Lead-in-hole components

Industry

CPC
H05K3/3447

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/3447Lead-in-hole components

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for shielding a printed circuit board from electromagnetic i...
- Patent number 12,289,822
- Issue date Apr 29, 2025
- Skyworks Solutions, Inc.
- Cesar Verdugo Muñoz
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Plug-in connector device and method for producing a plug-in connect...
- Patent number 12,170,415
- Issue date Dec 17, 2024
- Vitesco Technologies GmbH
- Gregory Drew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Battery pack and method of manufacture
- Patent number 12,095,046
- Issue date Sep 17, 2024
- BLACK & DECKER INC.
- Moriah Counts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for soldering an electronic component to a circuit board by...
- Patent number 12,028,987
- Issue date Jul 2, 2024
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit structure and electrical junction box
- Patent number 12,027,500
- Issue date Jul 2, 2024
- Autonetworks Technologies, Ltd.
- Akira Haraguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique to improve waterproofness and dust resistance for circuit...
- Patent number 11,997,958
- Issue date Jun 4, 2024
- Makita Corporation
- Akihiro Hozumi
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Substrate structure and manufacturing method thereof, electronic de...
- Patent number 11,917,758
- Issue date Feb 27, 2024
- PANELSEMI CORPORATION
- Ya-Che Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and manufacturing method thereof, and electro...
- Patent number 11,882,665
- Issue date Jan 23, 2024
- Huawei Technologies Co., Ltd.
- Zhengbao Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielding shell
- Patent number 11,862,898
- Issue date Jan 2, 2024
- Dongguan Luxshare Technologies Co., Ltd.
- Tao Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wave solder pallets for optimal solder flow and methods of manufact...
- Patent number 11,850,684
- Issue date Dec 26, 2023
- Flex Ltd.
- Zohair Mehkri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component
- Patent number 11,844,178
- Issue date Dec 12, 2023
- Analog Devices International Unlimited Company
- John David Brazzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer copper bus bars with soldered through hole components
- Patent number 11,832,390
- Issue date Nov 28, 2023
- Rolls-Royce Corporation
- Shuai Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backplane connector with improved mounting block
- Patent number 11,769,968
- Issue date Sep 26, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Xiaogang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic-component carrier board and a wiring method for the same
- Patent number 11,751,339
- Issue date Sep 5, 2023
- GLOBAL MASTER TECH. CO., LTD.
- Yao-Hua Kao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backplane connector
- Patent number 11,749,948
- Issue date Sep 5, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Tao Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for shielding a printed circuit board from electromagnetic i...
- Patent number 11,729,899
- Issue date Aug 15, 2023
- Skyworks Solutions, Inc.
- Cesar Verdugo Muñoz
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Terminal module and backplane connector having the terminal module
- Patent number 11,710,929
- Issue date Jul 25, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Xiaogang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal module and backplane connector having the terminal module
- Patent number 11,710,930
- Issue date Jul 25, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Xiaogang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane connector with improved structure strength
- Patent number 11,710,931
- Issue date Jul 25, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Xiaogang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane connector assembly with improved shielding effect
- Patent number 11,705,671
- Issue date Jul 18, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Xiaogang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane connector with improved shielding effect
- Patent number 11,705,670
- Issue date Jul 18, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Xiaogang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane connector
- Patent number 11,699,880
- Issue date Jul 11, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Tao Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal module and backplane connector having the terminal module
- Patent number 11,699,881
- Issue date Jul 11, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Xiaogang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane connector with improved shielding effect
- Patent number 11,699,882
- Issue date Jul 11, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Xiaogang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sleeve soldering device and method of producing electronic device
- Patent number 11,696,411
- Issue date Jul 4, 2023
- Denso Corporation
- Hayato Kiuchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component, positioning device and method for fastening the componen...
- Patent number 11,688,989
- Issue date Jun 27, 2023
- Phoenix Contact GmbH & Co.
- Jurgen Sahm
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compliant pin surface mount technology pad for rework
- Patent number 11,647,591
- Issue date May 9, 2023
- International Business Machines Corporation
- Theron Lee Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-core cable assembling method and multi-core cable assembly pr...
- Patent number 11,570,906
- Issue date Jan 31, 2023
- Hitachi Metals, Ltd.
- Yohei Shirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Battery pack and method of manufacture
- Patent number 11,563,239
- Issue date Jan 24, 2023
