Lifting the component during or after mounting Increasing the gap between component and PCB

Industry

CPC
H05K2203/306

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/306Lifting the component during or after mounting Increasing the gap between component and PCB

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module and electronic apparatus
- Patent number 11,818,844
- Issue date Nov 14, 2023
- Canon Kabushiki Kaisha
- Yuya Karakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increasing solder hole-fill in a printed circuit board assembly
- Patent number 9,662,732
- Issue date May 30, 2017
- International Business Machines Corporation
- Stephen M. Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Increasing solder hole-fill in a printed circuit board assembly
- Patent number 9,427,828
- Issue date Aug 30, 2016
- International Business Machines Corporation
- Stephen M. Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method of manufacturing same
- Patent number 8,872,335
- Issue date Oct 28, 2014
- Infineon Technologies AG
- Holger Huebner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
OC2 oriented connections 2
- Patent number 8,125,790
- Issue date Feb 28, 2012
- Gabe Cherian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device mounting structure, manufacturing method, and...
- Patent number 7,969,028
- Issue date Jun 28, 2011
- Panasonic Corporation
- Hisahiko Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting board, height adjusting apparatus and mounting method
- Patent number 7,872,875
- Issue date Jan 18, 2011
- Fujitsu Limited
- Tsuyoshi So
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering method for mounting semiconductor device on wiring board...
- Patent number 7,861,913
- Issue date Jan 4, 2011
- NEC Electronics Corporation
- Shinichi Miyazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method to increase die stand-off height
- Patent number 7,598,124
- Issue date Oct 6, 2009
- Texas Instruments Incorporated
- Charles Anthony Odegard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Head gimbal assembly with flying height controller, disk drive unit...
- Patent number 7,551,386
- Issue date Jun 23, 2009
- Sae Magnetics (H.K.) Ltd.
- Minggao Yao
- G11 - INFORMATION STORAGE
Information Patent Grant
Temperature-activated self-extending surface mount attachment struc...
- Patent number 7,530,820
- Issue date May 12, 2009
- Myoungsoo Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Oriented connections for leadless and leaded packages
- Patent number 7,433,201
- Issue date Oct 7, 2008
- Gabe Cherian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Increased stand-off height integrated circuit assemblies, systems,...
- Patent number 7,393,719
- Issue date Jul 1, 2008
- Texas Instruments Incorporated
- Charles Anthony Odegard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for attaching an IC package to a PCB assembly
- Patent number 7,371,673
- Issue date May 13, 2008
- Texas Instruments Incorporated
- Akira Matsunami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method to increase die stand-off height
- Patent number 7,224,071
- Issue date May 29, 2007
- Texas Instruments Incorporated
- Charles Anthony Odegard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device to elongate a solder joint
- Patent number 7,178,711
- Issue date Feb 20, 2007
- Agency for Science, Technology and Research
- Ee Hua Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic packages with elongated solder interconnections
- Patent number 7,078,819
- Issue date Jul 18, 2006
- Tessera, Inc.
- Thomas H. DiStefano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of using pre-applied underfill encapsulant
- Patent number 7,047,633
- Issue date May 23, 2006
- National Starch and Chemical Investment Holding, Corporation
- Paul Morganelli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of reforming reformable members of an electronic package and...
- Patent number 7,014,094
- Issue date Mar 21, 2006
- International Business Machines Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of reforming reformable members of an electronic package and...
- Patent number 6,978,542
- Issue date Dec 27, 2005
- International Business Machines Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, method for manufacturing an electronic equipm...
- Patent number 6,905,911
- Issue date Jun 14, 2005
- Mitsubishi Denki Kabushiki Kaisha
- Tsuneo Hamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Zero insertion force heat-activated retention pin
- Patent number 6,764,325
- Issue date Jul 20, 2004
- Intel Corporation
- George Arrigotti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounted member and repair method thereof
- Patent number 6,675,474
- Issue date Jan 13, 2004
- Matsushita Electric Industrial Co., Ltd.
- Tsutomu Mitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array IC package and manufacturing method thereof
- Patent number 6,642,626
- Issue date Nov 4, 2003
- Hynix Semiconductor Inc.
- Sang Wook Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, method for manufacturing an electronic equipm...
- Patent number 6,633,078
- Issue date Oct 14, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Tsuneo Hamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of reforming reformable members of an electronic package and...
- Patent number 6,583,354
- Issue date Jun 24, 2003
- International Business Machines Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounted member and repair method thereof
- Patent number 6,512,183
- Issue date Jan 28, 2003
- Matsushita Electric Industrial Co., Ltd.
- Tsutomu Mitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
CONDUCTIVE PASTE, CONDUCTIVE STRUCTURE USING THE SAME, ELECTRONIC P...
- Patent number 6,479,763
- Issue date Nov 12, 2002
- Matsushita Electric Industrial Co., Ltd.
- Emiko Igaki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Surface-mount connector
- Patent number 6,334,789
- Issue date Jan 1, 2002
- Hirose Electric Co., Ltd.
- Ryozo Koyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages with solder interconnections
- Patent number 6,335,222
- Issue date Jan 1, 2002
