Laminating printed circuit boards onto other substrates

Industry

CPC
H05K3/0058

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/0058Laminating printed circuit boards onto other substrates

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing microelectrode film
- Patent number 12,063,749
- Issue date Aug 13, 2024
- BOE Technology Group Co., Ltd.
- Fan Li
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,979,982
- Issue date May 7, 2024
- TANAZAWA HAKKOSHA CO., LTD.
- Keiichiro Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 11,917,757
- Issue date Feb 27, 2024
- Murata Manufacturing Co., Ltd.
- Hiroki Maegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a computer device
- Patent number 11,889,615
- Issue date Jan 30, 2024
- Graphcore Limited
- Stephen Felix
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with low shrinkage dielectric material
- Patent number 11,688,668
- Issue date Jun 27, 2023
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lightweight conformal phased array antenna using aerogel substrate
- Patent number 11,658,398
- Issue date May 23, 2023
- United States of America as represented by the Administrator of National Aero...
- James M. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and control device for laminating display panel as well as v...
- Patent number 11,604,372
- Issue date Mar 14, 2023
- HKC CORPORATION LIMITED
- Xin Chen
- G02 - OPTICS
Information Patent Grant
Method for manufacturing wiring board or wiring board material
- Patent number 11,490,522
- Issue date Nov 1, 2022
- Daiwa Co., Ltd.
- Yoshimura Eiji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support, adhesive sheet, laminated structure, semiconductor device,...
- Patent number 11,482,437
- Issue date Oct 25, 2022
- Ajinomoto Co., Inc.
- Masanori Ohkoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive transfer
- Patent number 11,457,868
- Issue date Oct 4, 2022
- CONDUCTIVE TRANSFERS LIMITED
- Paul Timothy Brook
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Processing method and processing system of a flexible substrate
- Patent number 11,430,351
- Issue date Aug 30, 2022
- BOE Technology Group Co., Ltd.
- Weiyun Huang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Adhering jig and adhering method
- Patent number 11,420,431
- Issue date Aug 23, 2022
- Nichia Corporation
- Yumiko Kameshima
- B32 - LAYERED PRODUCTS
Information Patent Grant
Substrate structures and methods of manufacture
- Patent number 11,419,217
- Issue date Aug 16, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated flexible printed circuit with routing channel/aid
- Patent number 11,412,619
- Issue date Aug 9, 2022
- Aptiv Technologies Limited
- David R. Peterson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for manufacturing a plurality of electronic circuits
- Patent number 11,406,023
- Issue date Aug 2, 2022
- Pragmatic Printing Ltd
- Richard Price
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing flex circuits with mechanically formed con...
- Patent number 11,297,718
- Issue date Apr 5, 2022
- Gentherm GmbH
- Michael Peter Ciaccio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fitting structure for conductive sheet and electronic device
- Patent number 11,071,209
- Issue date Jul 20, 2021
- NEC Platforms, Ltd.
- Manabu Hayahi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module with compression-molded circuit board and manufacturi...
- Patent number 11,051,400
- Issue date Jun 29, 2021
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- G02 - OPTICS
Information Patent Grant
Wearable electronics formed on intermediate layer on textiles
- Patent number 11,019,728
- Issue date May 25, 2021
- King Abdullah University of Science and Technology
- Muhammad Mustafa Hussain
- D03 - WEAVING
Information Patent Grant
Methods for producing laminate and substrate for mounting a semicon...
- Patent number 10,964,552
- Issue date Mar 30, 2021
- Mitsubishi Gas Chemical Company, Inc.
- Yoshihiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,879,227
- Issue date Dec 29, 2020
- Renesas Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive member, circuit assembly, and method for manufacturing c...
- Patent number 10,842,015
- Issue date Nov 17, 2020
- Autonetworks Technologies, Ltd.
- Yukinori Kita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement for actively suppressing interference signals
- Patent number 10,840,801
- Issue date Nov 17, 2020
- HANON SYSTEMS
- Stephan Werker
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Thermal ground planes and light-emitting diodes
- Patent number 10,840,425
- Issue date Nov 17, 2020
- ROCCOR, LLC
- William Francis
- F21 - LIGHTING
Information Patent Grant
Control unit
- Patent number 10,829,048
- Issue date Nov 10, 2020
- Jaguar Land Rover Limited
- Ashutosh Tomar
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Locking device with configurable electrical connector key and inter...
- Patent number 10,829,959
- Issue date Nov 10, 2020
- Sargent Manufacturing Company
- Scott B. Lowder
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Grant
Magnetic sheet, module comprising same, and portable device compris...
- Patent number 10,784,030
- Issue date Sep 22, 2020
- Amogreentech Co., Ltd.
- Jin Hyoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for affixing a frequency selective surface to...
- Patent number 10,764,993
- Issue date Sep 1, 2020
- Walter S. Wall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuits and methods therefor
- Patent number 10,716,341
- Issue date Jul 21, 2020
- LOOMIA Technologies, Inc.
- Madison Thea Maxey
- A41 - WEARING APPAREL
Information Patent Grant
Circuit board, circuit board assembly and liquid crystal display de...
- Patent number 10,634,964
- Issue date Apr 28, 2020
- BOE Technology Group Co., Ltd.
- Jian Xu
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD FOR SEMICONDUCTOR TESTING AND METHOD OF MANUFACTURING...