- Black & Decker Inc.
- Moriah Counts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical assembly
- Patent number 11,558,963
- Issue date Jan 17, 2023
- Lear Corporation
- Greg Dickerhoof
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MASKING METHOD AND MASKED PRODUCT
- Publication number 20250133661
- Publication date Apr 24, 2025
- P2i Ltd.
- Graham HUBBARD
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BATTERY PACK AND METHOD OF MANUFACTURE
- Publication number 20240421365
- Publication date Dec 19, 2024
- Black & Decker Inc.
- Moriah Counts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Soldering an Electronic Component to a Circuit Board by...
- Publication number 20240373563
- Publication date Nov 7, 2024
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL
- Publication number 20240237228
- Publication date Jul 11, 2024
- International Business Machines Corporation
- Theron Lee Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSISTOR PIN ALIGNMENT ASSEMBLY
- Publication number 20240215167
- Publication date Jun 27, 2024
- Garrett Transportation I Inc.
- Valeriy Fedorikhin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT SUBSTRATE, AND ELECTRONIC DEVICE
- Publication number 20240147621
- Publication date May 2, 2024
- Hitachi Astemo, Ltd.
- Narutoshi YAMADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL
- Publication number 20240138074
- Publication date Apr 25, 2024
- International Business Machines Corporation
- Theron Lee Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SHIELDING A PRINTED CIRCUIT BOARD FROM ELECTROMAGNETIC I...
- Publication number 20240090122
- Publication date Mar 14, 2024
- Skyworks Solutions, Inc.
- Cesar Verdugo Muñoz
- G01 - MEASURING TESTING
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20240049400
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING BOARD AND CIRCUIT BOARD
- Publication number 20240008183
- Publication date Jan 4, 2024
- TDK Corporation
- Kiryu IKEBE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE COMPRISING SAME
- Publication number 20230292440
- Publication date Sep 14, 2023
- LG Innotek Co., Ltd.
- Seung Min LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER COPPER BUS BARS WITH SOLDERED THROUGH HOLE COMPONENTS
- Publication number 20230284387
- Publication date Sep 7, 2023
- Rolls-Royce Corporation
- Shuai Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BATTERY PACK AND METHOD OF MANUFACTURE
- Publication number 20230207899
- Publication date Jun 29, 2023
- Black & Decker Inc.
- Moriah Counts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAND OFF STRUCTURES FOR ELECTRONIC CIRCUITS
- Publication number 20230135363
- Publication date May 4, 2023
- KROMEK LIMITED
- Franklin Dean Walker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUG-IN CONNECTOR DEVICE AND METHOD FOR PRODUCING A PLUG-IN CONNECT...
- Publication number 20230029329
- Publication date Jan 26, 2023
- Vitesco Technologies GMBH
- Gregory Drew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR-MOUNTED BOARD MANUFACTURING METHOD AND ELECTRONIC UNIT
- Publication number 20230021587
- Publication date Jan 26, 2023
- YAZAKI CORPORATION
- Ryo HIRAMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT PIN SURFACE MOUNT TECHNOLOGY PAD FOR REWORK
- Publication number 20220400557
- Publication date Dec 15, 2022
- International Business Machines Corporation
- Theron Lee Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC-COMPONENT CARRIER BOARD AND A WIRING METHOD FOR THE SAME
- Publication number 20220377909
- Publication date Nov 24, 2022
- GLOBAL MASTER TECH. CO., LTD.
- Yao-Hua KAO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Soldering an Electronic Component to a Circuit Board by...
- Publication number 20220369473
- Publication date Nov 17, 2022
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER SOLDERING METHOD AND DEVICE
- Publication number 20220320811
- Publication date Oct 6, 2022
- O.M.C. CO., LTD.
- Shinji WATANABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR
- Publication number 20220285862
- Publication date Sep 8, 2022
- YAZAKI CORPORATION
- Fuminori KONDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF, ELECTRONIC DE...
- Publication number 20220210916
- Publication date Jun 30, 2022
- HUA YA APPLIED MATERIALS COMPANY LIMITED
- YA-CHE SHUEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A CONNECTION CONTACT
- Publication number 20210410293
- Publication date Dec 30, 2021
- Knorr-Bremse Systeme fuer Nutzfahrzeuge GmbH
- Karin Pohley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20210378098
- Publication date Dec 2, 2021
- Analog Devices International Unlimited Company
- John Brazzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL ASSEMBLY
- Publication number 20210378102
- Publication date Dec 2, 2021
- LEAR CORPORATION
- Greg Dickerhoof
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Board and Terminal
- Publication number 20210352803
- Publication date Nov 11, 2021
- Huawei Technologies Co., Ltd
- Liping Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board and Manufacturing Method Thereof, and Electro...
- Publication number 20210329791
- Publication date Oct 21, 2021
- Huawei Technologies Co., Ltd
- Zhengbao Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROSWITCH BASED POSITION SENSOR WITH HARNESS RELIEF FOR MOTORIZED...
- Publication number 20210315106
- Publication date Oct 7, 2021
- HAMILTON SUNDSTRAND CORPORATION
- Agata Kurowska
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
MULTI-CORE CABLE ASSEMBLING METHOD AND MULTI-CORE CABLE ASSEMBLY PR...
- Publication number 20210307179
- Publication date Sep 30, 2021
- Hitachi Metals, Ltd.
- Yohei SHIRAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING BUFFER STRUCTURE FOR EXTERNAL TERMINALS
- Publication number 20210235579
- Publication date Jul 29, 2021
- Fuji Electric Co., Ltd.
- Toshiyuki MIYASAKA
- H01 - BASIC ELECTRIC ELEMENTS

