Leads having locally deformed portion

Industry

CPC
H05K2201/1078

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/1078Leads having locally deformed portion

Industries

Patents Grantslast 30 patents

Information Patent Grant
Shielding shell
- Patent number 11,862,898
- Issue date Jan 2, 2024
- Dongguan Luxshare Technologies Co., Ltd.
- Tao Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane connector with improved mounting block
- Patent number 11,769,968
- Issue date Sep 26, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Xiaogang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane connector
- Patent number 11,749,948
- Issue date Sep 5, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Tao Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal module and backplane connector having the terminal module
- Patent number 11,710,929
- Issue date Jul 25, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Xiaogang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal module and backplane connector having the terminal module
- Patent number 11,710,930
- Issue date Jul 25, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Xiaogang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane connector with improved structure strength
- Patent number 11,710,931
- Issue date Jul 25, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Xiaogang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane connector assembly with improved shielding effect
- Patent number 11,705,671
- Issue date Jul 18, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Xiaogang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane connector with improved shielding effect
- Patent number 11,705,670
- Issue date Jul 18, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Xiaogang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane connector
- Patent number 11,699,880
- Issue date Jul 11, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Tao Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal module and backplane connector having the terminal module
- Patent number 11,699,881
- Issue date Jul 11, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Xiaogang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane connector with improved shielding effect
- Patent number 11,699,882
- Issue date Jul 11, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- Xiaogang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Short interconnect assembly with strip elastomer
- Patent number 11,696,396
- Issue date Jul 4, 2023
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Short interconnect assembly with strip elastomer
- Patent number 11,674,977
- Issue date Jun 13, 2023
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- G01 - MEASURING TESTING
Information Patent Grant
Low noise relay
- Patent number 11,476,069
- Issue date Oct 18, 2022
- Hyundai Motor Company
- Jong Joo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Short interconnect assembly with strip elastomer
- Patent number 11,266,015
- Issue date Mar 1, 2022
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Press-fit terminal and electronic device including press-fit terminal
- Patent number 10,680,360
- Issue date Jun 9, 2020
- Denso Corporation
- Yuki Yagyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,602,613
- Issue date Mar 24, 2020
- Omron Corporation
- Seiki Shimoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor module and power semiconductor device
- Patent number 10,561,021
- Issue date Feb 11, 2020
- Fuji Electric Co., Ltd.
- Kenshi Terashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer electronic component and board having the same
- Patent number 10,460,875
- Issue date Oct 29, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component and board having the same
- Patent number 10,347,425
- Issue date Jul 9, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wiring board and wiring board
- Patent number 10,321,582
- Issue date Jun 11, 2019
- Olympus Corporation
- Jumpei Yoneyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Special electric component, printed circuit board assembly, and met...
- Patent number 10,264,679
- Issue date Apr 16, 2019
- The Procter & Gamble Company
- Christian Ellsaesser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor device
- Patent number 10,229,867
- Issue date Mar 12, 2019
- Mitsubishi Electric Corporation
- Shinya Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete device
- Patent number 10,201,087
- Issue date Feb 5, 2019
- Infineon Technologies Austria AG
- Fabio Brucchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldered interconnect for a printed circuit board having an angular...
- Patent number 10,096,915
- Issue date Oct 9, 2018
- MERCURY SYSTEMS, INC.
- Darryl J. McKenney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods for solder flow control in three-dimensional mi...
- Patent number 10,076,042
- Issue date Sep 11, 2018
- NUVOTRONICS, INC.
- David W. Sherrer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wiring substrate and manufacturing method thereof
- Patent number 9,980,364
- Issue date May 22, 2018
- Yazaki Corporation
- Akira Harao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical devices with solder dam
- Patent number 9,949,378
- Issue date Apr 17, 2018
- Presidio Components, Inc.
- Hung Van Trinh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical devices and methods for manufacturing same
- Patent number 9,936,589
- Issue date Apr 3, 2018
- Presidio Components, Inc.
- Hung Van Trinh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and manufacturing method thereof
