Leaded Integrated Circuit [IC] package

Industry

CPC
H05K2201/10689

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10689Leaded Integrated Circuit [IC] package

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Techniques for reducing an eddy current in a ground plane of a core...
- Patent number 12,078,662
- Issue date Sep 3, 2024
- ALLEGRO MICROSYSTEMS, LLC
- Yannick Vuillermet
- G01 - MEASURING TESTING
Information Patent Grant
Reconfigurable circuit devices
- Patent number 11,924,966
- Issue date Mar 5, 2024
- Innovium, Inc.
- Vittal Balasubramanian
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board devices with reconfigurable connections
- Patent number 11,916,325
- Issue date Feb 27, 2024
- Innovium, Inc.
- Vittal Balasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Information handling system interchangeable solder pads
- Patent number 11,832,393
- Issue date Nov 28, 2023
- Dell Products L.P.
- Yu-Lin Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Exposed pad integrated circuit package
- Patent number 11,769,247
- Issue date Sep 26, 2023
- Texas Instruments Incorporated
- Reynaldo Corpuz Javier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board and electronic apparatus using the same
- Patent number 11,553,585
- Issue date Jan 10, 2023
- Realtek Semiconductor Corp.
- Chin-Yuan Lo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Information handling system interchangeable solder pads
- Patent number 11,432,447
- Issue date Aug 30, 2022
- Dell Products L.P.
- Yu-Lin Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor apparatus
- Patent number 11,212,908
- Issue date Dec 28, 2021
- Mitsubishi Electric Corporation
- Yuki Hata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed pad integrated circuit package
- Patent number 11,195,269
- Issue date Dec 7, 2021
- Texas Instruments Incorporated
- Reynaldo Corpuz Javier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit, circuit board with integrated circuit, and disp...
- Patent number 11,114,372
- Issue date Sep 7, 2021
- LG Display Co., Ltd.
- Jungjae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmitting data signals on separate layers of a memory module, an...
- Patent number 11,107,507
- Issue date Aug 31, 2021
- Micron Technology, Inc.
- Yogesh Sharma
- G11 - INFORMATION STORAGE
Information Patent Grant
Component carrier with adhesion promoting shape of wiring structure
- Patent number 11,044,812
- Issue date Jun 22, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Voraberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-cost superior performance coinless RF power amplifier
- Patent number 10,912,185
- Issue date Feb 2, 2021
- Telefonaktiebolaget LM Ericsson (publ)
- Reginald Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for enhancing signaling bandwidth in an integ...
- Patent number 10,880,991
- Issue date Dec 29, 2020
- Marvell Asia Pte, Ltd.
- Thomas T. Ngo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing flexible printed circuit board
- Patent number 10,791,625
- Issue date Sep 29, 2020
- Avary Holding (Shenzhen) Co., Limited.
- Xian-Qin Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit boards and circuit board assemblies
- Patent number 10,764,994
- Issue date Sep 1, 2020
- Hamilton Sundstrand Corporation
- Tran Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,638,600
- Issue date Apr 28, 2020
- Renesas Electronics Corporation
- Tatsuaki Tsukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Axial flow fan and electronic device
- Patent number 10,590,953
- Issue date Mar 17, 2020
- Champ Tech Optical (Foshan) Corporation
- Yong-Kang Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder component
- Patent number 10,594,061
- Issue date Mar 17, 2020
- Japan Aviation Electronics Industry, Limited
- Osamu Hashiguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 10,477,686
- Issue date Nov 12, 2019
- Canon Kabushiki Kaisha
- Jin Miyasaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interactive routing with poly vias
- Patent number 10,445,459
- Issue date Oct 15, 2019
- Cadence Design Systems, Inc.
- Eric Tatara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solderless inter-component joints
- Patent number 10,390,440
- Issue date Aug 20, 2019
- NXP B.V.
- Tsung Nan Lo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board device
- Patent number 10,375,819
- Issue date Aug 6, 2019
- Lapis Semiconductor Co., Ltd.
- Kentaro Toda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with adhesion promoting shape of wiring structure
- Patent number 10,349,521
- Issue date Jul 9, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Voraberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board, printed circuit board structure and...
- Patent number 10,321,561
- Issue date Jun 11, 2019
- Avary Holding (Shenzhen) Co., Limited.
- Xian-Qin Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 10,165,673
- Issue date Dec 25, 2018
- Renesas Electronics Corporation
- Tatsuaki Tsukuda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Printed circuit board for transmitting digital signals
- Patent number 10,111,317
- Issue date Oct 23, 2018
- Canon Kabushiki Kaisha
- Yasuhiro Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated electronic assembly for conserving space in a circuit
- Patent number 10,098,231
- Issue date Oct 9, 2018
- Coilcraft, Incorporated
- Stephen Michael Sedio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with coextensive electrical connectors and co...
- Patent number 10,051,733
- Issue date Aug 14, 2018
- SanDisk Technologies Inc.
- Chih-Chin Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Application store model for dynamic reconfiguration of a field-prog...
- Patent number 10,031,993
- Issue date Jul 24, 2018
- Intel Corporation
- Rajesh Poornachandran
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD
