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H01L2027/1189

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2027/1189Latch-up prevention

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,154,904
- Issue date Nov 26, 2024
- SOCIONEXT INC.
- Atsushi Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increasing device density and reducing cross-talk spacer structures
- Patent number 12,148,795
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device, method, and system
- Patent number 12,027,525
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Yao Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor devices, methods of designing layouts of semiconducto...
- Patent number 11,869,884
- Issue date Jan 9, 2024
- Samsung Electronics Co., Ltd.
- Jong-Kyu Ryu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 11,784,188
- Issue date Oct 10, 2023
- SOCIONEXT INC.
- Toshio Hino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor layout in FinFET technologies
- Patent number 11,720,734
- Issue date Aug 8, 2023
- Apple Inc.
- Farzan Farbiz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit structure and method of forming the same
- Patent number 11,652,102
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kam-Tou Sio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device, method, and system
- Patent number 11,646,317
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Yao Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated capacitive element and corresponding production method
- Patent number 11,538,941
- Issue date Dec 27, 2022
- STMicroelectronics (Rousset) SAS
- Abderrezak Marzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increasing device density and reducing cross-talk spacer structures
- Patent number 11,527,609
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Latch-up immunization techniques for integrated circuits
- Patent number 11,502,078
- Issue date Nov 15, 2022
- STMicroelectronics International N.V.
- Vishal Kumar Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 11,387,256
- Issue date Jul 12, 2022
- SOCIONEXT INC.
- Toshio Hino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, methods of designing layouts of semiconducto...
- Patent number 11,239,227
- Issue date Feb 1, 2022
- Samsung Electronics Co., Ltd.
- Jong-Kyu Ryu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit including asymmetric ending cells and system-on-...
- Patent number 11,189,640
- Issue date Nov 30, 2021
- Samsung Electronics Co., Ltd.
- Jong-kyu Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip backside die grounding techniques
- Patent number 11,043,467
- Issue date Jun 22, 2021
- Texas Instruments Incorporated
- James Fred Salzman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit, system for and method of forming an integrated...
- Patent number 10,879,229
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kam-Tou Sio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,840,263
- Issue date Nov 17, 2020
- SOCIONEXT INC.
- Toshio Hino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor layout in FinFET technologies
- Patent number 10,740,527
- Issue date Aug 11, 2020
- Apple Inc.
- Farzan Farbiz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit, system for and method of forming an integrated...
- Patent number 10,734,377
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kam-Tou Sio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including asymmetric ending cells and system-on-...
- Patent number 10,680,014
- Issue date Jun 9, 2020
- Samsung Electronics Co., Ltd.
- Jong-kyu Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip backside die grounding techniques
- Patent number 10,607,958
- Issue date Mar 31, 2020
- Texas Instruments Incorporated
- James Fred Salzman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,593,702
- Issue date Mar 17, 2020
- SOCIONEXT INC.
- Masaki Tamaru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, electronic component, and electronic device
- Patent number 10,504,919
- Issue date Dec 10, 2019
- Semiconductor Energy Laboratory Co., Ltd.
- Munehiro Kozuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photodiode array structure for cross talk suppression
- Patent number 10,109,671
- Issue date Oct 23, 2018
- Massachusetts Institute of Technology
- Joseph P Donnelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,083,985
- Issue date Sep 25, 2018
- SOCIONEXT INC.
- Masaki Tamaru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,741,740
- Issue date Aug 22, 2017
- SOCIONEXT INC.
- Masaki Tamaru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with well and substrate contacts
- Patent number 9,679,915
- Issue date Jun 13, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Zhang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating radiation hardened MOS devices
- Patent number 9,653,544
- Issue date May 16, 2017
- Texas Instruments Incorporated
- James Fred Salzman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device having improved radiation hardness and high breakdown voltages
- Patent number 9,620,586
- Issue date Apr 11, 2017
- Texas Instruments Incorporated
- James Fred Salzman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device having improved radiation hardness and high breakdown voltages
- Patent number 9,281,232
- Issue date Mar 8, 2016
- Texas Instruments Incorporated
- James Fred Salzman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD
- Publication number 20240387554
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Yao HUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INCREASING DEVICE DENSITY AND REDUCING CROSS-TALK SPACER STRUCTURES
- Publication number 20240379745
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20230411396
- Publication date Dec 21, 2023
- SOCIONEXT INC.
- Toshio HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCREASING DEVICE DENSITY AND REDUCING CROSS-TALK SPACER STRUCTURES
- Publication number 20220359649
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20220310658
- Publication date Sep 29, 2022
- SOCIONEXT INC.
- Toshio HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220293634
- Publication date Sep 15, 2022
- SOCIONEXT INC.
- Atsushi OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20220254811
- Publication date Aug 11, 2022
- SOCIONEXT INC.
- Masahisa IIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220231054
- Publication date Jul 21, 2022
- SOCIONEXT INC.
- Atsushi OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES, METHODS OF DESIGNING LAYOUTS OF SEMICONDUCTO...
- Publication number 20220115369
- Publication date Apr 14, 2022
- Samsung Electronics Co., Ltd.
- Jong-Kyu RYU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT INCLUDING ASYMMETRIC ENDING CELLS AND SYSTEM-ON-...
- Publication number 20220059572
- Publication date Feb 24, 2022
- Samsung Electronics Co., Ltd.
- Jong-kyu RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE, METHOD, AND SYSTEM
- Publication number 20210272984
- Publication date Sep 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien Yao HUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INCREASING DEVICE DENSITY AND REDUCING CROSS-TALK SPACER STRUCTURES
- Publication number 20210134944
- Publication date May 6, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20210118868
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kam-Tou SIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20210028191
- Publication date Jan 28, 2021
- SOCIONEXT INC.
- Toshio HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, SYSTEM FOR AND METHOD OF FORMING AN INTEGRATED...
- Publication number 20200357793
- Publication date Nov 12, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kam-Tou SIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip Chip Backside Die Grounding Techniques
- Publication number 20200176413
- Publication date Jun 4, 2020
- TEXAS INSTRUMENTS INCORPORATED
- James Fred Salzman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES, METHODS OF DESIGNING LAYOUTS OF SEMICONDUCTO...
- Publication number 20190214377
- Publication date Jul 11, 2019
- Samsung Electronics Co., Ltd.
- Jong-Kyu RYU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20190198530
- Publication date Jun 27, 2019
- SOCIONEXT INC.
- Toshio HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INCLUDING ASYMMETRIC ENDING CELLS AND SYSTEM-ON-...
- Publication number 20190074296
- Publication date Mar 7, 2019
- Samsung Electronics Co., Ltd.
- Jong-kyu RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180366490
- Publication date Dec 20, 2018
- SOCIONEXT INC.
- Masaki TAMARU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, SYSTEM FOR AND METHOD OF FORMING AN INTEGRATED...
- Publication number 20180151559
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kam-Tou SIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photodiode Array Structure for Cross Talk Suppression
- Publication number 20180040663
- Publication date Feb 8, 2018
- Massachusetts Institute of Technology
- Joseph P. Donnelly
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170317101
- Publication date Nov 2, 2017
- SOCIONEXT INC.
- Masaki TAMARU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE
- Publication number 20170125440
- Publication date May 4, 2017
- Semiconductor Energy Laboratory Co., Ltd.
- Munehiro KOZUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP BACKSIDE MECHANICAL DIE GROUNDING TECHNIQUES
- Publication number 20170062377
- Publication date Mar 2, 2017
- TEXAS INSTRUMENTS INCORPORATED
- James Fred Salzman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP BACKSIDE DIE GROUNDING TECHNIQUES
- Publication number 20170062376
- Publication date Mar 2, 2017
- TEXAS INSTRUMENTS INCORPORATED
- James Fred Salzman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH WELL AND SUBSTRATE CONTACTS
- Publication number 20160336343
- Publication date Nov 17, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Zhang KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160247820
- Publication date Aug 25, 2016
- SOCIONEXT INC.
- Masaki TAMARU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Radiation Hardened MOS Devices and Methods of Fabrication
- Publication number 20160141389
- Publication date May 19, 2016
- TEXAS INSTRUMENTS INCORPORATED
- James Fred Salzman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140159160
- Publication date Jun 12, 2014
- PANASONIC CORPORATION
- MASAKI TAMARU
- H01 - BASIC ELECTRIC ELEMENTS