- Patent number 9,888,558
- Issue date Feb 6, 2018
- Yazaki Corporation
- Akira Harao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20240040702
- Publication date Feb 1, 2024
- HITACHI,ASTEMO, LTD.
- Takeshi TOKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER
- Publication number 20220390488
- Publication date Dec 8, 2022
- JF Microtechnology Sdn. Bhd.
- Wei Kuong FOONG
- G01 - MEASURING TESTING
Information Patent Application
ELECTRICAL AND/OR ELECTRONIC COMPONENT AND CONTACT SYSTEM
- Publication number 20220270956
- Publication date Aug 25, 2022
- Robert Bosch GmbH
- Thomas Suenner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER
- Publication number 20220151063
- Publication date May 12, 2022
- JF Microtechnology Sdn. Bhd.
- Wei Kuong FOONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER
- Publication number 20210392746
- Publication date Dec 16, 2021
- JF Microtechnology Sdn. Bhd.
- Wei Kuong FOONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low Noise Relay
- Publication number 20200395181
- Publication date Dec 17, 2020
- Hyundai Motor Company
- Jong Joo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRESS-FIT TERMINAL AND ELECTRONIC DEVICE INCLUDING PRESS-FIT TERMINAL
- Publication number 20190312367
- Publication date Oct 10, 2019
- DENSO CORPORATION
- Yuki YAGYU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SEMICONDUCTOR MODULE AND POWER SEMICONDUCTOR DEVICE
- Publication number 20180338376
- Publication date Nov 22, 2018
- Fuji Electric Co., Ltd.
- Kenshi TERASHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION COMPONENT, CONNECTOR, MANUFACTURING METHOD FOR THE SAME...
- Publication number 20180331170
- Publication date Nov 15, 2018
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., L TD
- Kui XU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
- Publication number 20180323010
- Publication date Nov 8, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE DEVICE
- Publication number 20180288878
- Publication date Oct 4, 2018
- Infineon Technologies Austria AG
- Fabio Brucchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20160205763
- Publication date Jul 14, 2016
- YAZAKI CORPORATION
- Akira HARAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20140268581
- Publication date Sep 18, 2014
- YAZAKI CORPORATION
- Akira HARAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20140262451
- Publication date Sep 18, 2014
- YAZAKI CORPORATION
- Akira HARAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Discrete-Pin Printed-Circuit Mounting with Notches
- Publication number 20140160681
- Publication date Jun 12, 2014
- Wintec Industries, Inc.
- Kong-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN CONNECTOR STRUCTURE AND METHOD
- Publication number 20130342986
- Publication date Dec 26, 2013
- Tsung-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXING MEANS FOR INSTALLING A PLURALITY OF OUTPUT CABLES ONTO A CIR...
- Publication number 20130155634
- Publication date Jun 20, 2013
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Shengyao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD UNIT
- Publication number 20120181077
- Publication date Jul 19, 2012
- SHINANO KENSHI CO., LTD.
- Kazuya MIYASAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20110299250
- Publication date Dec 8, 2011
- YAZAKI CORPORATION
- Akira HARAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder and Lead Free Electronic Circuit and Method of Manufacturing...
- Publication number 20110299288
- Publication date Dec 8, 2011
- Carmen Rapisarda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
LEADFRAME FOR LEADLESS PACKAGE, STRUCTURE AND MANUFACTURING METHOD...
- Publication number 20110136299
- Publication date Jun 9, 2011
- CHIPMOS TECHNOLOGIES INC.
- Chun Ying Lin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
LEADFRAME FOR LEADLESS PACKAGE, STRUCTURE AND MANUFACTURING METHOD...
- Publication number 20110133322
- Publication date Jun 9, 2011
- CHIPMOS TECHNOLOGIES INC.
- Chun Ying Lin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC COMPONENT, BOARD UNIT, AND INFORMATION-PROCESSING DEVICE
- Publication number 20110075386
- Publication date Mar 31, 2011
- Fujitsu Limited
- Hiroaki Tamura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
INTEGRATION OF SMD COMPONENTS IN AN IC HOUSING
- Publication number 20110068460
- Publication date Mar 24, 2011
- Felix SCHINNER
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Surface mount contact
- Publication number 20110059633
- Publication date Mar 10, 2011
- Power Mate Technology Co., Ltd.
- Lien-Hsing CHEN
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Solder and Lead-Free Electronic Circuit and Method of Manufacturing...
- Publication number 20100208425
- Publication date Aug 19, 2010
- Carmen Rapisarda
- A43 - FOOTWEAR
Information Patent Application
WIRING BOARD HAVING LEAD PIN, AND LEAD PIN
- Publication number 20100139970
- Publication date Jun 10, 2010
- Shinko Electric Industries Co., Ltd.
- Kazuhiro Oshima
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CONNECTION DEVICE
- Publication number 20100093197
- Publication date Apr 15, 2010
- FCI
- Reinhard Sander
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BATTERY PACK
- Publication number 20090246615
- Publication date Oct 1, 2009
- Samsung SDI Co., Ltd
- Junyoung Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LED ASSEMBLY INCORPORATING A STRUCTURE FOR PREVENTING SOLDER CONTAM...
- Publication number 20090236617
- Publication date Sep 24, 2009
- FOXCONN TECHNOLOGY CO., LTD.
- CHIN-LONG KU
- F21 - LIGHTING