- Publication number 20240397606
- Publication date Nov 28, 2024
- Omron Corporation
- Junya MISHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MEMORY MODULE NOTCH AND CONNECTOR-TO-MOTHERBOARD PINS FO...
- Publication number 20240397628
- Publication date Nov 28, 2024
- Intel Corporation
- Landon HANKS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING BOARD AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240298407
- Publication date Sep 5, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Gyumook Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board And Method For Soldering A Chip Housing In A...
- Publication number 20240292514
- Publication date Aug 29, 2024
- LISA DRAXLMAIER GMBH
- Andreas Brinkmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING CIRCUIT ASSEMBLI...
- Publication number 20240237205
- Publication date Jul 11, 2024
- Liquid Wire, LLC
- Mark S. Kruskopf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY IMPROVED PCB FOR SEMICONDUCTOR POWER DIE CONNECTED BY VIA...
- Publication number 20240237208
- Publication date Jul 11, 2024
- Mitsubishi Electric Corporation
- REMI PERRIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240164026
- Publication date May 16, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jung Soo KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING CIRCUIT ASSEMBLI...
- Publication number 20240138062
- Publication date Apr 25, 2024
- Liquid Wire, LLC
- Mark S. Kruskopf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE, FOR EXAMPLE AN OPTICAL PACKAGE, FOR AN INTEGRATED CIRCUIT
- Publication number 20230403791
- Publication date Dec 14, 2023
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT APPARATUS
- Publication number 20230356590
- Publication date Nov 9, 2023
- AUTONETWORKS TECHNOLOGIES, LTD.
- Shinnosuke NAKAGUCHI
- B60 - VEHICLES IN GENERAL
Information Patent Application
INFORMATION HANDLING SYSTEM INTERCHANGEABLE SOLDER PADS
- Publication number 20220322591
- Publication date Oct 6, 2022
- Dell Products L.P.
- Yu-Lin Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC APPARATUS USING THE SAME
- Publication number 20220312579
- Publication date Sep 29, 2022
- Realtek Semiconductor Corp.
- CHIN-YUAN LO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSMITTING DATA SIGNALS ON SEPARATE LAYERS OF A MEMORY MODULE, AN...
- Publication number 20210358526
- Publication date Nov 18, 2021
- Micron Technology, Inc.
- Yogesh Sharma
- G11 - INFORMATION STORAGE
Information Patent Application
SURFACE MOUNT TECHNOLOGY RELIABILITY MONITORING SYSTEM
- Publication number 20210282272
- Publication date Sep 9, 2021
- BAE Systems Controls Inc.
- Kevin E. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMITTING DATA SIGNALS ON SEPARATE LAYERS OF A MEMORY MODULE, AN...
- Publication number 20200402547
- Publication date Dec 24, 2020
- Micron Technology, Inc.
- Yogesh Sharma
- G11 - INFORMATION STORAGE
Information Patent Application
INFORMATION HANDLING SYSTEM INTERCHANGEABLE SOLDER PADS
- Publication number 20200390012
- Publication date Dec 10, 2020
- Dell Products L.P.
- Yu-Lin Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20200196432
- Publication date Jun 18, 2020
- Mitsubishi Electric Corporation
- Yuki HATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, CIRCUIT BOARD WITH INTEGRATED CIRCUIT, AND DISP...
- Publication number 20200006216
- Publication date Jan 2, 2020
- LG Display Co., Ltd.
- Jungjae KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHODS FOR ENHANCING SIGNALING BANDWIDTH IN AN INTEG...
- Publication number 20190313523
- Publication date Oct 10, 2019
- Marvell World Trade Ltd.
- Thomas T. Ngo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Adhesion Promoting Shape of Wiring Structure
- Publication number 20190274218
- Publication date Sep 5, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Voraberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERLESS INTER-COMPONENT JOINTS
- Publication number 20190239361
- Publication date Aug 1, 2019
- NXP B.V.
- Tsung Nan Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Adhesion Promoting Shape of Wiring Structure
- Publication number 20180132354
- Publication date May 10, 2018
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Voraberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20160135326
- Publication date May 12, 2016
- Samsung Electronics Co., Ltd.
- Won-young KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING COMPONENTS IN COMPONENT RECEIVING CAVIT...
- Publication number 20150332995
- Publication date Nov 19, 2015
- STMicroelectronics Pte Ltd
- Kim-Yong GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Design for Semiconductor Packages and Method of Forming Same
- Publication number 20150235915
- Publication date Aug 20, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR VOID REDUCTION IN A SOLDER JOINT
- Publication number 20140328039
- Publication date Nov 6, 2014
- Paul J. Koep
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATTENUATION REDUCTION GROUNDING PATTERN STRUCTURE FOR CONNECTION PA...
- Publication number 20140318833
- Publication date Oct 30, 2014
- ADVANCED FLEXBLE CIRCUITS CO., LTD.
- CHING-CHENG TIEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL MODULE
- Publication number 20140286614
- Publication date Sep 25, 2014
- FUJITSU OPTICAL COMPONENTS LIMITED
- Shinichi AOKI
- G02 - OPTICS
Information Patent Application
Primary circuit board non-conductive void having different planar d...
- Publication number 20140213077
- Publication date Jul 31, 2014
- International Business Machines Corporation
- Wai M. Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HAVING CIRCUIT BOARD WITH CO-LAYOUT DESIGN OF MUL...
- Publication number 20140137065
- Publication date May 15, 2014
- MEDIATEK INC.
- Huai-Yuan Feng
- G06 - COMPUTING CALCULATING COUNTING

