Lapping tools

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CPC
B24B37/11

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B37/00Lapping machines or devices Accessories

Current Industry

B24B37/11Lapping tools

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Atmospheric plasma in wafer processing system optimization
- Patent number 12,198,935
- Issue date Jan 14, 2025
- Axus Technology, LLC
- Daniel Ray Trojan
- B24 - GRINDING POLISHING
Information Patent Grant
Roller for location-specific wafer polishing
- Patent number 12,194,591
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Ekaterina A. Mikhaylichenko
- B24 - GRINDING POLISHING
Information Patent Grant
Methods of forming an adhesive layer, and related adhesive films an...
- Patent number 12,157,847
- Issue date Dec 3, 2024
- Seagate Technology LLC
- Zubair Ahmed Khan
- B24 - GRINDING POLISHING
Information Patent Grant
Roller for location-specific wafer polishing
- Patent number 12,138,733
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Ekaterina A. Mikhaylichenko
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing platens and polishing platen manufacturing methods
- Patent number 12,076,877
- Issue date Sep 3, 2024
- Applied Materials, Inc.
- Bum Jick Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chemical mechanical polishing apparatus for controlling polishing u...
- Patent number 11,676,824
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- In-kwon Kim
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing silicon substrate and polishing composition set
- Patent number 11,648,641
- Issue date May 16, 2023
- FUJIMI INCORPORATED
- Makoto Tabata
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Substrate adsorption method, substrate holding apparatus, substrate...
- Patent number 11,472,000
- Issue date Oct 18, 2022
- Ebara Corporation
- Hiroyuki Shinozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing apparatus and methods
- Patent number 11,453,097
- Issue date Sep 27, 2022
- Applied Materials, Inc.
- Rajeev Bajaj
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate cleaning apparatus, substrate cleaning method, and substr...
- Patent number 11,285,517
- Issue date Mar 29, 2022
- Ebara Corporation
- Hideaki Tanaka
- B08 - CLEANING
Information Patent Grant
Wafer grinding apparatus and wafer grinding method
- Patent number 11,101,150
- Issue date Aug 24, 2021
- Mitsubishi Electric Corporation
- Naoyuki Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing pad having arc-shaped configuration
- Patent number 11,072,049
- Issue date Jul 27, 2021
- Applied Materials, Inc.
- Hung Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flattening method and flattening apparatus
- Patent number 10,916,455
- Issue date Feb 9, 2021
- Ebara Corporation
- Kazuto Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Abrasives, polishing composition, and polishing method
- Patent number 10,669,462
- Issue date Jun 2, 2020
- Fujimi Incorporated
- Eiichi Yamada
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for nanolapping
- Patent number 10,610,995
- Issue date Apr 7, 2020
- Victor B. Kley
- G01 - MEASURING TESTING
Information Patent Grant
Substrate cleaning apparatus, substrate cleaning method, and substr...
- Patent number 10,562,076
- Issue date Feb 18, 2020
- Ebara Corporation
- Hideaki Tanaka
- B08 - CLEANING
Information Patent Grant
Substrate adsorption method, substrate holding apparatus, substrate...
- Patent number 10,537,975
- Issue date Jan 21, 2020
- Ebara Corporation
- Hiroyuki Shinozaki
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing tool and polishing method for member having curved surfac...
- Patent number 10,434,622
- Issue date Oct 8, 2019
- Fujimi Incorporated
- Yutaka Niwano
- B24 - GRINDING POLISHING
Information Patent Grant
Molds and methods to control mold surface quality
- Patent number 10,351,459
- Issue date Jul 16, 2019
- Corning Incorporated
- Yi-Chun Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Flattening method and flattening apparatus
