Linear CCD imagers

Industry

CPC
H01L27/14825

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/14825Linear CCD imagers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Waveguide integration with optical coupling structures on light det...
- Patent number 12,111,262
- Issue date Oct 8, 2024
- Illumina Inc
- Arvin Emadi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with sequentially-coupled charge storage and ass...
- Patent number 12,085,442
- Issue date Sep 10, 2024
- Quantum-Si Incorporated
- Eric A. G. Webster
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Integrated circuit with sequentially-coupled charge storage and ass...
- Patent number 11,714,001
- Issue date Aug 1, 2023
- Quantum-Si Incorporated
- Eric A. G. Webster
- G01 - MEASURING TESTING
Information Patent Grant
Solid-state imaging device
- Patent number 11,362,129
- Issue date Jun 14, 2022
- Kabushiki Kaisha Toshiba
- Hisayuki Taruki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image pickup device and control method of solid-state i...
- Patent number 10,986,291
- Issue date Apr 20, 2021
- Kabushiki Kaisha Toshiba
- Masao Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside incidence type solid-state image pickup device
- Patent number 10,811,459
- Issue date Oct 20, 2020
- Hamamatsu Photonics K.K.
- Shin-ichiro Takagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device
- Patent number 10,797,100
- Issue date Oct 6, 2020
- Kabushiki Kaisha Toshiba
- Ryuta Inobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple column per channel CCD sensor architecture for inspection...
- Patent number 10,778,925
- Issue date Sep 15, 2020
- KLA-Tencor Corporation
- Yung-Ho Alex Chuang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual-column-parallel CCD sensor and inspection systems using a sensor
- Patent number 10,764,527
- Issue date Sep 1, 2020
- KLA-Tencor Corporation
- Yung-Ho Alex Chuang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optoelectronic modules for the acquisition of spectral and distance...
- Patent number 10,578,739
- Issue date Mar 3, 2020
- ams Sensors Singapore Pte. Ltd.
- Bernhard Buettgen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Linear image sensor
- Patent number 10,403,677
- Issue date Sep 3, 2019
- Hamamatsu Photonics K.K.
- Shin-ichiro Takagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-column-parallel CCD sensor and inspection systems using a sensor
- Patent number 10,313,622
- Issue date Jun 4, 2019
- KLA-Tencor Corporation
- Yung-Ho Alex Chuang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Charge-coupled device, manufacturing method thereof, and solid-stat...
- Patent number 9,967,503
- Issue date May 8, 2018
- Hamamatsu Photonics K.K.
- Shin-ichiro Takagi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
EMCCD image sensor with stable charge multiplication gain
- Patent number 9,905,608
- Issue date Feb 27, 2018
- Semiconductor Components Industries, LLC
- Jaroslav Hynecek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image reading apparatus and semiconductor device
- Patent number 9,854,130
- Issue date Dec 26, 2017
- Seiko Epson Corporation
- Takafumi Suzuki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor, an inspection system and a method of inspecting an ar...
- Patent number 9,620,547
- Issue date Apr 11, 2017
- KLA-Tencor Corporation
- Yung-Ho Alex Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor, an inspection system and a method of inspecting an ar...
- Patent number 9,410,901
- Issue date Aug 9, 2016
- KLA-Tencor Corporation
- Yung-Ho Alex Chuang
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor element and solid-state imaging device
- Patent number 9,202,902
- Issue date Dec 1, 2015
- National University Corporation Shizuoka University
- Shoji Kawahito
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
TDI-type linear image sensor
- Patent number 9,184,209
- Issue date Nov 10, 2015
- Mitsubishi Electric Corporation
- Takahiro Onakado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Matrix image sensor providing bidirectional charge transfer with as...
- Patent number 9,093,353
- Issue date Jul 28, 2015
- E2V Semiconductors
- Frederic Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D CCD-style imaging sensor with rolling readout
- Patent number 9,076,709
- Issue date Jul 7, 2015
- Mesa Imaging AG
- Jonas Felber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Off-axial three-mirror system
- Patent number 8,975,571
- Issue date Mar 10, 2015
- Tsinghua University
- Wei Hou
- G02 - OPTICS
Information Patent Grant
Image sensor and image-reading device
- Patent number 8,514,312
- Issue date Aug 20, 2013
- Fuji Xerox Co., Ltd.
- Jiro Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charge detection device and charge detection method, solid-state im...
- Patent number 8,233,065
- Issue date Jul 31, 2012
- Sony Corporation
- Shunsuke Kameda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charge coupled device having diverged channel
- Patent number 7,595,517
- Issue date Sep 29, 2009
- FUJIFILM Corporation
- Katsumi Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device
- Patent number 7,488,999
- Issue date Feb 10, 2009
- NEC Electronics Corporation
- Makoto Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molded semiconductor device and mold
- Patent number 7,448,861
- Issue date Nov 11, 2008
- NEC Electronics Corporation
- Masahiro Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Linear image sensor
- Patent number 7,436,450
- Issue date Oct 14, 2008
- NEC Electronics Corporation
- Takao Tsuzuki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Resin molded semiconductor device
- Patent number 7,265,444
- Issue date Sep 4, 2007
- NEC Electronics Corporation
- Masahiro Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charge read-out method and solid-state imaging device capable of sh...
- Patent number 7,250,971
- Issue date Jul 31, 2007
- FUJIFILM Corporation
