Lead-in-hole components

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CPC
H05K3/306

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/306Lead-in-hole components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacture for embedded IC chip directly connected to PCB
- Patent number 12,213,258
- Issue date Jan 28, 2025
- AVERATEK CORPORATION
- Haris Basit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light board, method for manufacturing the same, and LED backlight m...
- Patent number 12,177,966
- Issue date Dec 24, 2024
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Xinghan He
- F21 - LIGHTING
Information Patent Grant
Modular electronic prototyping platforms
- Patent number 12,177,969
- Issue date Dec 24, 2024
- Microsoft Technology Licensing, LLC
- Stephen Edward Hodges
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED circuit board structure and LED testing and packaging method
- Patent number 12,150,242
- Issue date Nov 19, 2024
- Ingentec Corporation
- Yi-Chuan Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic interference shielding and thermal management syste...
- Patent number 12,137,515
- Issue date Nov 5, 2024
- Aptiv Technologies AG
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interface assembly and method for manufacturing interface assembly
- Patent number 12,137,523
- Issue date Nov 5, 2024
- TACTOTEK OY
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Interface assembly and method for manufacturing interface assembly
- Patent number 12,096,562
- Issue date Sep 17, 2024
- TACTOTEK OY
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of manufacturing light-emitting device, method of manufactur...
- Patent number 12,044,399
- Issue date Jul 23, 2024
- Nichia Corporation
- Isamu Niki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-diameter female contacts and related m...
- Patent number 12,035,482
- Issue date Jul 9, 2024
- Eagle Technology, LLC
- John Voelkel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly structure for vehicle camera module using solder-jet
- Patent number 12,025,848
- Issue date Jul 2, 2024
- Hyundai Mobis Co., Ltd.
- SangHwan Oh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Interface assembly and method for manufacturing interface assembly
- Patent number 12,004,299
- Issue date Jun 4, 2024
- TACTOTEK OY
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of manufacturing a three-dimensional electronic module havin...
- Patent number 11,974,399
- Issue date Apr 30, 2024
- Yuriy Borisovich Sokolov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic control unit and method for assembling electronic contro...
- Patent number 11,956,900
- Issue date Apr 9, 2024
- Hitachi Astemo, Ltd.
- Tomohiro Fukuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solid state relay
- Patent number 11,949,407
- Issue date Apr 2, 2024
- Zonit Structured Solutions, LLC
- Steve Chapel
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Printed circuit board and manufacturing method thereof, and electro...
- Patent number 11,882,665
- Issue date Jan 23, 2024
- Huawei Technologies Co., Ltd.
- Zhengbao Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielding shell
- Patent number 11,862,898
- Issue date Jan 2, 2024
- Dongguan Luxshare Technologies Co., Ltd.
- Tao Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with embedded electronic component and method for man...
- Patent number 11,778,752
- Issue date Oct 3, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Hsiao-Ting Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backplane connector with improved mounting block
- Patent number 11,769,968
- Issue date Sep 26, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Xiaogang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane connector
- Patent number 11,749,948
- Issue date Sep 5, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Tao Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-fit rework method
- Patent number 11,742,602
- Issue date Aug 29, 2023
- International Business Machines Corporation
- John R. Dangler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal module and backplane connector having the terminal module
- Patent number 11,710,929
- Issue date Jul 25, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Xiaogang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal module and backplane connector having the terminal module
- Patent number 11,710,930
- Issue date Jul 25, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Xiaogang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane connector with improved structure strength
- Patent number 11,710,931
- Issue date Jul 25, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Xiaogang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane connector assembly with improved shielding effect
- Patent number 11,705,671
- Issue date Jul 18, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Xiaogang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane connector with improved shielding effect
- Patent number 11,705,670
- Issue date Jul 18, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Xiaogang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane connector
- Patent number 11,699,880
- Issue date Jul 11, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Tao Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal module and backplane connector having the terminal module
- Patent number 11,699,881
- Issue date Jul 11, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Xiaogang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane connector with improved shielding effect
- Patent number 11,699,882
- Issue date Jul 11, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Xiaogang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 11,605,609
- Issue date Mar 14, 2023
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric compressor
- Patent number 11,585,332
- Issue date Feb 21, 2023
- MITSUBISHI HEAVY INDUSTRIES THERMAL SYSTEMS, LTD.
- Makoto Hattori
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF SEGMENTED ELECTROPLATING GOLD FINGER