- Tessera, Inc.
- Thomas H. DiStefano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20160297022
- Publication date Oct 13, 2016
- International Business Machines Corporation
- Stephen M. Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GROUNDING GASKET AND ELECTRONIC APPARATUS
- Publication number 20140133116
- Publication date May 15, 2014
- Kabushiki Kaisha Toshiba
- Tomohiro Matano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20100210042
- Publication date Aug 19, 2010
- Samsung Electronics Co., Ltd.
- Hyun-Jong OH
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
OC2 ORIENTED CONNECTIONS 2
- Publication number 20090207575
- Publication date Aug 20, 2009
- Gabe Cherian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for forming BGA package with increased standoff height
- Publication number 20090080169
- Publication date Mar 26, 2009
- Mark E. Webster
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Soldering method for mounting semiconductor device on wiring board...
- Publication number 20090029488
- Publication date Jan 29, 2009
- NEC ELECTRONICS CORPORATION
- Shinichi Miyazaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic Device and Method of Manufacturing Same
- Publication number 20090026607
- Publication date Jan 29, 2009
- INFINEON TECHNOLOGIES AG
- Holger HUEBNER
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTING STRUCTURE, MANUFACTURING METHOD, AND...
- Publication number 20080308930
- Publication date Dec 18, 2008
- Hisahiko Yoshida
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Temperature-activated self-extending surface mount attachment struc...
- Publication number 20080299801
- Publication date Dec 4, 2008
- Myoungsoo Jeon
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic device and electronic component mounting method
- Publication number 20080223609
- Publication date Sep 18, 2008
- Fujitsu Limited
- Keiichi Yamamoto
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Increased Stand-Off Height Integrated Circuit Assemblies, Systems,...
- Publication number 20080218986
- Publication date Sep 11, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Charles Anthony Odegard
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MOUNTING BOARD, HEIGHT ADJUSTING APPARATUS AND MOUNTING METHOD
- Publication number 20080158843
- Publication date Jul 3, 2008
- Fujitsu Limited
- Tsuyoshi SO
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method and device to elongate a solder joint
- Publication number 20070114266
- Publication date May 24, 2007
- Agency For Science, Technology and Research
- Ee Hua Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldering method for mounting semiconductor device on wiring board...
- Publication number 20070099412
- Publication date May 3, 2007
- NEC Electronics Corporation
- Shinichi Miyazaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method and apparatus for attaching an IC package to a PCB assembly
- Publication number 20060263929
- Publication date Nov 23, 2006
- Texas Instruments Inc.
- Akira Matsunami
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Increased stand-off height integrated circuit assemblies, systems,...
- Publication number 20060234490
- Publication date Oct 19, 2006
- Charles Anthony Odegard
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
System and Method to Increase Die Stand-off Height
- Publication number 20060211172
- Publication date Sep 21, 2006
- Charles Anthony Odegard
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Foamable underfill encapsulant
- Publication number 20060142424
- Publication date Jun 29, 2006
- Jayesh Shah
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Microelectronic packages with solder interconnections
- Publication number 20060113680
- Publication date Jun 1, 2006
- Tessera, Inc.
- Thomas H. DiStefano
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Head gimbal assembly with flying height controller, disk drive unit...
- Publication number 20060082917
- Publication date Apr 20, 2006
- SAE MAGNETICS (H. K) LTD.
- MingGao Yao
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD OF REFORMING REFORMABLE MEMBERS OF AN ELECTRONIC PACKAGE AND...
- Publication number 20060005986
- Publication date Jan 12, 2006
- David J. Alcoe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of using pre-applied underfill encapsulant
- Publication number 20050074547
- Publication date Apr 7, 2005
- Paul Morganelli
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method and device to elongate a solder joint
- Publication number 20050056684
- Publication date Mar 17, 2005
- Agency for Science, Technology and Research
- Ee Hua Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and method to increase die stand-off height
- Publication number 20040232561
- Publication date Nov 25, 2004
- TEXAS INSTRUMENTS INCORPORATED
- Charles Anthony Odegard
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of using pre-applied underfill encapsulant
- Publication number 20040234689
- Publication date Nov 25, 2004
- Paul Morganelli
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Foamable underfill encapsulant
- Publication number 20040235996
- Publication date Nov 25, 2004
- Jayesh Shah
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Oriented connections for leadless and leaded packages
- Publication number 20040178250
- Publication date Sep 16, 2004
- Gabe Cherian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, method for manufacturing an electronic equipm...
- Publication number 20040021212
- Publication date Feb 5, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Tsuneo Hamaguchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Zero insertion force heat-activated retention pin
- Publication number 20030216066
- Publication date Nov 20, 2003
- George Arrigotti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of reforming reformable members of an electronic package and...
- Publication number 20030196826
- Publication date Oct 23, 2003
- David J. Alcoe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Lifting the component during or after mounting Increasing the gap between component and PCB

