TREA

Leads of a surface mounted component bent for providing a gap between the lead and the pad during soldering

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Industry

  • CPC
  • H05K2201/10772
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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10772Leads of a surface mounted component bent for providing a gap between the lead and the pad during soldering
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    ADAPTER WITH AN INSAULATING BODY HAVING A CIRCUIT BOARD WITH A PLUR...
    • Publication number 20190053376
    • Publication date Feb 14, 2019
    • CHIEF LAND ELECTRONIC CO., LTD.
    • CHUNG-NAN PAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Three-dimensional stack of leaded package and electronic member
    • Publication number 20150348882
    • Publication date Dec 3, 2015
    • INFINEON TECHNOLOGIES AG
    • Alfred Swain Hong YEO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED POWER MODULE FOR GRAPHICS PROCESSING UNIT
    • Publication number 20140185214
    • Publication date Jul 3, 2014
    • Zhen Jia
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    HIGH ASPECT RATIO STACKED MLCC DESIGN
    • Publication number 20130146347
    • Publication date Jun 13, 2013
    • Kemet Electronics Corporation
    • John E. McConnell
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Lead pin for package substrate
    • Publication number 20110014827
    • Publication date Jan 20, 2011
    • Samsung Electro-Mechanics Co., Ltd.
    • Heung Jae Oh
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Attachment Member Surface-Mount Component Comprising the Attachment...
    • Publication number 20100227506
    • Publication date Sep 9, 2010
    • Yuzo Kawahara
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    WIRING BOARD HAVING LEAD PIN, AND LEAD PIN
    • Publication number 20100139970
    • Publication date Jun 10, 2010
    • Shinko Electric Industries Co., Ltd.
    • Kazuhiro Oshima
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Lead pin for package boards
    • Publication number 20100000761
    • Publication date Jan 7, 2010
    • Samsung Electro-Mechanics Co., Ltd.
    • Hueng Jae Oh
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    METHOD AND APPARATUS TO REDUCE PIN VOIDS
    • Publication number 20090250824
    • Publication date Oct 8, 2009
    • Xiwang Qi
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Electronic Component
    • Publication number 20080024960
    • Publication date Jan 31, 2008
    • Matsushita Electric Industrial Co., Ltd.
    • Akio Hidaka
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    ELECTRICAL CONNECTOR AND METHOD OF PRODUCING SAME
    • Publication number 20070117453
    • Publication date May 24, 2007
    • LEAR CORPORATION
    • Slobadan Pavlovic
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    CONNECTOR AND A MOUNTING METHOD THEREFOR
    • Publication number 20070054548
    • Publication date Mar 8, 2007
    • SUMITOMO WIRING SYSTEMS, LTD.
    • Hiroshi Nakano
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    ELECTRICAL CONNECTOR TERMINAL AND METHOD OF PRODUCING SAME
    • Publication number 20060216970
    • Publication date Sep 28, 2006
    • LEAR CORPORATION
    • Slobadan Pavlovic
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Electronic component
    • Publication number 20060113666
    • Publication date Jun 1, 2006
    • DENSO CORPORATION
    • Jun Oonishi
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Surface mount connector and circuit board assembly with same
    • Publication number 20050221636
    • Publication date Oct 6, 2005
    • DELTA ELECTRONICS, INC.
    • Kai-Hung Huang
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Semiconductor package
    • Publication number 20050127494
    • Publication date Jun 16, 2005
    • Advanced Semiconductor Engineering, Inc.
    • Sheng Tsung Liu
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Semiconductor device and its manufacturing method
    • Publication number 20050012187
    • Publication date Jan 20, 2005
    • Koujiro Kameyama
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Connecting structure of printed circuit boards
    • Publication number 20030098339
    • Publication date May 29, 2003
    • Makoto Totani
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method for connecting printed circuit boards and connected printed...
    • Publication number 20030079341
    • Publication date May 1, 2003
    • Toshihiro Miyake
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Circuit component
    • Publication number 20020105790
    • Publication date Aug 8, 2002
    • Takumi Naruse
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Connecting method and connecting structure of printed circuit boards
    • Publication number 20020014518
    • Publication date Feb 7, 2002
    • Makoto Totani
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Metal component carrier
    • Publication number 20010051458
    • Publication date Dec 13, 2001
    • Telefonaktiebolaget LM Ericsson (publ)
    • Ulrika Renmark
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...