- Publication number 20240397631
- Publication date Nov 28, 2024
- Gold Circuit Electronics Ltd.
- Chen-Tse Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY
- Publication number 20240373559
- Publication date Nov 7, 2024
- TactoTek Oy
- Mikko HEIKKINEN
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-DIAMETER FEMALE CONTACTS AND RELATED M...
- Publication number 20240334615
- Publication date Oct 3, 2024
- Eagle Technology, LLC
- JOHN VOELKEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY
- Publication number 20240284598
- Publication date Aug 22, 2024
- TactoTek Oy
- Mikko HEIKKINEN
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CI...
- Publication number 20240237210
- Publication date Jul 11, 2024
- International Business Machines Corporation
- James D. BIELICK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CI...
- Publication number 20240138064
- Publication date Apr 25, 2024
- International Business Machines Corporation
- James D. BIELICK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VGA MONITOR EMULATING PRINTED CIRCUIT BOARD
- Publication number 20240064903
- Publication date Feb 22, 2024
- Alcon Inc.
- Horst Keiler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LED CIRCUIT BOARD STRUCTURE, LED TESTING AND PACKAGING METHOD AND L...
- Publication number 20240008170
- Publication date Jan 4, 2024
- INGENTEC CORPORATION
- Yi-Chuan HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Prototyping
- Publication number 20230389175
- Publication date Nov 30, 2023
- Microsoft Technology Licensing, LLC
- Stephen Edward HODGES
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE ELECTRONIC STRUCTURES
- Publication number 20230363092
- Publication date Nov 9, 2023
- X-CELEPRINT LIMITED
- António José Marques Trindade
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLID STATE RELAY
- Publication number 20230283274
- Publication date Sep 7, 2023
- Zonit Structured Solutions, LLC
- Steve Chapel
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
LIGHT BOARD, METHOD FOR MANUFACTURING THE SAME, AND LED BACKLIGHT M...
- Publication number 20230217586
- Publication date Jul 6, 2023
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.
- Xinghan HE
- F21 - LIGHTING
Information Patent Application
METHOD OF MANUFACTURING A THREE-DIMENSIONAL ELECTRONIC MODULE HAVIN...
- Publication number 20230143909
- Publication date May 11, 2023
- Yuriy Borisovich Sokolov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING COUPLER
- Publication number 20230146499
- Publication date May 11, 2023
- Samsung Electronics Co.,Ltd.
- Youngjoon KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF ASSEMBLING AND EFFICIENT MANUFACTURE OF HIGH PERFORMANCE...
- Publication number 20230012133
- Publication date Jan 12, 2023
- Amphenol Corporation
- Michael D. Long
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONICS CIRCUIT BOARD DESIGN TOOL
- Publication number 20230005387
- Publication date Jan 5, 2023
- SLIM CIRCUITS PTY LTD
- Graham Maxwell Mitchell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENT AND METHOD FOR MAN...
- Publication number 20220312598
- Publication date Sep 29, 2022
- Avary Holding (Shenzhen) Co., Limited.
- HSIAO-TING HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATED PRESS-FIT CONNECTION
- Publication number 20220278470
- Publication date Sep 1, 2022
- International Business Machines Corporation
- John R. Dangler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC INTERFERENCE SHIELDING AND THERMAL MANAGEMENT SYSTE...
- Publication number 20220248525
- Publication date Aug 4, 2022
- Aptiv Technologies Limited
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Control Unit and Method for Assembling Electronic Contro...
- Publication number 20220159838
- Publication date May 19, 2022
- Hitachi Astemo, Ltd.
- Tomohiro FUKUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE, METHOD OF MANUFACTUR...
- Publication number 20220107078
- Publication date Apr 7, 2022
- Nichia Corporation.
- Isamu NIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL ASSEMBLIES FOR NUCLEIC ACID PREPARATION
- Publication number 20210370299
- Publication date Dec 2, 2021
- ArcherDX, LLC
- Joshua Stahl
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Printed Circuit Board and Manufacturing Method Thereof, and Electro...
- Publication number 20210329791
- Publication date Oct 21, 2021
- Huawei Technologies Co., Ltd
- Zhengbao Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY STRUCTURE FOR VEHICLE CAMERA MODULE USING SOLDER-JET
- Publication number 20210318507
- Publication date Oct 14, 2021
- HYUNDAI MOBIS CO., LTD.
- SangHwan OH
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PIN SIDE EDGE MOUNT CONNECTOR AND SYSTEMS AND METHODS THEREOF
- Publication number 20210151913
- Publication date May 20, 2021
- Lockheed Martin Corporation
- Samuel Muen SHYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN SIDE EDGE MOUNT CONNECTOR AND SYSTEMS AND METHODS THEREOF
- Publication number 20210066827
- Publication date Mar 4, 2021
- Lockheed Martin Corporation
- Samuel Muen SHYU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLID STATE RELAY
- Publication number 20210021261
- Publication date Jan 21, 2021
- Zonit Structured Solutions, LLC
- Steve Chapel
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRICAL CONNECTOR AND CONNECTOR ASSEMBLY THEREOF
- Publication number 20200259280
- Publication date Aug 13, 2020
- DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
- Yung-Chih Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD COMPONENT MOUNTING MACHINE AND LEAD COMPONENT MOUNTING METHOD
- Publication number 20200245471
- Publication date Jul 30, 2020
- FUJI CORPORATION
- Nobuyuki ISHIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN MOLDED SUBSTRATE AND MOUNTING STRUCTURE FOR CAPACITOR
- Publication number 20200227206
- Publication date Jul 16, 2020
- FANUC CORPORATION
- Yuuki INOUE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Lead-in-hole components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacture for embedded IC chip directly connected to PCB

