involving the use of conductive adhesives

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H01L2021/60277

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2021/60277involving the use of conductive adhesives

Industries

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Patents Grantslast 30 patents

Information Patent Grant
III-nitride-based semiconductor packaged structure and method for m...
- Patent number 12,040,259
- Issue date Jul 16, 2024
- INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
- Shangqing Qiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Profiled thermode
- Patent number 11,910,533
- Issue date Feb 20, 2024
- Pragmatic Printing Ltd
- Neil Davies
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual side cooling power module and manufacturing method of the same
- Patent number 11,862,542
- Issue date Jan 2, 2024
- Hyundai Mobis Co., Ltd.
- HanSin Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package and method of manufacturing the same
- Patent number 11,615,967
- Issue date Mar 28, 2023
- Semiconductor Components Industries, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fastening a semiconductor chip on a lead frame, and elect...
- Patent number 11,545,369
- Issue date Jan 3, 2023
- OSRAM OLED GmbH
- Mathias Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bio-inspired, highly stretchable and conductive dry adhesive patch,...
- Patent number 11,490,859
- Issue date Nov 8, 2022
- Korea Advanced Institute of Science and Technology
- Seok-woo Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual side cooling power module and manufacturing method of the same
- Patent number 11,251,112
- Issue date Feb 15, 2022
- Hyundai Mobis Co., Ltd.
- HanSin Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package structure
- Patent number 11,139,177
- Issue date Oct 5, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fastening a semiconductor chip on a lead frame, and elect...
- Patent number 11,094,559
- Issue date Aug 17, 2021
- OSRAM OLED GmbH
- Mathias Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,094,561
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar cell edge interconnects
- Patent number 11,043,606
- Issue date Jun 22, 2021
- ZHEJIANG KAIYING NEW MATERIALS CO., LTD.
- Mohamed M. Hilali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package
- Patent number 11,004,698
- Issue date May 11, 2021
- Semiconductor Components Industries, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 10,825,795
- Issue date Nov 3, 2020
- Samsung Electronics Co., Ltd.
- Yeong-Seok Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package and methods of manufacture thereof
- Patent number 10,825,747
- Issue date Nov 3, 2020
- NXP USA, INC.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar cell edge interconnects
- Patent number 10,749,061
- Issue date Aug 18, 2020
- ZHEJIANG KAIYING NEW MATERIALS CO., LTD.
- Mohamed M. Hilali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed adhesion deposition to mitigate integrated circuit package...
- Patent number 10,727,085
- Issue date Jul 28, 2020
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for semiconductor package and method of fabr...
- Patent number 10,679,866
- Issue date Jun 9, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar cell edge interconnects
- Patent number 10,622,502
- Issue date Apr 14, 2020
- Zhejiang Kaiying New Materials Co., Ltd.
- Mohamed M. Hilali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed adhesion deposition to mitigate integrated circuit delamina...
- Patent number 10,347,508
- Issue date Jul 9, 2019
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with conductive clip for mounting a semiconductor die wi...
- Patent number 10,163,762
- Issue date Dec 25, 2018
- Vishay General Semiconductor LLC
- Hui-Ying Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a power semiconductor module
- Patent number 10,096,584
- Issue date Oct 9, 2018
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,068,929
- Issue date Sep 4, 2018
- LG Display Co., Ltd.
- Sungjoon Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High heat dissipation stacked chip package structure and the manufa...
- Patent number 10,014,283
- Issue date Jul 3, 2018
- Jing Qiao Corporation Limited
- Chin-Liang Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding bare chip dies
- Patent number 9,859,247
- Issue date Jan 2, 2018
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Edsger Constant Pieter Smits
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package and methods of manufacture thereof
- Patent number 9,799,580
- Issue date Oct 24, 2017
- NXP USA, INC.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin plastic leadless package with exposed metal die paddle
- Patent number 9,691,688
- Issue date Jun 27, 2017
- CARSEM (M) SDN. BHD.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING AN INTERPOSER PRODUCT
- Publication number 20230290649
- Publication date Sep 14, 2023
- Murata Manufacturing Co., Ltd.
- Sophie GABORIEAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND ELECTRONIC APPARATUS
- Publication number 20230178442
- Publication date Jun 8, 2023
- HUAWEI TECHNOLOGIES CO., LTD.
- Zhimin DOU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
III-NITRIDE-BASED SEMICONDUCTOR PACKAGED STRUCTURE AND METHOD FOR M...
- Publication number 20230036009
- Publication date Feb 2, 2023
- INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
- Shangqing QIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROFILED THERMODE
- Publication number 20210307225
- Publication date Sep 30, 2021
- PRAGMATIC PRINTING LTD.
- Neil DAVIES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLAR CELL EDGE INTERCONNECTS
- Publication number 20200373447
- Publication date Nov 26, 2020
- ZHEJIANG KAIYING NEW MATERIALS CO., LTD.
- MOHAMED M. HILALI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIO-INSPIRED, HIGHLY STRETCHABLE AND CONDUCTIVE DRY ADHESIVE PATCH,...
- Publication number 20200337640
- Publication date Oct 29, 2020
- Korea Advanced Institute of Science and Technology
- Seok-woo Jeon
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20200303214
- Publication date Sep 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20200303213
- Publication date Sep 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDE COOLING POWER MODULE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20200185310
- Publication date Jun 11, 2020
- Hyundai Autron Co., Ltd.
- HanSin CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20200144222
- Publication date May 7, 2020
- Samsung Electronics Co., Ltd.
- Yeong-Seok KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE THEREOF
- Publication number 20180012815
- Publication date Jan 11, 2018
- NXP USA, Inc.
- LI LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED ADHESION DEPOSITION TO MITIGATE INTEGRATED CIRCUIT DELAMINA...
- Publication number 20170271174
- Publication date Sep 21, 2017
- TEXAS INSTRUMENTS INCORPORATED
- YONG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED ADHESION DEPOSITION TO MITIGATE INTEGRATED CIRCUIT DELAMINA...
- Publication number 20170194170
- Publication date Jul 6, 2017
- TEXAS INSTRUMENTS INCORPORATED
- YONG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170062317
- Publication date Mar 2, 2017
- Hyundai Motor Company
- Jeong-Min Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF FABR...
- Publication number 20160240451
- Publication date Aug 18, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20160064312
- Publication date Mar 3, 2016
- Renesas Electronics Corporation
- Koji Bando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN PLASTIC LEADLESS PACKAGE WITH EXPOSED METAL DIE PADDLE
- Publication number 20160049357
- Publication date Feb 18, 2016
- Carsem (M) Sdn.Bhd.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING BARE CHIP DIES
- Publication number 20150294951
- Publication date Oct 15, 2015
- NEDERLANDSE ORGANISATIE VOORTOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Edsger Constant Pieter Smits
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin Plastic Leadless Package with Exposed Metal Die Paddle
- Publication number 20090026594
- Publication date Jan 29, 2009
- Carsem (M) Sdn.Bhd.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS

