Layered conductors or foils

Industry

CPC
H05K2201/0335

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0335Layered conductors or foils

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Board-to-board connection structure and method for manufacturing th...
- Patent number 12,028,976
- Issue date Jul 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Jian-Yi Hao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive trace interconnection tape
- Patent number 11,812,553
- Issue date Nov 7, 2023
- Honeywell Federal Manufacturing & Technologies, LLC
- Stephen McGarry Hatch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Barrier layer
- Patent number 11,612,062
- Issue date Mar 21, 2023
- Kunal Shah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic wave shielding sheet and printed wiring board
- Patent number 11,533,833
- Issue date Dec 20, 2022
- Toyo Ink SC Holdings Co., Ltd.
- Daisuke Kishi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Conductive trace interconnection tape
- Patent number 11,350,524
- Issue date May 31, 2022
- Honeywell Federal Manufacturing & Technologies, LLC
- Stephen McGarry Hatch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Barrier layer
- Patent number 11,058,011
- Issue date Jul 6, 2021
- Kunal Shah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic wave shielding sheet and printed wiring board
- Patent number 10,820,457
- Issue date Oct 27, 2020
- Toyo Ink SC Holdings Co., Ltd.
- Daisuke Kishi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Copper foil with minimized bagginess, wrinkle or tear, electrode in...
- Patent number 10,787,752
- Issue date Sep 29, 2020
- KCF TECHNOLOGIES CO., LTD.
- Seung Min Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for component incorporated substrate and compo...
- Patent number 9,622,352
- Issue date Apr 11, 2017
- MEIKO ELECTRONICS CO., LTD.
- Ryoichi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 9,554,462
- Issue date Jan 24, 2017
- Ibiden Co., Ltd.
- Katsutoshi Kitagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free monolithic epitaxial graphene-on-diamond PWB with optica...
- Patent number 9,402,322
- Issue date Jul 26, 2016
- Lockheed Martin Corporation
- David G. Findley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC MODULE AND ELECTRONIC DEVICE
- Publication number 20240179831
- Publication date May 30, 2024
- Canon Kabushiki Kaisha
- HIROYUKI YAMAGUCHI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CIRCUIT STRUCTURE FOR HOT-PRESS BONDING
- Publication number 20230422405
- Publication date Dec 28, 2023
- SuperC-Touch Corporation
- Hsiang-Yu LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING BONDED BODY AND METHOD FOR MANUFACTURING I...
- Publication number 20230115820
- Publication date Apr 13, 2023
- MITSUBISHI MATERIALS CORPORATION
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD-TO-BOARD CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING TH...
- Publication number 20220338350
- Publication date Oct 20, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- JIAN-YI HAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE TRACE INTERCONNECTION TAPE
- Publication number 20220279653
- Publication date Sep 1, 2022
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- STEPHEN MCGARRY HATCH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Barrier Layer
- Publication number 20220022325
- Publication date Jan 20, 2022
- Kunal Shah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE TRACE INTERCONNECTION TAPE
- Publication number 20210092839
- Publication date Mar 25, 2021
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- STEPHEN MCGARRY HATCH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC WAVE SHIELDING SHEET AND PRINTED WIRING BOARD
- Publication number 20200413576
- Publication date Dec 31, 2020
- TOYO INK SC HOLDINGS CO., LTD
- Daisuke KISHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INSULATED CIRCUIT BOARD
- Publication number 20200413534
- Publication date Dec 31, 2020
- MITSUBISHI MATERIALS CORPORATION
- Takeshi Kitahara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE TRACE INTERCONNECTION TAPE
- Publication number 20200367358
- Publication date Nov 19, 2020
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- STEPHEN MCGARRY HATCH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER FOIL WITH MINIMIZED BAGGINESS, WRINKLE OR TEAR, ELECTRODE IN...
- Publication number 20190017188
- Publication date Jan 17, 2019
- KCF Technologies Co., Ltd.
- Seung Min KIM
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Printable Films for Printed Circuit Boards and Processes for Making...
- Publication number 20170135220
- Publication date May 11, 2017
- The Governing Council of the University of Toronto
- Perumal Varun Chadalavada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE TRANSPARENT ELECTRODE AND METHOD OF FABRICATING SAME
- Publication number 20160234930
- Publication date Aug 11, 2016
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Chan Woo PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20150257261
- Publication date Sep 10, 2015
- IBIDEN CO., LTD.
- Katsutoshi KITAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR COMPONENT INCORPORATED SUBSTRATE AND COMPO...
- Publication number 20150237734
- Publication date Aug 20, 2015
- MEIKO ELECTRONICS CO., LTD.
- Ryoichi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE-TREATED COPPER FOIL AND COPPER-CLAD LAMINATE PLATE INCLUDIN...
- Publication number 20150101848
- Publication date Apr 16, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Ji Sung CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LUMINESCENCE DEVICE
- Publication number 20140091345
- Publication date Apr 3, 2014
- Sampei TOMOHIRO
- H01 - BASIC ELECTRIC ELEMENTS

Layered conductors or foils

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Board-to-board connection structure and method for manufacturing th...

Conductive trace interconnection tape

Barrier layer

Electromagnetic wave shielding sheet and printed wiring board

Conductive trace interconnection tape

Barrier layer

Electromagnetic wave shielding sheet and printed wiring board

Copper foil with minimized bagginess, wrinkle or tear, electrode in...

Manufacturing method for component incorporated substrate and compo...

Printed wiring board

Metal-free monolithic epitaxial graphene-on-diamond PWB with optica...

Patents Applicationslast 30 patents

ELECTRONIC MODULE AND ELECTRONIC DEVICE

CIRCUIT STRUCTURE FOR HOT-PRESS BONDING

METHOD FOR MANUFACTURING BONDED BODY AND METHOD FOR MANUFACTURING I...

BOARD-TO-BOARD CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING TH...

CONDUCTIVE TRACE INTERCONNECTION TAPE

Barrier Layer

CONDUCTIVE TRACE INTERCONNECTION TAPE

ELECTROMAGNETIC WAVE SHIELDING SHEET AND PRINTED WIRING BOARD

INSULATED CIRCUIT BOARD

CONDUCTIVE TRACE INTERCONNECTION TAPE

COPPER FOIL WITH MINIMIZED BAGGINESS, WRINKLE OR TEAR, ELECTRODE IN...

Printable Films for Printed Circuit Boards and Processes for Making...

STRETCHABLE TRANSPARENT ELECTRODE AND METHOD OF FABRICATING SAME

PRINTED WIRING BOARD

MANUFACTURING METHOD FOR COMPONENT INCORPORATED SUBSTRATE AND COMPO...

SURFACE-TREATED COPPER FOIL AND COPPER-CLAD LAMINATE PLATE INCLUDIN...

LUMINESCENCE DEVICE