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Leadless chip

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  • H05K2201/10636
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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10636Leadless chip
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    ELECTRIC ASSEMBLY COMPRISING TWO PRINTED CIRCUIT BOARDS
    • Publication number 20240381534
    • Publication date Nov 14, 2024
    • Endress+Hauser SE+Co. KG
    • Romuald Girardey
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240306303
    • Publication date Sep 12, 2024
    • Innolux Corporation
    • Jen-Hai Chi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DECOUPLING CAPACITOR BOOSTER MODULE
    • Publication number 20240260193
    • Publication date Aug 1, 2024
    • Intel Corporation
    • Herh Nan Chen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
    • Publication number 20240237195
    • Publication date Jul 11, 2024
    • InnoLux Corporation
    • Ker-Yih KAO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COMPOSITE ELECTRONIC COMPONENT
    • Publication number 20240222026
    • Publication date Jul 4, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Dae Heon JEONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE COMPRISING CAMERA MODULE
    • Publication number 20240205530
    • Publication date Jun 20, 2024
    • Samsung Electronics Co., Ltd.
    • Sewon KIM
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    ELECTRONIC COMPONENT AND BOARD HAVING ELECTRONIC COMPONENT MOUNTED...
    • Publication number 20240196523
    • Publication date Jun 13, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Heung Kil PARK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER MODULE AND APPARATUS
    • Publication number 20240194390
    • Publication date Jun 13, 2024
    • Delta Electronics, Inc.
    • Yahong Xiong
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    NON-UNIFORM SURFACE MOUNT PADS
    • Publication number 20240164018
    • Publication date May 16, 2024
    • Dell Products L.P.
    • Umesh CHANDRA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC MODULE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURIN...
    • Publication number 20240147624
    • Publication date May 2, 2024
    • Canon Kabushiki Kaisha
    • NORITAKE TSUBOI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    APPARATUS AND POWER MODULE
    • Publication number 20240096543
    • Publication date Mar 21, 2024
    • DELTA ELECTRONICS, INC.
    • Yahong Xiong
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    THERMAL MANAGEMENT FOR FLAT NO LEAD PACKAGES
    • Publication number 20240090131
    • Publication date Mar 14, 2024
    • HAMILTON SUNDSTRAND CORPORATION
    • Alexander Trotman
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LEADLESS CURRENT SENSOR PACKAGE WITH HIGH ISOLATION
    • Publication number 20240044946
    • Publication date Feb 8, 2024
    • ALLEGRO MICROSYSTEMS, LLC
    • Robert A. Briano
    • G01 - MEASURING TESTING
  • Information Patent Application

    STACKED COMPONENT ARRAY STRUCTURE
    • Publication number 20240015887
    • Publication date Jan 11, 2024
    • Tesla, Inc.
    • Jin Zhao
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DIRECT WRITE DUAL CURE GASKET
    • Publication number 20240002692
    • Publication date Jan 4, 2024
    • Raytheon Company
    • Susan C. Trulli
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE
    • Publication number 20230403796
    • Publication date Dec 14, 2023
    • Canon Kabushiki Kaisha
    • Noritake Tsuboi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CONDUCTIVE MODULE
    • Publication number 20230389188
    • Publication date Nov 30, 2023
    • YAZAKI CORPORATION
    • Hidehiko Shimizu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONDUCTIVE MODULE
    • Publication number 20230389187
    • Publication date Nov 30, 2023
    • YAZAKI CORPORATION
    • Hidehiko Shimizu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT AND ELECTRONIC DEVICE
    • Publication number 20230337362
    • Publication date Oct 19, 2023
    • HUAWEI TECHNOLOGIES CO., LTD.
    • Hongbin SHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MOUNTING STRUCTURE AND MOUNTING METHOD OF ELECTRONIC COMPONENT
    • Publication number 20230298814
    • Publication date Sep 21, 2023
    • Murata Manufacturing Co., Ltd.
    • Daichi SATOU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TOMBSTONE PREVENTION FOR A SURFACE MOUNT DEVICE
    • Publication number 20230284388
    • Publication date Sep 7, 2023
    • Western Digital Technologies, Inc.
    • Joyce Chen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    EMBEDDED PRINTED CIRCUIT BOARD
    • Publication number 20230276575
    • Publication date Aug 31, 2023
    • Shinko Electric Industries Co., Ltd.
    • Yukinori HATORI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COMPONENT BUILT-IN SUBSTRATE
    • Publication number 20230223197
    • Publication date Jul 13, 2023
    • Murata Manufacturing Co., Ltd.
    • Yuichiro TANAKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, MOVING BODY, AND...
    • Publication number 20230164915
    • Publication date May 25, 2023
    • Mitsubishi Electric Corporation
    • Takeshi HIGASHIHATA
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    SEMICONDUCTOR PACKAGES
    • Publication number 20230115957
    • Publication date Apr 13, 2023
    • Samsung Electronics Co., Ltd.
    • KIJU LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
    • Publication number 20230060577
    • Publication date Mar 2, 2023
    • Showa Denko Materials Co., Ltd.
    • Kunihiko AKAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SUBSTRATE WITH BURIED COMPONENT AND MANUFACTURE METHOD THEREOF
    • Publication number 20230058180
    • Publication date Feb 23, 2023
    • Unimicron Technology Corp.
    • Yu-Shen Chen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD WITH COMPACT PASSIVE COMPONENT ARRANGEMENT
    • Publication number 20230047285
    • Publication date Feb 16, 2023
    • ADVANCED MICRO DEVICES, INC.
    • MILIND S. BHAGAVAT
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING ELECTRONIC COMPONENT
    • Publication number 20220386467
    • Publication date Dec 1, 2022
    • Murata Manufacturing Co., Ltd.
    • Satoshi YOKOMIZO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20220375677
    • Publication date Nov 24, 2022
    • Delta Electronics, Inc.
    • Yahong Xiong
    • G05 - CONTROLLING REGULATING