Leaded Integrated Circuit [IC] package

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Techniques for reducing an eddy current in a ground plane of a core...

Reconfigurable circuit devices

Circuit board devices with reconfigurable connections

Information handling system interchangeable solder pads

Exposed pad integrated circuit package

Circuit board and electronic apparatus using the same

Information handling system interchangeable solder pads

Semiconductor apparatus

Exposed pad integrated circuit package

Integrated circuit, circuit board with integrated circuit, and disp...

Transmitting data signals on separate layers of a memory module, an...

Component carrier with adhesion promoting shape of wiring structure

Low-cost superior performance coinless RF power amplifier

Apparatus and methods for enhancing signaling bandwidth in an integ...

Method for manufacturing flexible printed circuit board

Circuit boards and circuit board assemblies

Electronic device

Axial flow fan and electronic device

Solder component

Printed circuit board

Interactive routing with poly vias

Solderless inter-component joints

Circuit board device

Component carrier with adhesion promoting shape of wiring structure

Flexible printed circuit board, printed circuit board structure and...

Electronic device

Printed circuit board for transmitting digital signals

Integrated electronic assembly for conserving space in a circuit

Printed circuit board with coextensive electrical connectors and co...

Application store model for dynamic reconfiguration of a field-prog...

Patents Applicationslast 30 patents

MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD

CONDUCTIVE MEMORY MODULE NOTCH AND CONNECTOR-TO-MOTHERBOARD PINS FO...

CONNECTING BOARD AND MANUFACTURING METHOD OF THE SAME

Printed Circuit Board And Method For Soldering A Chip Housing In A...

DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING CIRCUIT ASSEMBLI...

THERMALLY IMPROVED PCB FOR SEMICONDUCTOR POWER DIE CONNECTED BY VIA...

PRINTED CIRCUIT BOARD

DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING CIRCUIT ASSEMBLI...

PACKAGE, FOR EXAMPLE AN OPTICAL PACKAGE, FOR AN INTEGRATED CIRCUIT

CIRCUIT APPARATUS

INFORMATION HANDLING SYSTEM INTERCHANGEABLE SOLDER PADS

CIRCUIT BOARD AND ELECTRONIC APPARATUS USING THE SAME

TRANSMITTING DATA SIGNALS ON SEPARATE LAYERS OF A MEMORY MODULE, AN...

SURFACE MOUNT TECHNOLOGY RELIABILITY MONITORING SYSTEM

TRANSMITTING DATA SIGNALS ON SEPARATE LAYERS OF A MEMORY MODULE, AN...

INFORMATION HANDLING SYSTEM INTERCHANGEABLE SOLDER PADS

SEMICONDUCTOR APPARATUS

INTEGRATED CIRCUIT, CIRCUIT BOARD WITH INTEGRATED CIRCUIT, AND DISP...

APPARATUS AND METHODS FOR ENHANCING SIGNALING BANDWIDTH IN AN INTEG...

Component Carrier With Adhesion Promoting Shape of Wiring Structure

SOLDERLESS INTER-COMPONENT JOINTS

Component Carrier With Adhesion Promoting Shape of Wiring Structure

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE INCLUDING COMPONENTS IN COMPONENT RECEIVING CAVIT...

Substrate Design for Semiconductor Packages and Method of Forming Same

SYSTEMS AND METHODS FOR VOID REDUCTION IN A SOLDER JOINT

ATTENUATION REDUCTION GROUNDING PATTERN STRUCTURE FOR CONNECTION PA...

OPTICAL MODULE

Primary circuit board non-conductive void having different planar d...

ELECTRONIC DEVICE HAVING CIRCUIT BOARD WITH CO-LAYOUT DESIGN OF MUL...