- Tetsuo Yamada
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
VERTICALLY STACKED LIGHT SENSORS
- Publication number 20240363672
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH SEQUENTIALLY-COUPLED CHARGE STORAGE AND ASS...
- Publication number 20240044703
- Publication date Feb 8, 2024
- Quantum-Si Incorporated
- Eric A.G. Webster
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT WITH SEQUENTIALLY-COUPLED CHARGE STORAGE AND ASS...
- Publication number 20230349755
- Publication date Nov 2, 2023
- Quantum-Si Incorporated
- Eric A.G. Webster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH SEQUENTIALLY-COUPLED CHARGE STORAGE AND ASS...
- Publication number 20220128402
- Publication date Apr 28, 2022
- Quantum-Si Incorporated
- Eric A.G. Webster
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT WITH SEQUENTIALLY-COUPLED CHARGE STORAGE AND ASS...
- Publication number 20220128403
- Publication date Apr 28, 2022
- Quantum-Si Incorporated
- Eric A.G. Webster
- G01 - MEASURING TESTING
Information Patent Application
SOLID-STATE IMAGING DEVICE
- Publication number 20200273903
- Publication date Aug 27, 2020
- KABUSHIKI KAISHA TOSHIBA
- Hisayuki Taruki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE
- Publication number 20200083279
- Publication date Mar 12, 2020
- Kabushiki Kaisha Toshiba
- Ryuta Inobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple Column Per Channel CCD Sensor Architecture For Inspection...
- Publication number 20190313044
- Publication date Oct 10, 2019
- Yung-Ho Alex Chuang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Dual-Column-Parallel CCD Sensor And Inspection Systems Using A Sensor
- Publication number 20190253652
- Publication date Aug 15, 2019
- Yung-Ho Alex Chuang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BACKSIDE INCIDENCE TYPE SOLID-STATE IMAGE PICKUP DEVICE
- Publication number 20170301722
- Publication date Oct 19, 2017
- Hamamatsu Photonics K.K.
- Shin-ichiro TAKAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual-Column-Parallel CCD Sensor And Inspection Systems Using A Sensor
- Publication number 20170295334
- Publication date Oct 12, 2017
- Yung-Ho Alex Chuang
- G01 - MEASURING TESTING
Information Patent Application
IMAGE READING APPARATUS AND SEMICONDUCTOR DEVICE
- Publication number 20170237877
- Publication date Aug 17, 2017
- SEIKO EPSON CORPORATION
- Takafumi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensor, An Inspection System And A Method Of Inspecting An Ar...
- Publication number 20160315114
- Publication date Oct 27, 2016
- KLA-Tencor Corporation
- Yung-Ho Alex Chuang
- G01 - MEASURING TESTING
Information Patent Application
CHARGE-COUPLED DEVICE, MANUFACTURING METHOD THEREOF, AND SOLID-STAT...
- Publication number 20160286147
- Publication date Sep 29, 2016
- Hamamatsu Photonics K.K.
- Shin-ichiro Takagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINEAR IMAGE SENSOR
- Publication number 20160268334
- Publication date Sep 15, 2016
- Hamamatsu Photonics K.K.
- Shin-ichiro Takagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensor, An Inspection System And A Method Of Inspecting An Ar...
- Publication number 20150260659
- Publication date Sep 17, 2015
- KLA-Tencor Corporation
- Yung-Ho Alex Chuang
- G01 - MEASURING TESTING
Information Patent Application
TDI-TYPE LINEAR IMAGE SENSOR
- Publication number 20140217476
- Publication date Aug 7, 2014
- MITSUBISHI ELECTRIC CORPORATION
- Takahiro Onakado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFF-AXIAL THREE-MIRROR SYSTEM
- Publication number 20140124649
- Publication date May 8, 2014
- WEI HOU
- G02 - OPTICS
Information Patent Application
3D CCD-Style Imaging Sensor with Rolling Readout
- Publication number 20110114821
- Publication date May 19, 2011
- MESA IMAGING AG
- Jonas Felber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND IMAGE-READING DEVICE
- Publication number 20100321552
- Publication date Dec 23, 2010
- FUJI XEROX CO., LTD
- Jiro MATSUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Charge detection device and charge detection method, solid-state im...
- Publication number 20100201861
- Publication date Aug 12, 2010
- SONY CORPORATION
- Shunsuke Kameda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solid-state imaging device
- Publication number 20070131974
- Publication date Jun 14, 2007
- NEC ELECTRONICS CORPORATION
- Makoto Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor
- Publication number 20070045669
- Publication date Mar 1, 2007
- NEC ELECTRONICS CORPORATION
- Shiro Tsunai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Charge coupled device having diverged channel
- Publication number 20060214194
- Publication date Sep 28, 2006
- Fuji Photo Film Co., Ltd.
- Katsumi Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin molded semiconductor device and mold
- Publication number 20060071321
- Publication date Apr 6, 2006
- NEC Electronics Corporation
- Masahiro Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solid image pickup apparatus
- Publication number 20050270595
- Publication date Dec 8, 2005
- Kabushiki Kaisha Toshiba
- Makoto Monoi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Solid-state imaging device and CCD linear sensor
- Publication number 20050247857
- Publication date Nov 10, 2005
- Toshimitsu Nagae
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Linear image sensor
- Publication number 20050225663
- Publication date Oct 13, 2005
- NEC Electronics Corporation
- Takao Tsuzuki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Resin molded semiconductor device and mold
- Publication number 20040262741
- Publication date Dec 30, 2004
- NEC ELECTRONICS CORPORATION
- Masahiro Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photosensitive imaging device having photosites isolated with deep...
- Publication number 20040012100
- Publication date Jan 22, 2004
- Xerox Corporation.
- Paul A. Hosier
- H01 - BASIC ELECTRIC ELEMENTS