- Publication number 20240264219
- Publication date Aug 8, 2024
- MPI Corporation
- SHIH-CHING CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20240244744
- Publication date Jul 18, 2024
- TANAZAWA HAKKOSHA CO., LTD.
- Keiichiro YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE WITH CONDUCTIVE PATTERN ATTACHED...
- Publication number 20240147627
- Publication date May 2, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Tomohiro FUKAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING STRETCHABLE CIRCUIT BOARD, METAL-CLAD LAMI...
- Publication number 20240147609
- Publication date May 2, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Tomohiro FUKAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20240130035
- Publication date Apr 18, 2024
- FUJIFILM CORPORATION
- Yota AKASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240121889
- Publication date Apr 11, 2024
- Innolux Corporation
- Chi-Liang Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY PANEL AND METHOD FOR ASSEMBLING SAME AND SPLICED DISPLAY DE...
- Publication number 20240023247
- Publication date Jan 18, 2024
- Shenzhen china Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Kanmeng WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inlay With Exposed Porous Layer, Component Carrier and Manufacturin...
- Publication number 20230309236
- Publication date Sep 28, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Stefanie Paller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230275005
- Publication date Aug 31, 2023
- Mitsubishi Electric Corporation
- Shogo TOKUMARU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20230026493
- Publication date Jan 26, 2023
- TANAZAWA HAKKOSHA CO., LTD.
- Keiichiro YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER MATERIAL WITH ONE OR MORE EMBEDDED FUNCTIONAL LAYERS
- Publication number 20220330425
- Publication date Oct 13, 2022
- Uvex Safety Gloves GmbH & Co., KG
- Markus Burghart
- A41 - WEARING APPAREL
Information Patent Application
PHOTOVOLTAIC MODULE WITH A LAMINATED POTTED PRINTED CIRCUIT BOARD
- Publication number 20220302329
- Publication date Sep 22, 2022
- GAF Energy LLC
- Dawei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods Of Manufacturing Flex Circuits With Mechanically Formed Con...
- Publication number 20220232706
- Publication date Jul 21, 2022
- GENTHERM GMBH
- Michael Peter CIACCIO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE TRANSFER
- Publication number 20220202363
- Publication date Jun 30, 2022
- CONDUCTIVE TRANSFERS LIMITED
- Paul Timothy BROOK
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
CIRCUIT BOARD
- Publication number 20220030712
- Publication date Jan 27, 2022
- Murata Manufacturing Co., Ltd.
- Hiroki MAEGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of Manufacturing Flex Circuits With Mechanically Formed Con...
- Publication number 20210410290
- Publication date Dec 30, 2021
- GENTHERM GMBH
- Michael Peter CIACCIO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MICROELECTRODE FILM
- Publication number 20210315105
- Publication date Oct 7, 2021
- BOE TECHNOLOGY GROUP CO., LTD.
- Fan LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED FLEXIBLE PRINTED CIRCUIT WITH ROUTING CHANNEL/AID
- Publication number 20210227694
- Publication date Jul 22, 2021
- Aptiv Technologies Limited
- David R. Peterson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Low Shrinkage Dielectric Material
- Publication number 20210202355
- Publication date Jul 1, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD OR WIRING BOARD MATERIAL
- Publication number 20210195755
- Publication date Jun 24, 2021
- DAIWA CO., LTD.
- YOSHIMURA Eiji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FITTING STRUCTURE FOR CONDUCTIVE SHEET AND ELECTRONIC DEVICE
- Publication number 20210168940
- Publication date Jun 3, 2021
- NEC PLATFORMS, LTD.
- Manabu HAYAHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHERING JIG AND ADHERING METHOD
- Publication number 20210154987
- Publication date May 27, 2021
- Nichia Corporation.
- Yumiko KAMESHIMA
- B32 - LAYERED PRODUCTS
Information Patent Application
FLEXIBLE PRESSURE SENSORS AND USER INTERFACES, AND METHODS THEREFOR
- Publication number 20200329787
- Publication date Oct 22, 2020
- LOOMIA Technologies, Inc.
- Madison Thea Maxey
- A41 - WEARING APPAREL
Information Patent Application
METHOD FOR FORMING LAMINATED STRUCTURE OF TOUCH PANEL
- Publication number 20200337155
- Publication date Oct 22, 2020
- INTERFACE TECHNOLOGY (CHENGDU) CO., LTD.
- Han Lung TSAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS AND APPARATUS FOR MANUFACTURING A PLURALITY OF ELECTRONIC C...
- Publication number 20200214143
- Publication date Jul 2, 2020
- Pragmatic Printing Ltd.
- Richard PRICE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND CONTROL DEVICE FOR LAMINATING DISPLAY PANEL AS WELL AS V...
- Publication number 20200159049
- Publication date May 21, 2020
- HKC Corporation Limited
- Xin Chen
- G02 - OPTICS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20200118994
- Publication date Apr 16, 2020
- RENESAS ELECTRONICS CORPORATION
- Yoichiro KURITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SWIRL INTERCONNECTION IN A FLEXIBLE CIRCUIT
- Publication number 20200006205
- Publication date Jan 2, 2020
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Gerardus Titus VAN HECK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WEARABLE ELECTRONICS FORMED ON INTERMEDIATE LAYER ON TEXTILES
- Publication number 20190394881
- Publication date Dec 26, 2019
- King Abdullah University of Science and Technology
- Muhammad Mustafa HUSSAIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROL UNIT
- Publication number 20190217781
- Publication date Jul 18, 2019
- Jaguar Land Rover Limited
- Ashutosh TOMAR
- B60 - VEHICLES IN GENERAL

