involving the application of mechanical vibrations

Follow

Industry

CPC
H01L2021/607

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2021/607involving the application of mechanical vibrations

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Substrate processing apparatus, vibration detection system and non-...
- Patent number 11,035,721
- Issue date Jun 15, 2021
- Kokusai Electric Corporation
- Mamoru Oishi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ultrasonic vibration bonding apparatus
- Patent number 10,953,487
- Issue date Mar 23, 2021
- Toshiba Mitsubishi-Electric Industrial Systems Corporation
- Akihiro Ichinose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING APPARATUS, VIBRATION DETECTION SYSTEM AND NON-...
- Publication number 20190204144
- Publication date Jul 4, 2019
- Kokusai Electric Corporation
- Mamoru OISHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS AND METHODS TO ACHIEVE UNIFORM PACKAGE THICKNESS
- Publication number 20180166294
- Publication date Jun 14, 2018
- Intel Corporation
- Zheng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATING DEVICE AND SEPARATING METHOD
- Publication number 20150064876
- Publication date Mar 5, 2015
- Kabushiki Kaisha Toshiba
- Kazuhiro IIZUKA
- H01 - BASIC ELECTRIC ELEMENTS