laminating inorganic sheets comprising printed circuits

Industry

CPC
H05K3/4629

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4629laminating inorganic sheets comprising printed circuits

Industries

Patents Grantslast 30 patents

Information Patent Grant
Devices and methods related to metallization of ceramic substrates...
- Patent number 12,058,806
- Issue date Aug 6, 2024
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing ceramic substrate and ceramic substrate
- Patent number 11,950,360
- Issue date Apr 2, 2024
- Murata Manufacturing Co., Ltd.
- Koki Sai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 11,930,601
- Issue date Mar 12, 2024
- Ibiden Co., Ltd.
- Yuji Kadowaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated electronic component
- Patent number 11,887,764
- Issue date Jan 30, 2024
- Murata Manufacturing Co., Ltd.
- Yutaka Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,688,540
- Issue date Jun 27, 2023
- Murata Manufacturing Co., Ltd.
- Kouhei Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rapid implementation of high-temperature analog interface electronics
- Patent number 11,647,582
- Issue date May 9, 2023
- Ian Getreu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a glass substrate with a plurality of vias
- Patent number 11,646,246
- Issue date May 9, 2023
- Samtec, Inc.
- Tim Mobley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,587,711
- Issue date Feb 21, 2023
- Murata Manufacturing Co., Ltd.
- Shimpei Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board and probe card including same
- Patent number 11,497,126
- Issue date Nov 8, 2022
- POINT ENGINEERING CO., LTD.
- Bum Mo Ahn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic-circuit composite structure and method for making the same
- Patent number 11,462,430
- Issue date Oct 4, 2022
- HONG CHUANG APPLIED TECHNOLOGY CO., LTD
- Yan-Kai Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic wiring board and method for producing the same
- Patent number 11,350,523
- Issue date May 31, 2022
- Murata Manufacturing Co., Ltd.
- Takahiro Sumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip with patterned underbump metallization and polym...
- Patent number 11,335,659
- Issue date May 17, 2022
- ATI Technologies ULC
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods related to metallization of ceramic substrates for shieldin...
- Patent number 11,277,901
- Issue date Mar 15, 2022
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filling materials and methods of filling through holes of a substrate
- Patent number 11,251,109
- Issue date Feb 15, 2022
- Samtec, Inc.
- Tim Mobley
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Ceramic electronic component
- Patent number 11,230,499
- Issue date Jan 25, 2022
- Murata Manufacturing Co., Ltd.
- Takahiro Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supporting substrate, supporting substrate-attached laminate and me...
- Patent number 11,217,445
- Issue date Jan 4, 2022
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and method for manufacturing power module
- Patent number 11,114,355
- Issue date Sep 7, 2021
- Murata Manufacturing Co., Ltd.
- Takahiro Hayakawa
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Composite ceramic multilayer substrate, heat generating element-mou...
- Patent number 11,107,741
- Issue date Aug 31, 2021
- Murata Manufacturing Co., Ltd.
- Tomoki Kato
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Ceramic electronic component
- Patent number 11,051,398
- Issue date Jun 29, 2021
- Murata Manufacturing Co., Ltd.
- Yosuke Matsushita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for producing ceramic substrates and module components
- Patent number 11,019,727
- Issue date May 25, 2021
- Murata Manufacturing Co., Ltd.
- Masashi Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated electronic component
- Patent number 11,011,291
- Issue date May 18, 2021
- Murata Manufacturing Co., Ltd.
- Yutaka Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic substrate and electronic device
- Patent number 11,011,441
- Issue date May 18, 2021
- Murata Manufacturing Co., Ltd.
- Seiji Fujita
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for providing hermetic electrical feedthrough
- Patent number 10,952,332
- Issue date Mar 16, 2021
- Second Sight Medical Products, Inc.
- Jerry Ok
- B32 - LAYERED PRODUCTS
Information Patent Grant
Laminated electronic component
- Patent number 10,937,583
- Issue date Mar 2, 2021
- Murata Manufacturing Co., Ltd.
- Yutaka Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and production method therefor
- Patent number 10,785,879
- Issue date Sep 22, 2020
- NGK Spark Plug Co., Ltd.
- Tatsuya Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency component
- Patent number 10,770,223
- Issue date Sep 8, 2020
- Murata Manufacturing Co., Ltd.
- Issei Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic circuit plate and method of making same
- Patent number 10,757,806
- Issue date Aug 25, 2020
- Meng-Hsiu Hsieh
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Ceramic substrate component/assembly with raised thermal metal pad,...
- Patent number 10,743,411
- Issue date Aug 11, 2020
- ICP Technology Co., Ltd.
- Ho-Chieh Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Devices and methods related to metallization of ceramic substrates...
- Patent number 10,729,001
- Issue date Jul 28, 2020
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing laminated electronic component
- Patent number 10,707,016
- Issue date Jul 7, 2020
- Murata Manufacturing Co., Ltd.