Laminating printed circuit boards onto other substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing microelectrode film

Printed wiring board and method for manufacturing printed wiring board

Circuit board

Method of manufacturing a computer device

Component carrier with low shrinkage dielectric material

Lightweight conformal phased array antenna using aerogel substrate

Method and control device for laminating display panel as well as v...

Method for manufacturing wiring board or wiring board material

Support, adhesive sheet, laminated structure, semiconductor device,...

Conductive transfer

Processing method and processing system of a flexible substrate

Adhering jig and adhering method

Substrate structures and methods of manufacture

Integrated flexible printed circuit with routing channel/aid

Methods for manufacturing a plurality of electronic circuits

Methods of manufacturing flex circuits with mechanically formed con...

Fitting structure for conductive sheet and electronic device

Camera module with compression-molded circuit board and manufacturi...

Wearable electronics formed on intermediate layer on textiles

Methods for producing laminate and substrate for mounting a semicon...

Electronic device

Conductive member, circuit assembly, and method for manufacturing c...

Arrangement for actively suppressing interference signals

Thermal ground planes and light-emitting diodes

Control unit

Locking device with configurable electrical connector key and inter...

Magnetic sheet, module comprising same, and portable device compris...

Method and apparatus for affixing a frequency selective surface to...

Flexible circuits and methods therefor

Circuit board, circuit board assembly and liquid crystal display de...

Patents Applicationslast 30 patents

CIRCUIT BOARD FOR SEMICONDUCTOR TESTING AND METHOD OF MANUFACTURING...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

METHOD FOR MANUFACTURING SUBSTRATE WITH CONDUCTIVE PATTERN ATTACHED...

METHOD FOR MANUFACTURING STRETCHABLE CIRCUIT BOARD, METAL-CLAD LAMI...

ELECTRONIC APPARATUS

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

DISPLAY PANEL AND METHOD FOR ASSEMBLING SAME AND SPLICED DISPLAY DE...

Inlay With Exposed Porous Layer, Component Carrier and Manufacturin...

SEMICONDUCTOR DEVICE

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

MULTI-LAYER MATERIAL WITH ONE OR MORE EMBEDDED FUNCTIONAL LAYERS

PHOTOVOLTAIC MODULE WITH A LAMINATED POTTED PRINTED CIRCUIT BOARD

Methods Of Manufacturing Flex Circuits With Mechanically Formed Con...

CONDUCTIVE TRANSFER

CIRCUIT BOARD

Methods of Manufacturing Flex Circuits With Mechanically Formed Con...

METHOD FOR MANUFACTURING MICROELECTRODE FILM

INTEGRATED FLEXIBLE PRINTED CIRCUIT WITH ROUTING CHANNEL/AID

Component Carrier With Low Shrinkage Dielectric Material

METHOD FOR MANUFACTURING WIRING BOARD OR WIRING BOARD MATERIAL

FITTING STRUCTURE FOR CONDUCTIVE SHEET AND ELECTRONIC DEVICE

ADHERING JIG AND ADHERING METHOD

FLEXIBLE PRESSURE SENSORS AND USER INTERFACES, AND METHODS THEREFOR

METHOD FOR FORMING LAMINATED STRUCTURE OF TOUCH PANEL

METHODS AND APPARATUS FOR MANUFACTURING A PLURALITY OF ELECTRONIC C...

METHOD AND CONTROL DEVICE FOR LAMINATING DISPLAY PANEL AS WELL AS V...

ELECTRONIC DEVICE

SWIRL INTERCONNECTION IN A FLEXIBLE CIRCUIT

WEARABLE ELECTRONICS FORMED ON INTERMEDIATE LAYER ON TEXTILES

CONTROL UNIT