Isostatic pressure

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H01L2021/60187

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

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H01L2021/60187Isostatic pressure

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for treating substrate
- Patent number 10,714,352
- Issue date Jul 14, 2020
- Semes Co., Ltd.
- Min Jung Park
- F26 - DRYING
Information Patent Grant
Bonding device for chip on film and display panel and bonding metho...
- Patent number 10,395,945
- Issue date Aug 27, 2019
- BOE Technology Group Co., Ltd.
- Lili Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR TREATING SUBSTRATE
- Publication number 20180061649
- Publication date Mar 1, 2018
- SEMES CO., LTD.
- MIN JUNG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE FOR CHIP ON FILM AND DISPLAY PANEL AND BONDING METHO...
- Publication number 20180053664
- Publication date Feb 22, 2018
- BOE TECHNOLOGY GROUP CO., LTD.
- Lili Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR