Leads attached onto leadless component after manufacturing the component

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CPC
H05K2201/10946

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10946Leads attached onto leadless component after manufacturing the component

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Optical surface-mount devices
- Patent number 11,252,821
- Issue date Feb 15, 2022
- CoreLED Systems, LLC
- Brian C. Wells
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic electronic component, method of producing the same, and ele...
- Patent number 10,854,388
- Issue date Dec 1, 2020
- Taiyo Yuden Co., Ltd.
- Masaki Mochigi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density multi-component packages
- Patent number 10,757,810
- Issue date Aug 25, 2020
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component and board having the same
- Patent number 10,734,161
- Issue date Aug 4, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Beom Joon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density multi-component packages
- Patent number 10,681,814
- Issue date Jun 9, 2020
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component and mounting structure thereof
- Patent number 10,580,577
- Issue date Mar 3, 2020
- Murata Manufacturing Co., Ltd.
- Teppei Akiyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component and mounting structure thereof
- Patent number 10,573,459
- Issue date Feb 25, 2020
- Murata Manufacturing Co., Ltd.
- Teppei Akiyoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component, board having the same, and method of manufact...
- Patent number 10,553,355
- Issue date Feb 4, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Jae Young Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component having a connection element
- Patent number 10,249,435
- Issue date Apr 2, 2019
- Robert Bosch GmbH
- Thomas Peuser
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Electronic device
- Patent number 9,911,535
- Issue date Mar 6, 2018
- TDK Corporation
- Masahiro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor having terminal electrodes and board h...
- Patent number 9,842,699
- Issue date Dec 12, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter and method for manufacturing the same
- Patent number 9,819,263
- Issue date Nov 14, 2017
- Delta Electronics, Inc.
- Jian-Hong Zeng
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Multilayer ceramic electronic component and board having the same
- Patent number 9,818,541
- Issue date Nov 14, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component and board having the same
- Patent number 9,697,953
- Issue date Jul 4, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic component and board having the same
- Patent number 9,659,710
- Issue date May 23, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic component and board having the same
- Patent number 9,646,769
- Issue date May 9, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component with metal terminal
- Patent number 9,640,321
- Issue date May 2, 2017
- TDK Corporation
- Sunao Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor having terminal electrodes and board h...
- Patent number 9,607,769
- Issue date Mar 28, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic part and electronic control unit
- Patent number 9,425,016
- Issue date Aug 23, 2016
- Denso Corporation
- Toru Itabashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part and electronic control unit
- Patent number 9,368,309
- Issue date Jun 14, 2016
- Denso Corporation
- Yuki Mikami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part and electronic control unit
- Patent number 9,332,645
- Issue date May 3, 2016
- Denso Corporation
- Yuuto Kamiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part and electronic control unit
- Patent number 9,224,563
- Issue date Dec 29, 2015
- Denso Corporation
- Toru Itabashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System in package assembly
- Patent number 9,119,320
- Issue date Aug 25, 2015
- QUANTA COMPUTER INC.
- Li-Cheng Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adapter for plated through hole mounting of surface mount component
- Patent number 8,902,605
- Issue date Dec 2, 2014
- International Business Machines Corporation
- Daniel J. Buschel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic capacitor and electronic component including the same
- Patent number 8,797,712
- Issue date Aug 5, 2014
- Murata Manufacturing Co., Ltd.
- Hideki Otsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component, board unit, and information-processing device
- Patent number 8,547,706
- Issue date Oct 1, 2013
- Fujitsu Limited
- Hiroaki Tamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low profile compliant leads
- Patent number 8,481,862
- Issue date Jul 9, 2013
- General Dynamics Advanced Information Systems, Inc.
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,378,231
- Issue date Feb 19, 2013
- Ibiden Co., Ltd.
- Kiyotaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Probe card assembly and kit, and methods of making same
- Patent number 8,373,428
- Issue date Feb 12, 2013
- FormFactor, Inc.
- Benjamin N. Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer capacitor and method of manufacturing same
- Patent number 8,315,035
- Issue date Nov 20, 2012
- TDK Corporation
- Masaaki Togashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THERMAL MANAGEMENT FOR FLAT NO LEAD PACKAGES
- Publication number 20240090131
- Publication date Mar 14, 2024
- HAMILTON SUNDSTRAND CORPORATION
- Alexander Trotman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME MOUNTING WITH LEAD INSERTION FOR LEAD WALL BONDING
- Publication number 20240090130
- Publication date Mar 14, 2024
- Semiconductor Components Industries, LLC
- Chad CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20240040702
- Publication date Feb 1, 2024
- HITACHI,ASTEMO, LTD.
- Takeshi TOKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SURFACE-MOUNT DEVICES
- Publication number 20210051802
- Publication date Feb 18, 2021
- CoreLED Systems, LLC
- Brian C. Wells
- G02 - OPTICS
Information Patent Application
ELECTRONIC COMPONENT, BOARD HAVING THE SAME, AND METHOD OF MANUFACT...
- Publication number 20180268996
- Publication date Sep 20, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Jae Young NA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnect Device and Assemblies Made Therewith
- Publication number 20140262498
- Publication date Sep 18, 2014
- USA as represented by the Administrator of the National Aeronautics and Space...
- Jim D. Hester
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PART AND ELECTRONIC CONTROL UNIT
- Publication number 20140240942
- Publication date Aug 28, 2014
- Murata Manufacturing Co., Ltd.
- Toru ITABASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PART AND ELECTRONIC CONTROL UNIT
- Publication number 20140238732
- Publication date Aug 28, 2014
- Murata Manufacturing Co., Ltd.
- Toru ITABASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PART AND ELECTRONIC CONTROL UNIT
- Publication number 20140240885
- Publication date Aug 28, 2014
- Murata Manufacturing Co., Ltd.
- Yuuto KAMIYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PART AND ELECTRONIC CONTROL UNIT
- Publication number 20140240941
- Publication date Aug 28, 2014
- Murata Manufacturing Co., Ltd.
- Yuki MIKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECHARGEABLE BATTERY PACK
- Publication number 20140205864
- Publication date Jul 24, 2014
- Samsung SDI Co., Ltd.
- Sang-Il Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED POWER MODULE FOR GRAPHICS PROCESSING UNIT
- Publication number 20140185214
- Publication date Jul 3, 2014
- Zhen Jia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STACKED-TYPE MULTILAYER CERAMIC ELECTRONIC COMPONENT, STACKED-TYPE...
- Publication number 20140160622
- Publication date Jun 12, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Hae Sock CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT
- Publication number 20140048925
- Publication date Feb 20, 2014
- HON HAI Precision Industry CO., LTD.
- Meng-Che Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adapter For Plated Through Hole Mounting Of Surface Mount Component
- Publication number 20130337697
- Publication date Dec 19, 2013
- International Business Machines Corporation
- Daniel J. Buschel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM IN PACKAGE ASSEMBLY
- Publication number 20130271924
- Publication date Oct 17, 2013
- Quanta Computer Inc.
- Li-Cheng Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC CAPACITOR AND ELECTRONIC COMPONENT INCLUDING THE SAME
- Publication number 20120262838
- Publication date Oct 18, 2012
- Murata Manufacturing Co., Ltd.
- Hideki OTSUKA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
THERMAL FLEX CONTACT CARRIERS #2
- Publication number 20120012365
- Publication date Jan 19, 2012
- GABE CHERIAN
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC COMPONENT, BOARD UNIT, AND INFORMATION-PROCESSING DEVICE
- Publication number 20110075386
- Publication date Mar 31, 2011
- Fujitsu Limited
- Hiroaki Tamura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
INVERTER DEVICE
- Publication number 20110006718
- Publication date Jan 13, 2011
- Mitsubishi Heavy Industries, Ltd.
- Kazunori Teshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE HAVING LEADS
- Publication number 20100300742
- Publication date Dec 2, 2010
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Ihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC DEVICE MOUNTING...
- Publication number 20100193939
- Publication date Aug 5, 2010
- Shinko Electric Industries Co., Ltd.
- Yuichi TAGUCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTILAYER CAPACITOR AND METHOD OF MANUFACTURING SAME
- Publication number 20100188798
- Publication date Jul 29, 2010
- TDK Corporation
- Masaaki TOGASHI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
AREA ARRAY ADAPTOR
- Publication number 20100167560
- Publication date Jul 1, 2010
- Charles V. DeSantis
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
POP PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20100136745
- Publication date Jun 3, 2010
- Sung-Wook Hwang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CERAMIC CAPACITOR AND ELECTRONIC COMPONENT INCLUDING THE SAME
- Publication number 20100123995
- Publication date May 20, 2010
- Murata Manufacturing Co., Ltd.
- Hideki OTSUKA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
THERMALLY DECOUPLING FUSE HOLDER AND ASSEMBLY
- Publication number 20100090792
- Publication date Apr 15, 2010
- LITTELFUSE, INC.
- Stephen J. Whitney
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
STACKED MULTILAYER CAPACITOR
- Publication number 20100053842
- Publication date Mar 4, 2010
- Daniel Devoe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100027228
- Publication date Feb 4, 2010
- IBIDEN CO., LTD.
- Kiyotaka TSUKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROBE CARD ASSEMBLY AND KIT, AND METHODS OF MAKING SAME
- Publication number 20090291573
- Publication date Nov 26, 2009
- FormFactor, Inc.
- Benjamin N. Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Leads attached onto leadless component after manufacturing the component

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Optical surface-mount devices

Ceramic electronic component, method of producing the same, and ele...

High density multi-component packages

Multilayer electronic component and board having the same

High density multi-component packages

Multilayer ceramic electronic component and mounting structure thereof

Multilayer ceramic electronic component and mounting structure thereof

Electronic component, board having the same, and method of manufact...

Electronic component having a connection element

Electronic device

Multilayer ceramic capacitor having terminal electrodes and board h...

Power converter and method for manufacturing the same

Multilayer ceramic electronic component and board having the same

Multilayer ceramic electronic component and board having the same

Multilayer ceramic component and board having the same

Multilayer ceramic component and board having the same

Ceramic electronic component with metal terminal

Multilayer ceramic capacitor having terminal electrodes and board h...

Electronic part and electronic control unit

Electronic part and electronic control unit

Electronic part and electronic control unit

Electronic part and electronic control unit

System in package assembly

Adapter for plated through hole mounting of surface mount component

Ceramic capacitor and electronic component including the same

Electronic component, board unit, and information-processing device

Low profile compliant leads

Semiconductor device and method for manufacturing the same

Probe card assembly and kit, and methods of making same

Multilayer capacitor and method of manufacturing same

Patents Applicationslast 30 patents

THERMAL MANAGEMENT FOR FLAT NO LEAD PACKAGES

LEADFRAME MOUNTING WITH LEAD INSERTION FOR LEAD WALL BONDING

POWER SEMICONDUCTOR DEVICE

OPTICAL SURFACE-MOUNT DEVICES

ELECTRONIC COMPONENT, BOARD HAVING THE SAME, AND METHOD OF MANUFACT...

Interconnect Device and Assemblies Made Therewith

ELECTRONIC PART AND ELECTRONIC CONTROL UNIT

ELECTRONIC PART AND ELECTRONIC CONTROL UNIT

ELECTRONIC PART AND ELECTRONIC CONTROL UNIT

ELECTRONIC PART AND ELECTRONIC CONTROL UNIT

RECHARGEABLE BATTERY PACK

STACKED POWER MODULE FOR GRAPHICS PROCESSING UNIT

STACKED-TYPE MULTILAYER CERAMIC ELECTRONIC COMPONENT, STACKED-TYPE...

INTEGRATED CIRCUIT

Adapter For Plated Through Hole Mounting Of Surface Mount Component

SYSTEM IN PACKAGE ASSEMBLY

CERAMIC CAPACITOR AND ELECTRONIC COMPONENT INCLUDING THE SAME

THERMAL FLEX CONTACT CARRIERS #2

ELECTRONIC COMPONENT, BOARD UNIT, AND INFORMATION-PROCESSING DEVICE

INVERTER DEVICE

SUBSTRATE HAVING LEADS

WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC DEVICE MOUNTING...

MULTILAYER CAPACITOR AND METHOD OF MANUFACTURING SAME

AREA ARRAY ADAPTOR

POP PACKAGE AND METHOD OF FABRICATING THE SAME

CERAMIC CAPACITOR AND ELECTRONIC COMPONENT INCLUDING THE SAME

THERMALLY DECOUPLING FUSE HOLDER AND ASSEMBLY

STACKED MULTILAYER CAPACITOR

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

PROBE CARD ASSEMBLY AND KIT, AND METHODS OF MAKING SAME