- Yutaka Noguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CERAMIC SUBSTRATE, JOINED BODY, SEMICONDUCTOR DEVICE, METHOD FOR MA...
- Publication number 20240324105
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Kentaro IWAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM...
- Publication number 20240188228
- Publication date Jun 6, 2024
- IBIDEN CO., LTD.
- Yuji KADOWAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR PRODUCING ELECTRONIC COMPONENT
- Publication number 20230282406
- Publication date Sep 7, 2023
- Murata Manufacturing Co., Ltd.
- Kouhei MATSUURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT
- Publication number 20230209727
- Publication date Jun 29, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Chang Ho SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20230122767
- Publication date Apr 20, 2023
- MURATA MANUFACTURING CO., LTD.
- Ikuo DEGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20230119828
- Publication date Apr 20, 2023
- MURATA MANUFACTURING CO., LTD.
- Hirofumi OIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20230113966
- Publication date Apr 13, 2023
- MURATA MANUFACTURING CO., LTD.
- Toru YASO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LTCC ELECTRONIC DEVICE UNIT STRUCTURE
- Publication number 20220367363
- Publication date Nov 17, 2022
- ONANO INDUSTRIAL CORP.
- Chun-Hsia Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM...
- Publication number 20220304166
- Publication date Sep 22, 2022
- IBIDEN CO., LTD.
- Yuji KADOWAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20220141962
- Publication date May 5, 2022
- MONTAGE TECHNOLOGY (KUNSHAN) CO., LTD.
- Meng MEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE
- Publication number 20220059436
- Publication date Feb 24, 2022
- SAMTEC, INC.
- Tim Mobley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CERAMIC SUBSTRATE AND CERAMIC SUBSTRATE
- Publication number 20210360777
- Publication date Nov 18, 2021
- Murata Manufacturing Co., Ltd.
- Koki Sai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUPPORTING SUBSTRATE, SUPPORTING SUBSTRATE-ATTACHED LAMINATE AND ME...
- Publication number 20210257207
- Publication date Aug 19, 2021
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED ELECTRONIC COMPONENT
- Publication number 20210174997
- Publication date Jun 10, 2021
- Murata Manufacturing Co., Ltd.
- Yutaka NOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING BOARD AND PROBE CARD INCLUDING SAME
- Publication number 20210136927
- Publication date May 6, 2021
- POINT ENGINEERING CO., LTD.
- Bum Mo AHN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREPREG, LAMINATE, AND PRODUCTION METHODS THEREFOR, AS WELL AS PRIN...
- Publication number 20200404783
- Publication date Dec 24, 2020
- Hitachi Chemical Company, Ltd.
- Mari SHIMIZU
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CERAMIC SUBSTRATE
- Publication number 20200296828
- Publication date Sep 17, 2020
- Hitachi Metals, Ltd.
- Hisashi TANIE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC-CIRCUIT COMPOSITE STRUCTURE AND METHOD FOR MAKING THE SAME
- Publication number 20200294837
- Publication date Sep 17, 2020
- Hong Chuang Applied Technology Co., Ltd
- Yan-Kai ZENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ceramic Substrate Component/Assembly with Raised Thermal Metal Pad,...
- Publication number 20200245456
- Publication date Jul 30, 2020
- ICP Technology Co., Ltd.
- Ho-Chieh Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR PRODUCING ELECTRONIC COMPONENT
- Publication number 20200152365
- Publication date May 14, 2020
- Murata Manufacturing Co., Ltd.
- Kouhei MATSUURA
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURIN...
- Publication number 20200126729
- Publication date Apr 23, 2020
- Murata Manufacturing Co., Ltd.
- Miyuki MIZUKAMI
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
CERAMIC CIRCUIT PLATE AND METHOD OF MAKING SAME
- Publication number 20200107438
- Publication date Apr 2, 2020
- MENG-HSIU HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF A MULTI-LAYER CIRCUIT BOARD
- Publication number 20200053884
- Publication date Feb 13, 2020
- WINBOND ELECTRONICS CORP.
- Yu-Ming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE CERAMIC MULTILAYER SUBSTRATE, HEAT GENERATING ELEMENT-MOU...
- Publication number 20190371689
- Publication date Dec 5, 2019
- Murata Manufacturing Co., Ltd.
- Tomoki KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20190311832
- Publication date Oct 10, 2019
- Murata Manufacturing Co., Ltd.
- Shimpei TANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Providing Hermetic Electrical Feedthrough
- Publication number 20190313537
- Publication date Oct 10, 2019
- Second Sight Medical Products, Inc.
- Jerry Ok
- B32 - LAYERED PRODUCTS
Information Patent Application
MULTILAYER CERAMIC SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20190295911
- Publication date Sep 26, 2019
- Murata Manufacturing Co., Ltd.
- SEIJI FUJITA
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
CERAMIC CIRCUIT PLATE AND METHOD OF MAKING SAME
- Publication number 20190239346
- Publication date Aug 1, 2019
- MENG-HSIU HSIEH
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Ceramic- based Fan - Out Wafer Level Packaging
- Publication number 20190229026
- Publication date Jul 25, 2019
- Ananda H. Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORTING SUBSTRATE, SUPPORTING SUBSTRATE-ATTACHED LAMINATE AND ME...
- Publication number 20190181000
- Publication date Jun 13, 2019
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke HIRANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