Light board, method for manufacturing the same, and LED backlight m...

Modular electronic prototyping platforms

LED circuit board structure and LED testing and packaging method

Electromagnetic interference shielding and thermal management syste...

Interface assembly and method for manufacturing interface assembly

Interface assembly and method for manufacturing interface assembly

Method of manufacturing light-emitting device, method of manufactur...

Electronic device with multi-diameter female contacts and related m...

Assembly structure for vehicle camera module using solder-jet

Interface assembly and method for manufacturing interface assembly

Method of manufacturing a three-dimensional electronic module havin...

Electronic control unit and method for assembling electronic contro...

Solid state relay

Printed circuit board and manufacturing method thereof, and electro...

Shielding shell

Circuit board with embedded electronic component and method for man...

Backplane connector with improved mounting block

Backplane connector

Press-fit rework method

Terminal module and backplane connector having the terminal module

Terminal module and backplane connector having the terminal module

Backplane connector with improved structure strength

Backplane connector assembly with improved shielding effect

Backplane connector with improved shielding effect

Backplane connector

Terminal module and backplane connector having the terminal module

Backplane connector with improved shielding effect

Ultra-thin embedded semiconductor device package and method of manu...

Electric compressor

Patents Applicationslast 30 patents

METHOD OF SEGMENTED ELECTROPLATING GOLD FINGER

INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY

ELECTRONIC DEVICE WITH MULTI-DIAMETER FEMALE CONTACTS AND RELATED M...

INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY

MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CI...

MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CI...

VGA MONITOR EMULATING PRINTED CIRCUIT BOARD

LED CIRCUIT BOARD STRUCTURE, LED TESTING AND PACKAGING METHOD AND L...

Electronic Prototyping

FLEXIBLE ELECTRONIC STRUCTURES

SOLID STATE RELAY

LIGHT BOARD, METHOD FOR MANUFACTURING THE SAME, AND LED BACKLIGHT M...

METHOD OF MANUFACTURING A THREE-DIMENSIONAL ELECTRONIC MODULE HAVIN...

PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING COUPLER

METHOD OF ASSEMBLING AND EFFICIENT MANUFACTURE OF HIGH PERFORMANCE...

ELECTRONICS CIRCUIT BOARD DESIGN TOOL

CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENT AND METHOD FOR MAN...

HEATED PRESS-FIT CONNECTION

ELECTROMAGNETIC INTERFERENCE SHIELDING AND THERMAL MANAGEMENT SYSTE...

Electronic Control Unit and Method for Assembling Electronic Contro...

METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE, METHOD OF MANUFACTUR...

THERMAL ASSEMBLIES FOR NUCLEIC ACID PREPARATION

Printed Circuit Board and Manufacturing Method Thereof, and Electro...

ASSEMBLY STRUCTURE FOR VEHICLE CAMERA MODULE USING SOLDER-JET

PIN SIDE EDGE MOUNT CONNECTOR AND SYSTEMS AND METHODS THEREOF

PIN SIDE EDGE MOUNT CONNECTOR AND SYSTEMS AND METHODS THEREOF

SOLID STATE RELAY

ELECTRICAL CONNECTOR AND CONNECTOR ASSEMBLY THEREOF

LEAD COMPONENT MOUNTING MACHINE AND LEAD COMPONENT MOUNTING METHOD

RESIN MOLDED SUBSTRATE AND MOUNTING STRUCTURE FOR CAPACITOR