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor module and electronic apparatus

Increasing solder hole-fill in a printed circuit board assembly

Increasing solder hole-fill in a printed circuit board assembly

Electronic device and method of manufacturing same

OC2 oriented connections 2

Semiconductor device mounting structure, manufacturing method, and...

Mounting board, height adjusting apparatus and mounting method

Soldering method for mounting semiconductor device on wiring board...

System and method to increase die stand-off height

Head gimbal assembly with flying height controller, disk drive unit...

Temperature-activated self-extending surface mount attachment struc...

Oriented connections for leadless and leaded packages

Increased stand-off height integrated circuit assemblies, systems,...

Method and apparatus for attaching an IC package to a PCB assembly

System and method to increase die stand-off height

Method and device to elongate a solder joint

Microelectronic packages with elongated solder interconnections

Method of using pre-applied underfill encapsulant

Method of reforming reformable members of an electronic package and...

Method of reforming reformable members of an electronic package and...

Semiconductor device, method for manufacturing an electronic equipm...

Zero insertion force heat-activated retention pin

Electronic component mounted member and repair method thereof

Ball grid array IC package and manufacturing method thereof

Semiconductor device, method for manufacturing an electronic equipm...

Method of reforming reformable members of an electronic package and...

Electronic component mounted member and repair method thereof

CONDUCTIVE PASTE, CONDUCTIVE STRUCTURE USING THE SAME, ELECTRONIC P...

Surface-mount connector

Microelectronic packages with solder interconnections

Patents Applicationslast 30 patents

INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY

GROUNDING GASKET AND ELECTRONIC APPARATUS

METHOD OF MANUFACTURING SEMICONDUCTOR MODULE

OC2 ORIENTED CONNECTIONS 2

Method for forming BGA package with increased standoff height

Soldering method for mounting semiconductor device on wiring board...

Electronic Device and Method of Manufacturing Same

SEMICONDUCTOR DEVICE MOUNTING STRUCTURE, MANUFACTURING METHOD, AND...

Temperature-activated self-extending surface mount attachment struc...

Electronic device and electronic component mounting method

Increased Stand-Off Height Integrated Circuit Assemblies, Systems,...

MOUNTING BOARD, HEIGHT ADJUSTING APPARATUS AND MOUNTING METHOD

Method and device to elongate a solder joint

Soldering method for mounting semiconductor device on wiring board...

Method and apparatus for attaching an IC package to a PCB assembly

Increased stand-off height integrated circuit assemblies, systems,...

System and Method to Increase Die Stand-off Height

Foamable underfill encapsulant

Microelectronic packages with solder interconnections

Head gimbal assembly with flying height controller, disk drive unit...

METHOD OF REFORMING REFORMABLE MEMBERS OF AN ELECTRONIC PACKAGE AND...

Method of using pre-applied underfill encapsulant

Method and device to elongate a solder joint

System and method to increase die stand-off height

Method of using pre-applied underfill encapsulant

Foamable underfill encapsulant

Oriented connections for leadless and leaded packages

Semiconductor device, method for manufacturing an electronic equipm...

Zero insertion force heat-activated retention pin

Method of reforming reformable members of an electronic package and...