- Patent number 10,297,475
- Issue date May 21, 2019
- Ebara Corporation
- Kazuto Yamauchi
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad configuration and chemical mechanical polishing system
- Patent number 10,207,389
- Issue date Feb 19, 2019
- Applied Materials, Inc.
- Hung Chih Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Automated polishing system and method
- Patent number 10,144,108
- Issue date Dec 4, 2018
- Guangdong Institute of Intelligent Manufacturing
- Xuefeng Zhou
- B24 - GRINDING POLISHING
Information Patent Grant
Buffing apparatus and substrate processing apparatus
- Patent number 10,131,030
- Issue date Nov 20, 2018
- Ebara Corporation
- Kuniaki Yamaguchi
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad configuration and polishing pad support
- Patent number 10,105,812
- Issue date Oct 23, 2018
- Applied Materials, Inc.
- Hung Chih Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing liquid and method of polishing SiC substrate
- Patent number 9,994,739
- Issue date Jun 12, 2018
- Disco Corporation
- Katsuyoshi Kojima
- B24 - GRINDING POLISHING
Information Patent Grant
Systems and methods for performing chemical mechanical planarization
- Patent number 9,962,801
- Issue date May 8, 2018
- Taiwan Semiconductor Manufacturing Company Limited
- Shen-Nan Lee
- B24 - GRINDING POLISHING
Information Patent Grant
Processing apparatus and processing method
- Patent number 9,865,470
- Issue date Jan 9, 2018
- Panasonic Corporation
- Yoshifumi Takasu
- B24 - GRINDING POLISHING
Information Patent Grant
Bore finishing tool
- Patent number 9,789,581
- Issue date Oct 17, 2017
- Sunnen Products Company
- Daniel R. Cloutier
- B24 - GRINDING POLISHING
Information Patent Grant
Configurable pressure design for multizone chemical mechanical plan...
- Patent number 9,610,672
- Issue date Apr 4, 2017
- Applied Materials, Inc.
- Jeonghoon Oh
- B24 - GRINDING POLISHING
Information Patent Grant
Nickel phosphorous CMP compositions and methods
- Patent number 9,469,787
- Issue date Oct 18, 2016
- Cabot Microelectronics Corporation
- Ke Zhang
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250010421
- Publication date Jan 9, 2025
- EBARA CORPORATION
- Masayuki NAKANISHI
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD AND POLISHING SYSTEM
- Publication number 20240399526
- Publication date Dec 5, 2024
- EBARA CORPORATION
- Yuichi KATO
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20240383093
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SUBSTRATE FOR FABRICATION OF BETA GALLIUM OXIDE DEVICES
- Publication number 20240347339
- Publication date Oct 17, 2024
- Syrnatec, Inc.
- Yash Suresh Mirchandani
- B24 - GRINDING POLISHING
Information Patent Application
ELECTROCHEMICAL-MECHANICAL THINNING METHOD AND APPARATUS FOR LARGE-...
- Publication number 20240266178
- Publication date Aug 8, 2024
- XI'AN JIAOTONG UNIVERSITY
- Xu YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP POLISHING PAD WITH PROTRUDING STRUCTURES HAVING ENGINEERED OPEN...
- Publication number 20230311269
- Publication date Oct 5, 2023
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- John R. McCormick
- B24 - GRINDING POLISHING
Information Patent Application
ROLLER FOR LOCATION-SPECIFIC WAFER POLISHING
- Publication number 20220281062
- Publication date Sep 8, 2022
- Applied Materials, Inc.
- Ekaterina A. Mikhaylichenko
- B24 - GRINDING POLISHING
Information Patent Application
Lapping Tool
- Publication number 20210060724
- Publication date Mar 4, 2021
- Sunnen Products Co.
- Daniel R. Cloutier
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS FOR CONTROLLING POLISHING U...
- Publication number 20200185231
- Publication date Jun 11, 2020
- Samsung Electronics Co., Ltd.
- In-kwon Kim
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE CLEANING APPARATUS, SUBSTRATE CLEANING METHOD, AND SUBSTR...
- Publication number 20200147654
- Publication date May 14, 2020
- EBARA CORPORATION
- Hideaki TANAKA