Linear CCD imagers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Waveguide integration with optical coupling structures on light det...

Integrated circuit with sequentially-coupled charge storage and ass...

Integrated circuit with sequentially-coupled charge storage and ass...

Solid-state imaging device

Solid-state image pickup device and control method of solid-state i...

Backside incidence type solid-state image pickup device

Imaging device

Multiple column per channel CCD sensor architecture for inspection...

Dual-column-parallel CCD sensor and inspection systems using a sensor

Optoelectronic modules for the acquisition of spectral and distance...

Linear image sensor

Dual-column-parallel CCD sensor and inspection systems using a sensor

Charge-coupled device, manufacturing method thereof, and solid-stat...

EMCCD image sensor with stable charge multiplication gain

Image reading apparatus and semiconductor device

Image sensor, an inspection system and a method of inspecting an ar...

Image sensor, an inspection system and a method of inspecting an ar...

Semiconductor element and solid-state imaging device

TDI-type linear image sensor

Matrix image sensor providing bidirectional charge transfer with as...

3D CCD-style imaging sensor with rolling readout

Off-axial three-mirror system

Image sensor and image-reading device

Charge detection device and charge detection method, solid-state im...

Charge coupled device having diverged channel

Solid-state imaging device

Resin molded semiconductor device and mold

Linear image sensor

Resin molded semiconductor device

Charge read-out method and solid-state imaging device capable of sh...

Patents Applicationslast 30 patents

VERTICALLY STACKED LIGHT SENSORS

INTEGRATED CIRCUIT WITH SEQUENTIALLY-COUPLED CHARGE STORAGE AND ASS...

INTEGRATED CIRCUIT WITH SEQUENTIALLY-COUPLED CHARGE STORAGE AND ASS...

INTEGRATED CIRCUIT WITH SEQUENTIALLY-COUPLED CHARGE STORAGE AND ASS...

INTEGRATED CIRCUIT WITH SEQUENTIALLY-COUPLED CHARGE STORAGE AND ASS...

SOLID-STATE IMAGING DEVICE

IMAGING DEVICE

Multiple Column Per Channel CCD Sensor Architecture For Inspection...

Dual-Column-Parallel CCD Sensor And Inspection Systems Using A Sensor

BACKSIDE INCIDENCE TYPE SOLID-STATE IMAGE PICKUP DEVICE

Dual-Column-Parallel CCD Sensor And Inspection Systems Using A Sensor

IMAGE READING APPARATUS AND SEMICONDUCTOR DEVICE

Image Sensor, An Inspection System And A Method Of Inspecting An Ar...

CHARGE-COUPLED DEVICE, MANUFACTURING METHOD THEREOF, AND SOLID-STAT...

LINEAR IMAGE SENSOR

Image Sensor, An Inspection System And A Method Of Inspecting An Ar...

TDI-TYPE LINEAR IMAGE SENSOR

OFF-AXIAL THREE-MIRROR SYSTEM

3D CCD-Style Imaging Sensor with Rolling Readout

IMAGE SENSOR AND IMAGE-READING DEVICE

Charge detection device and charge detection method, solid-state im...

Solid-state imaging device

Image sensor

Charge coupled device having diverged channel

Resin molded semiconductor device and mold

Solid image pickup apparatus

Solid-state imaging device and CCD linear sensor

Linear image sensor

Resin molded semiconductor device and mold

Photosensitive imaging device having photosites isolated with deep...