involving the application of pressure

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H01L2021/603

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2021/603involving the application of pressure

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating semiconductor package structure
- Patent number 11,139,177
- Issue date Oct 5, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices including solid semiconductor dies
- Patent number 11,114,599
- Issue date Sep 7, 2021
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cap for package of integrated circuit
- Patent number 11,101,188
- Issue date Aug 24, 2021
- STMicroelectronics (Grenoble 2) SAS
- Olivier Franiatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,094,561
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid viscosity control during wafer bonding
- Patent number 11,056,356
- Issue date Jul 6, 2021
- Intel Corporation
- Brennen K. Mueller
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of forming heterojunction bipolar transistor (HBT)
- Patent number 10,971,598
- Issue date Apr 6, 2021
- Keysight Technologies, Inc.
- Martin W. Dvorak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion device and manufacturing method and appara...
- Patent number 10,950,391
- Issue date Mar 16, 2021
- Kabushiki Kaisha Toshiba
- Shigehiko Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of bonding semiconductor elements to a substrate, including...
- Patent number 10,861,820
- Issue date Dec 8, 2020
- Kulicke and Soffa Industries, Inc.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 10,825,795
- Issue date Nov 3, 2020
- Samsung Electronics Co., Ltd.
- Yeong-Seok Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package and methods of manufacture thereof
- Patent number 10,825,747
- Issue date Nov 3, 2020
- NXP USA, INC.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for semiconductor package and method of fabr...
- Patent number 10,679,866
- Issue date Jun 9, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High heat dissipation stacked chip package structure and the manufa...
- Patent number 10,014,283
- Issue date Jul 3, 2018
- Jing Qiao Corporation Limited
- Chin-Liang Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and methods of manufacture thereof
- Patent number 9,799,580
- Issue date Oct 24, 2017
- NXP USA, INC.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, resin sheet, and production method for semicondu...
- Patent number 9,738,763
- Issue date Aug 22, 2017
- Toray Industries, Inc.
- Yoichi Shimba
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Display device and method for producing same
- Patent number 9,740,067
- Issue date Aug 22, 2017
- Sharp Kabushiki Kaisha
- Keiji Aota
- G02 - OPTICS
Information Patent Grant
Reduced expansion thermal compression bonding process bond head
- Patent number 9,548,284
- Issue date Jan 17, 2017
- Intel Corporation
- Pramod Malatkar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210233781
- Publication date Jul 29, 2021
- KIOXIA Corporation
- Satoshi TSUKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20210057263
- Publication date Feb 25, 2021
- Samsung Electronics Co., Ltd.
- Hoechul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF BONDING SEMICONDUCTOR ELEMENTS TO A SUBSTRATE, INCLUDING...
- Publication number 20210057377
- Publication date Feb 25, 2021
- KULICKE AND SOFFA INDUSTRIES, INC.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS COMPENSATION FOR WAFER TO WAFER BONDING
- Publication number 20200303191
- Publication date Sep 24, 2020
- Intel Corporation
- Anant JAHAGIRDAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAP FOR PACKAGE OF INTEGRATED CIRCUIT
- Publication number 20200075436
- Publication date Mar 5, 2020
- STMicroelectronics (Grenoble 2) SAS
- Olivier Franiatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF BONDING SEMICONDUCTOR ELEMENTS TO A SUBSTRATE, INCLUDING...
- Publication number 20190252349
- Publication date Aug 15, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CORRECTING ESTIMATED FORCE OF BONDING APPARATUS
- Publication number 20180164171
- Publication date Jun 14, 2018
- Samsung Electronics Co., Ltd.
- YOUNGHO HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE THEREOF
- Publication number 20180012815
- Publication date Jan 11, 2018
- NXP USA, Inc.
- LI LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE THEREOF
- Publication number 20170278763
- Publication date Sep 28, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Li LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20170110341
- Publication date Apr 20, 2017
- Denso Corporation
- Kenji ONODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, RESIN SHEET, AND PRODUCTION METHOD FOR SEMICONDU...
- Publication number 20160083537
- Publication date Mar 24, 2016
- TORAY INDUSTRIES, INC.
- Yoichi SHIMBA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
DISPLAY DEVICE AND METHOD FOR PRODUCING SAME
- Publication number 20150226995
- Publication date Aug 13, 2015
- Sharp Kabushiki Kaisha
- Keiji Aota
- G02 - OPTICS

involving the application of pressure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of fabricating semiconductor package structure

Electronic devices including solid semiconductor dies

Cap for package of integrated circuit

Semiconductor package structure

Fluid viscosity control during wafer bonding

Method of forming heterojunction bipolar transistor (HBT)

Photoelectric conversion device and manufacturing method and appara...

Methods of bonding semiconductor elements to a substrate, including...

Method of manufacturing semiconductor devices

Semiconductor device package and methods of manufacture thereof

Interconnect structure for semiconductor package and method of fabr...

High heat dissipation stacked chip package structure and the manufa...

Semiconductor device package and methods of manufacture thereof

Resin composition, resin sheet, and production method for semicondu...

Display device and method for producing same

Reduced expansion thermal compression bonding process bond head

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...

METHODS OF BONDING SEMICONDUCTOR ELEMENTS TO A SUBSTRATE, INCLUDING...

STRESS COMPENSATION FOR WAFER TO WAFER BONDING

CAP FOR PACKAGE OF INTEGRATED CIRCUIT

METHODS OF BONDING SEMICONDUCTOR ELEMENTS TO A SUBSTRATE, INCLUDING...

METHOD OF CORRECTING ESTIMATED FORCE OF BONDING APPARATUS

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE THEREOF

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE THEREOF

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

RESIN COMPOSITION, RESIN SHEET, AND PRODUCTION METHOD FOR SEMICONDU...

DISPLAY DEVICE AND METHOD FOR PRODUCING SAME