Lead-in-hole components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for shielding a printed circuit board from electromagnetic i...

Plug-in connector device and method for producing a plug-in connect...

Battery pack and method of manufacture

Method for soldering an electronic component to a circuit board by...

Circuit structure and electrical junction box

Technique to improve waterproofness and dust resistance for circuit...

Substrate structure and manufacturing method thereof, electronic de...

Printed circuit board and manufacturing method thereof, and electro...

Shielding shell

Wave solder pallets for optimal solder flow and methods of manufact...

Electronic component

Multilayer copper bus bars with soldered through hole components

Backplane connector with improved mounting block

Electronic-component carrier board and a wiring method for the same

Backplane connector

Method for shielding a printed circuit board from electromagnetic i...

Terminal module and backplane connector having the terminal module

Terminal module and backplane connector having the terminal module

Backplane connector with improved structure strength

Backplane connector assembly with improved shielding effect

Backplane connector with improved shielding effect

Backplane connector

Terminal module and backplane connector having the terminal module

Backplane connector with improved shielding effect

Sleeve soldering device and method of producing electronic device

Component, positioning device and method for fastening the componen...

Compliant pin surface mount technology pad for rework

Multi-core cable assembling method and multi-core cable assembly pr...

Battery pack and method of manufacture

Electrical assembly

Patents Applicationslast 30 patents

MASKING METHOD AND MASKED PRODUCT

BATTERY PACK AND METHOD OF MANUFACTURE

Method for Soldering an Electronic Component to a Circuit Board by...

REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL

TRANSISTOR PIN ALIGNMENT ASSEMBLY

METHOD FOR MANUFACTURING CIRCUIT SUBSTRATE, AND ELECTRONIC DEVICE

REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL

METHOD FOR SHIELDING A PRINTED CIRCUIT BOARD FROM ELECTROMAGNETIC I...

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

MOUNTING BOARD AND CIRCUIT BOARD

PRINTED CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE COMPRISING SAME

MULTILAYER COPPER BUS BARS WITH SOLDERED THROUGH HOLE COMPONENTS

BATTERY PACK AND METHOD OF MANUFACTURE

STAND OFF STRUCTURES FOR ELECTRONIC CIRCUITS

PLUG-IN CONNECTOR DEVICE AND METHOD FOR PRODUCING A PLUG-IN CONNECT...

CONNECTOR-MOUNTED BOARD MANUFACTURING METHOD AND ELECTRONIC UNIT

COMPLIANT PIN SURFACE MOUNT TECHNOLOGY PAD FOR REWORK

ELECTRONIC-COMPONENT CARRIER BOARD AND A WIRING METHOD FOR THE SAME

Method for Soldering an Electronic Component to a Circuit Board by...

LASER SOLDERING METHOD AND DEVICE

CONNECTOR

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF, ELECTRONIC DE...

METHOD FOR PRODUCING A CONNECTION CONTACT

ELECTRONIC COMPONENT

ELECTRICAL ASSEMBLY

Printed Circuit Board and Terminal

Printed Circuit Board and Manufacturing Method Thereof, and Electro...

MICROSWITCH BASED POSITION SENSOR WITH HARNESS RELIEF FOR MOTORIZED...

MULTI-CORE CABLE ASSEMBLING METHOD AND MULTI-CORE CABLE ASSEMBLY PR...

SEMICONDUCTOR DEVICE HAVING BUFFER STRUCTURE FOR EXTERNAL TERMINALS