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE ADSORPTION METHOD, SUBSTRATE HOLDING APPARATUS, SUBSTRATE...
- Publication number 20200094372
- Publication date Mar 26, 2020
- EBARA CORPORATION
- Hiroyuki SHINOZAKI
- B24 - GRINDING POLISHING
Information Patent Application
MOLDS AND METHODS TO CONTROL MOLD SURFACE QUALITY
- Publication number 20190330096
- Publication date Oct 31, 2019
- Corning Incorporated
- Yi-Chun Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FLATTENING METHOD AND FLATTENING APPARATUS
- Publication number 20190228994
- Publication date Jul 25, 2019
- EBARA CORPORATION
- Kazuto Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING PAD HAVING ARC-SHAPED CONFIGURATION
- Publication number 20190047110
- Publication date Feb 14, 2019
- Applied Materials, Inc.
- Hung Chih Chen
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR POLISHING SILICON SUBSTRATE AND POLISHING COMPOSITION SET
- Publication number 20190022821
- Publication date Jan 24, 2019
- FUJIMI INCORPORATED
- Makoto TABATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ABRASIVES, POLISHING COMPOSITION, AND POLISHING METHOD
- Publication number 20170260436
- Publication date Sep 14, 2017
- FUJIMI INCORPORATED
- Eiichi YAMADA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING PAD
- Publication number 20170252892
- Publication date Sep 7, 2017
- FUJIMI INCORPORATED
- Koji KATAYAMA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING TOOL AND POLISHING METHOD FOR MEMBER HAVING CURVED SURFAC...
- Publication number 20170252890
- Publication date Sep 7, 2017
- FUJIMI INCORPORATED
- Yutaka NIWANO
- B24 - GRINDING POLISHING
Information Patent Application
Methods and Apparatus for Nanolapping
- Publication number 20170225290
- Publication date Aug 10, 2017
- Victor B. Kley
- G01 - MEASURING TESTING
Information Patent Application
CMP POLISHING LIQUID, AND POLISHING METHOD
- Publication number 20170210958
- Publication date Jul 27, 2017
- Hitachi Chemical Company, Ltd.
- Takashi SHINODA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SUBSTRATE ADSORPTION METHOD, SUBSTRATE HOLDING APPARATUS, SUBSTRATE...
- Publication number 20170050289
- Publication date Feb 23, 2017
- EBARA CORPORATION
- Hiroyuki SHINOZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDS AND METHODS TO CONTROL MOLD SURFACE QUALITY
- Publication number 20170044045
- Publication date Feb 16, 2017
- Corning Incorporated
- Yi-Chun Chiang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PROCESSING APPARATUS AND PROCESSING METHOD
- Publication number 20160379838
- Publication date Dec 29, 2016
- PANASONIC CORPORATION
- YOSHIFUMI TAKASU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for Nanolapping
- Publication number 20160325397
- Publication date Nov 10, 2016
- Victor B. Kley
- G01 - MEASURING TESTING
Information Patent Application
AUTOMATED POLISHING SYSTEM AND METHOD
- Publication number 20160250734
- Publication date Sep 1, 2016
- Guangdong Institute Of Automation
- Xuefeng Zhou
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE CLEANING APPARATUS,SUBSTRATE CLEANING METHOD, AND SUBSTRA...
- Publication number 20160243593
- Publication date Aug 25, 2016
- EBARA CORPORATION
- Hideaki TANAKA
- B08 - CLEANING
Information Patent Application
POLISHING LIQUID AND METHOD OF POLISHING SiC SUBSTRATE
- Publication number 20160130475
- Publication date May 12, 2016
- Disco Corporation
- Katsuyoshi Kojima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
NICKEL PHOSPHOROUS CMP COMPOSITIONS AND METHODS
- Publication number 20160102227
- Publication date Apr 14, 2016
- Cabot Microelectronics Corporation
- Ke ZHANG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BUFFING APPARATUS AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20160101498
- Publication date Apr 14, 2016
- EBARA CORPORATION
- Kuniaki YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAPPING TOOL
- Publication number 20160059374
- Publication date Mar 3, 2016
- SIEMENS ENERGY, INC.
- Harald W. Breitkopf
- B24 - GRINDING POLISHING