involving the use of conductive adhesives

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

III-nitride-based semiconductor packaged structure and method for m...

Profiled thermode

Dual side cooling power module and manufacturing method of the same

Power module package and method of manufacturing the same

Method of fastening a semiconductor chip on a lead frame, and elect...

Bio-inspired, highly stretchable and conductive dry adhesive patch,...

Dual side cooling power module and manufacturing method of the same

Method of fabricating semiconductor package structure

Method of fastening a semiconductor chip on a lead frame, and elect...

Semiconductor package structure

Solar cell edge interconnects

Power module package

Method of manufacturing semiconductor devices

Semiconductor device package and methods of manufacture thereof

Solar cell edge interconnects

Printed adhesion deposition to mitigate integrated circuit package...

Interconnect structure for semiconductor package and method of fabr...

Solar cell edge interconnects

Printed adhesion deposition to mitigate integrated circuit delamina...

Lead frame with conductive clip for mounting a semiconductor die wi...

Method for producing a power semiconductor module

Display device

High heat dissipation stacked chip package structure and the manufa...

Method for bonding bare chip dies

Semiconductor device package and methods of manufacture thereof

Thin plastic leadless package with exposed metal die paddle

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING AN INTERPOSER PRODUCT

PACKAGE STRUCTURE AND ELECTRONIC APPARATUS

III-NITRIDE-BASED SEMICONDUCTOR PACKAGED STRUCTURE AND METHOD FOR M...

PROFILED THERMODE

SOLAR CELL EDGE INTERCONNECTS

BIO-INSPIRED, HIGHLY STRETCHABLE AND CONDUCTIVE DRY ADHESIVE PATCH,...

SEMICONDUCTOR PACKAGE STRUCTURE

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE STRUCTURE

DUAL SIDE COOLING POWER MODULE AND MANUFACTURING METHOD OF THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE THEREOF

PRINTED ADHESION DEPOSITION TO MITIGATE INTEGRATED CIRCUIT DELAMINA...

PRINTED ADHESION DEPOSITION TO MITIGATE INTEGRATED CIRCUIT DELAMINA...

POWER SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME

INTERCONNECT STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF FABR...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

THIN PLASTIC LEADLESS PACKAGE WITH EXPOSED METAL DIE PADDLE

METHOD FOR BONDING BARE CHIP DIES

Thin Plastic Leadless Package with Exposed Metal Die Paddle