Latch-up prevention

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Increasing device density and reducing cross-talk spacer structures

Integrated circuit device, method, and system

Semiconductor devices, methods of designing layouts of semiconducto...

Semiconductor integrated circuit device

Semiconductor layout in FinFET technologies

Integrated circuit structure and method of forming the same

Integrated circuit device, method, and system

Integrated capacitive element and corresponding production method

Increasing device density and reducing cross-talk spacer structures

Latch-up immunization techniques for integrated circuits

Semiconductor integrated circuit device

Semiconductor devices, methods of designing layouts of semiconducto...

Integrated circuit including asymmetric ending cells and system-on-...

Flip chip backside die grounding techniques

Integrated circuit, system for and method of forming an integrated...

Semiconductor integrated circuit device

Semiconductor layout in FinFET technologies

Integrated circuit, system for and method of forming an integrated...

Integrated circuit including asymmetric ending cells and system-on-...

Flip chip backside die grounding techniques

Semiconductor device

Semiconductor device, electronic component, and electronic device

Photodiode array structure for cross talk suppression

Semiconductor device

Semiconductor device

Integrated circuit with well and substrate contacts

Methods for fabricating radiation hardened MOS devices

Device having improved radiation hardness and high breakdown voltages

Device having improved radiation hardness and high breakdown voltages

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD

INCREASING DEVICE DENSITY AND REDUCING CROSS-TALK SPACER STRUCTURES

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

INCREASING DEVICE DENSITY AND REDUCING CROSS-TALK SPACER STRUCTURES

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES, METHODS OF DESIGNING LAYOUTS OF SEMICONDUCTO...

INTEGRATED CIRCUIT INCLUDING ASYMMETRIC ENDING CELLS AND SYSTEM-ON-...

INTEGRATED CIRCUIT DEVICE, METHOD, AND SYSTEM

INCREASING DEVICE DENSITY AND REDUCING CROSS-TALK SPACER STRUCTURES

INTEGRATED CIRCUIT STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

INTEGRATED CIRCUIT, SYSTEM FOR AND METHOD OF FORMING AN INTEGRATED...

Flip Chip Backside Die Grounding Techniques

SEMICONDUCTOR DEVICES, METHODS OF DESIGNING LAYOUTS OF SEMICONDUCTO...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

INTEGRATED CIRCUIT INCLUDING ASYMMETRIC ENDING CELLS AND SYSTEM-ON-...

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT, SYSTEM FOR AND METHOD OF FORMING AN INTEGRATED...

Photodiode Array Structure for Cross Talk Suppression

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE

FLIP CHIP BACKSIDE MECHANICAL DIE GROUNDING TECHNIQUES

FLIP CHIP BACKSIDE DIE GROUNDING TECHNIQUES

INTEGRATED CIRCUIT WITH WELL AND SUBSTRATE CONTACTS

SEMICONDUCTOR DEVICE

Radiation Hardened MOS Devices and Methods of Fabrication

SEMICONDUCTOR DEVICE