Lapping tools

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Atmospheric plasma in wafer processing system optimization

Roller for location-specific wafer polishing

Methods of forming an adhesive layer, and related adhesive films an...

Roller for location-specific wafer polishing

Polishing platens and polishing platen manufacturing methods

Chemical mechanical polishing apparatus for controlling polishing u...

Method for polishing silicon substrate and polishing composition set

Substrate adsorption method, substrate holding apparatus, substrate...

Chemical mechanical polishing apparatus and methods

Substrate cleaning apparatus, substrate cleaning method, and substr...

Wafer grinding apparatus and wafer grinding method

Polishing pad having arc-shaped configuration

Flattening method and flattening apparatus

Abrasives, polishing composition, and polishing method

Method and apparatus for nanolapping

Substrate cleaning apparatus, substrate cleaning method, and substr...

Substrate adsorption method, substrate holding apparatus, substrate...

Polishing tool and polishing method for member having curved surfac...

Molds and methods to control mold surface quality

Flattening method and flattening apparatus

Polishing pad configuration and chemical mechanical polishing system

Automated polishing system and method

Buffing apparatus and substrate processing apparatus

Polishing pad configuration and polishing pad support

Polishing liquid and method of polishing SiC substrate

Systems and methods for performing chemical mechanical planarization

Processing apparatus and processing method

Bore finishing tool

Configurable pressure design for multizone chemical mechanical plan...

Nickel phosphorous CMP compositions and methods

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

POLISHING HEAD AND POLISHING SYSTEM

APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING

COMPOSITE SUBSTRATE FOR FABRICATION OF BETA GALLIUM OXIDE DEVICES

ELECTROCHEMICAL-MECHANICAL THINNING METHOD AND APPARATUS FOR LARGE-...

CMP POLISHING PAD WITH PROTRUDING STRUCTURES HAVING ENGINEERED OPEN...

ROLLER FOR LOCATION-SPECIFIC WAFER POLISHING

Lapping Tool

CHEMICAL MECHANICAL POLISHING APPARATUS FOR CONTROLLING POLISHING U...

SUBSTRATE CLEANING APPARATUS, SUBSTRATE CLEANING METHOD, AND SUBSTR...

SUBSTRATE ADSORPTION METHOD, SUBSTRATE HOLDING APPARATUS, SUBSTRATE...

MOLDS AND METHODS TO CONTROL MOLD SURFACE QUALITY

FLATTENING METHOD AND FLATTENING APPARATUS

POLISHING PAD HAVING ARC-SHAPED CONFIGURATION

METHOD FOR POLISHING SILICON SUBSTRATE AND POLISHING COMPOSITION SET

ABRASIVES, POLISHING COMPOSITION, AND POLISHING METHOD

POLISHING PAD

POLISHING TOOL AND POLISHING METHOD FOR MEMBER HAVING CURVED SURFAC...

Methods and Apparatus for Nanolapping

CMP POLISHING LIQUID, AND POLISHING METHOD

SUBSTRATE ADSORPTION METHOD, SUBSTRATE HOLDING APPARATUS, SUBSTRATE...

MOLDS AND METHODS TO CONTROL MOLD SURFACE QUALITY

PROCESSING APPARATUS AND PROCESSING METHOD

Methods and Apparatus for Nanolapping

AUTOMATED POLISHING SYSTEM AND METHOD

SUBSTRATE CLEANING APPARATUS,SUBSTRATE CLEANING METHOD, AND SUBSTRA...

POLISHING LIQUID AND METHOD OF POLISHING SiC SUBSTRATE

NICKEL PHOSPHOROUS CMP COMPOSITIONS AND METHODS

BUFFING APPARATUS AND SUBSTRATE PROCESSING APPARATUS

LAPPING TOOL