    • Rei ARAKI
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    MULTIPLE DRIVE SLED IN A STORAGE ARRAY
    • Publication number 20160095246
    • Publication date Mar 31, 2016
    • Seagate Technology LLC
    • Shawn Noland
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20160061885
    • Publication date Mar 3, 2016
    • Fuji Electric Co., Ltd.
    • Yuji TAKEMATSU
    • G01 - MEASURING TESTING
  • Information Patent Application

    Manufacturing a Semiconductor Package Including an Embedded Circuit...
    • Publication number 20150342053
    • Publication date Nov 26, 2015
    • Cisco Technology, Inc.
    • Jovica Savic
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE WITH LOW INDUCTANCE LOAD CONNECTIONS
    • Publication number 20150342055
    • Publication date Nov 26, 2015
    • INFINEON TECHNOLOGIES AG
    • Andre Arens
    • H01 - BASIC ELECTRIC ELEMENTS