Leads having locally deformed portion

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Shielding shell

Backplane connector with improved mounting block

Backplane connector

Terminal module and backplane connector having the terminal module

Terminal module and backplane connector having the terminal module

Backplane connector with improved structure strength

Backplane connector assembly with improved shielding effect

Backplane connector with improved shielding effect

Backplane connector

Terminal module and backplane connector having the terminal module

Backplane connector with improved shielding effect

Short interconnect assembly with strip elastomer

Short interconnect assembly with strip elastomer

Low noise relay

Short interconnect assembly with strip elastomer

Press-fit terminal and electronic device including press-fit terminal

Electronic device

Power semiconductor module and power semiconductor device

Multilayer electronic component and board having the same

Multilayer electronic component and board having the same

Method of manufacturing wiring board and wiring board

Special electric component, printed circuit board assembly, and met...

Power semiconductor device

Discrete device

Soldered interconnect for a printed circuit board having an angular...

Devices and methods for solder flow control in three-dimensional mi...

Wiring substrate and manufacturing method thereof

Electrical devices with solder dam

Electrical devices and methods for manufacturing same

Wiring substrate and manufacturing method thereof

Patents Applicationslast 30 patents

POWER SEMICONDUCTOR DEVICE

SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER

ELECTRICAL AND/OR ELECTRONIC COMPONENT AND CONTACT SYSTEM

SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER

SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER

Low Noise Relay

PRESS-FIT TERMINAL AND ELECTRONIC DEVICE INCLUDING PRESS-FIT TERMINAL

POWER SEMICONDUCTOR MODULE AND POWER SEMICONDUCTOR DEVICE

CONNECTION COMPONENT, CONNECTOR, MANUFACTURING METHOD FOR THE SAME...

MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

DISCRETE DEVICE

WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF

WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF

WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF

Discrete-Pin Printed-Circuit Mounting with Notches

PIN CONNECTOR STRUCTURE AND METHOD

FIXING MEANS FOR INSTALLING A PLURALITY OF OUTPUT CABLES ONTO A CIR...

PRINTED CIRCUIT BOARD UNIT

WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF

Solder and Lead Free Electronic Circuit and Method of Manufacturing...

LEADFRAME FOR LEADLESS PACKAGE, STRUCTURE AND MANUFACTURING METHOD...

LEADFRAME FOR LEADLESS PACKAGE, STRUCTURE AND MANUFACTURING METHOD...

ELECTRONIC COMPONENT, BOARD UNIT, AND INFORMATION-PROCESSING DEVICE

INTEGRATION OF SMD COMPONENTS IN AN IC HOUSING

Surface mount contact

Solder and Lead-Free Electronic Circuit and Method of Manufacturing...

WIRING BOARD HAVING LEAD PIN, AND LEAD PIN

CONNECTION DEVICE

BATTERY PACK

LED ASSEMBLY INCORPORATING A STRUCTURE FOR PREVENTING SOLDER CONTAM...