laminating inorganic sheets comprising printed circuits

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Devices and methods related to metallization of ceramic substrates...

Method for manufacturing ceramic substrate and ceramic substrate

Method for manufacturing printed wiring board

Laminated electronic component

Electronic component

Rapid implementation of high-temperature analog interface electronics

Method of fabricating a glass substrate with a plurality of vias

Electronic component

Multilayer wiring board and probe card including same

Ceramic-circuit composite structure and method for making the same

Ceramic wiring board and method for producing the same

Semiconductor chip with patterned underbump metallization and polym...

Methods related to metallization of ceramic substrates for shieldin...

Filling materials and methods of filling through holes of a substrate

Ceramic electronic component

Supporting substrate, supporting substrate-attached laminate and me...

Power module and method for manufacturing power module

Composite ceramic multilayer substrate, heat generating element-mou...

Ceramic electronic component

Methods for producing ceramic substrates and module components

Laminated electronic component

Multilayer ceramic substrate and electronic device

Method for providing hermetic electrical feedthrough

Laminated electronic component

Circuit board and production method therefor

High frequency component

Ceramic circuit plate and method of making same

Ceramic substrate component/assembly with raised thermal metal pad,...

Devices and methods related to metallization of ceramic substrates...

Method of manufacturing laminated electronic component

Patents Applicationslast 30 patents

CERAMIC SUBSTRATE, JOINED BODY, SEMICONDUCTOR DEVICE, METHOD FOR MA...

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM...

ELECTRONIC COMPONENT AND METHOD FOR PRODUCING ELECTRONIC COMPONENT

METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT

ELECTRONIC COMPONENT

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

LTCC ELECTRONIC DEVICE UNIT STRUCTURE

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM...

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE

METHOD FOR MANUFACTURING CERAMIC SUBSTRATE AND CERAMIC SUBSTRATE

SUPPORTING SUBSTRATE, SUPPORTING SUBSTRATE-ATTACHED LAMINATE AND ME...

LAMINATED ELECTRONIC COMPONENT

MULTILAYER WIRING BOARD AND PROBE CARD INCLUDING SAME

PREPREG, LAMINATE, AND PRODUCTION METHODS THEREFOR, AS WELL AS PRIN...

CERAMIC SUBSTRATE

CERAMIC-CIRCUIT COMPOSITE STRUCTURE AND METHOD FOR MAKING THE SAME

Ceramic Substrate Component/Assembly with Raised Thermal Metal Pad,...

ELECTRONIC COMPONENT AND METHOD FOR PRODUCING ELECTRONIC COMPONENT

MULTILAYER CERAMIC ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURIN...

CERAMIC CIRCUIT PLATE AND METHOD OF MAKING SAME

MANUFACTURING METHOD OF A MULTI-LAYER CIRCUIT BOARD

COMPOSITE CERAMIC MULTILAYER SUBSTRATE, HEAT GENERATING ELEMENT-MOU...

ELECTRONIC COMPONENT

Method for Providing Hermetic Electrical Feedthrough

MULTILAYER CERAMIC SUBSTRATE AND ELECTRONIC DEVICE

CERAMIC CIRCUIT PLATE AND METHOD OF MAKING SAME

Ceramic- based Fan - Out Wafer Level Packaging

SUPPORTING SUBSTRATE, SUPPORTING SUBSTRATE-ATTACHED LAMINATE AND ME...