involving the use of an electron or laser beam

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CPC
H01L2021/60292

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2021/60292involving the use of an electron or laser beam

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for wafer bond monitoring
- Patent number 12,085,518
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser beam shaping for foil-based metallization of solar cells
- Patent number 11,817,512
- Issue date Nov 14, 2023
- Maxeon Solar Pte. Ltd.
- Taeseok Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for wafer bond monitoring
- Patent number 11,815,471
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser bonding apparatus for three-dimensional molded sculptures
- Patent number 11,813,688
- Issue date Nov 14, 2023
- LASERSSEL CO., LTD.
- Jae Joon Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip to chip interconnect in encapsulant of molded semiconductor pa...
- Patent number 11,569,196
- Issue date Jan 31, 2023
- Infineon Technologies AG
- Khay Chwan Saw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for wafer bond monitoring
- Patent number 11,543,363
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser beam shaping for foil-based metallization of solar cells
- Patent number 11,374,137
- Issue date Jun 28, 2022
- SunPower Corporation
- Taeseok Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mask changing unit for laser bonding apparatus
- Patent number 11,358,236
- Issue date Jun 14, 2022
- PROTEC CO., LTD.
- Geunsik Ahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip to chip interconnect in encapsulant of molded semiconductor pa...
- Patent number 11,133,281
- Issue date Sep 28, 2021
- Infineon Technologies AG
- Khay Chwan Saw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser bonding apparatus for three-dimensional molded sculptures
- Patent number 10,748,773
- Issue date Aug 18, 2020
- LASERSSEL CO., LTD.
- Jae Joon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser beam shaping for foil-based metallization of solar cells
- Patent number 10,535,785
- Issue date Jan 14, 2020
- SunPower Corporation
- Taeseok Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid exposure for semiconductor devices
- Patent number 9,543,224
- Issue date Jan 10, 2017
- Intel IP Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR WAFER BOND MONITORING
- Publication number 20240385124
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Yu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER BONDING APPARATUS FOR THREE-DIMENSIONAL MOLDED SCULPTURES
- Publication number 20240033840
- Publication date Feb 1, 2024
- LASERSSEL CO., LTD.
- Jae Joon CHOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE WITH HEATSINK AND MANUFACTURING METHOD THEREFOR
- Publication number 20230402355
- Publication date Dec 14, 2023
- NEXPERIA B.V.
- Wei Leong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20230143539
- Publication date May 11, 2023
- STMicroelectronics S.r.l
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER BEAM SHAPING FOR FOIL-BASED METALLIZATION OF SOLAR CELLS
- Publication number 20220285570
- Publication date Sep 8, 2022
- SunPower Corporation
- Taeseok Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip to Chip Interconnect in Encapsulant of Molded Semiconductor Pa...
- Publication number 20210391298
- Publication date Dec 16, 2021
- Khay Chwan Saw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR WAFER BOND MONITORING
- Publication number 20200371046
- Publication date Nov 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Yu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER BONDING APPARATUS FOR THREE-DIMENSIONAL STRUCTURES
- Publication number 20200335344
- Publication date Oct 22, 2020
- LASERSSEL CO., LTD.
- Jae Joon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER BEAM SHAPING FOR FOIL-BASED METALLIZATION OF SOLAR CELLS
- Publication number 20200091356
- Publication date Mar 19, 2020
- SunPower Corporation
- Taeseok Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

involving the use of an electron or laser beam

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for wafer bond monitoring

Laser beam shaping for foil-based metallization of solar cells

Systems and methods for wafer bond monitoring

Laser bonding apparatus for three-dimensional molded sculptures

Chip to chip interconnect in encapsulant of molded semiconductor pa...

Systems and methods for wafer bond monitoring

Laser beam shaping for foil-based metallization of solar cells

Mask changing unit for laser bonding apparatus

Chip to chip interconnect in encapsulant of molded semiconductor pa...

Laser bonding apparatus for three-dimensional molded sculptures

Laser beam shaping for foil-based metallization of solar cells

Hybrid exposure for semiconductor devices

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR WAFER BOND MONITORING

LASER BONDING APPARATUS FOR THREE-DIMENSIONAL MOLDED SCULPTURES

ELECTRONIC PACKAGE WITH HEATSINK AND MANUFACTURING METHOD THEREFOR

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

LASER BEAM SHAPING FOR FOIL-BASED METALLIZATION OF SOLAR CELLS

Chip to Chip Interconnect in Encapsulant of Molded Semiconductor Pa...

SYSTEMS AND METHODS FOR WAFER BOND MONITORING

LASER BONDING APPARATUS FOR THREE-DIMENSIONAL STRUCTURES

LASER BEAM SHAPING FOR FOIL-BASED METALLIZATION OF SOLAR CELLS