Liquid crystal polymer [LCP]

Industry

CPC
H05K2201/0141

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0141Liquid crystal polymer [LCP]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Rigid flexible printed circuit board and electronic device comprisi...
- Patent number 12,185,464
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Youngsun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal clad laminate and production method thereof
- Patent number 12,172,408
- Issue date Dec 24, 2024
- Kuraray Co., Ltd.
- Takahiro Nakashima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 12,160,949
- Issue date Dec 3, 2024
- FUJIFILM Corporation
- Genya Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin multilayer substrate and method for manufacturing resin multi...
- Patent number 12,120,817
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Ryosuke Takada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bent laminated printed circuit board
- Patent number 12,108,524
- Issue date Oct 1, 2024
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-coated liquid-crystal polymer film
- Patent number 12,089,327
- Issue date Sep 10, 2024
- Kuraray Co., Ltd.
- Kikuo Arimoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board, antenna structure including the same and ima...
- Patent number 12,082,341
- Issue date Sep 3, 2024
- Dongwoo Fine-Chem Co., Ltd.
- Dong Pil Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component and method for manufacturing electronic component
- Patent number 12,070,800
- Issue date Aug 27, 2024
- Resonac Corporation
- Yoshinori Ejiri
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Multilayer board and manufacturing method thereof
- Patent number 12,058,811
- Issue date Aug 6, 2024
- AZOTEK CO., LTD.
- Hung-Jung Lee
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin multilayer substrate
- Patent number 12,052,818
- Issue date Jul 30, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi Kasuya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transmission line substrate and electronic device
- Patent number 12,046,792
- Issue date Jul 23, 2024
- Murata Manufacturing Co., Ltd.
- Kosuke Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate
- Patent number 12,041,716
- Issue date Jul 16, 2024
- LG Innotek Co., Ltd
- Nam Heon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit structure
- Patent number 12,035,467
- Issue date Jul 9, 2024
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low dielectric resin composition, molded article, film, multilayer...
- Patent number 11,993,740
- Issue date May 28, 2024
- Kaneka Corporation
- Yuichi Imamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid crystal polymer embedded microelectronics device
- Patent number 11,997,786
- Issue date May 28, 2024
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible laminated board and multilayer circuit board
- Patent number 11,985,762
- Issue date May 14, 2024
- UBE EXSYMO CO., LTD.
- Eisuke Tachibana
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Wiring board
- Patent number 11,979,981
- Issue date May 7, 2024
- Kyocera Corporation
- Takayuki Umemoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer resin substrate, and method of manufacturing multilayer...
- Patent number 11,963,294
- Issue date Apr 16, 2024
- Murata Manufacturing Co., Ltd.
- Tomohiro Furumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid crystal polymer film and laminate comprising the same
- Patent number 11,945,907
- Issue date Apr 2, 2024
- Chang Chun Plastics Co., Ltd.
- An-Pang Tu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Liquid crystal polymer film and laminate comprising the same
- Patent number 11,926,698
- Issue date Mar 12, 2024
- Chang Chun Plastics Co., Ltd.
- An-Pang Tu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for manufacturing multilayer substrate and multilayer substrate
- Patent number 11,924,980
- Issue date Mar 5, 2024
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board for use at 5G frequencies
- Patent number 11,917,753
- Issue date Feb 27, 2024
- Ticona LLC
- Xiaowei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoplastic liquid crystal polymer film and circuit board using same
- Patent number 11,877,395
- Issue date Jan 16, 2024
- Kuraray Co., Ltd.
- Minoru Onodera
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed circuit board
- Patent number 11,864,307
- Issue date Jan 2, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Dae Jung Byun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid crystal polymer film and laminate comprising the same
- Patent number 11,859,045
- Issue date Jan 2, 2024
- Chang Chun Plastics Co., Ltd.
- An-Pang Tu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Laminate, circuit board, and liquid crystal polymer film applied to...
- Patent number 11,840,602
- Issue date Dec 12, 2023
- Chang Chun Plastics Co., Ltd.
- An-Pang Tu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Multilayer printed wiring board, multilayer metal-clad laminated bo...
- Patent number 11,818,835
- Issue date Nov 14, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroaki Takahashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit board with embedded electronic component and method for man...
- Patent number 11,778,752
- Issue date Oct 3, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Hsiao-Ting Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin multilayer substrate
- Patent number 11,751,321
- Issue date Sep 5, 2023
- Murata Manufacturing Co., Ltd.
- Atsushi Kasuya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and substrate including electronic component...
- Patent number 11,744,012
- Issue date Aug 29, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Dae Jung Byun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FILM AND LAMINATE
- Publication number 20250034424
- Publication date Jan 30, 2025
- FUJIFILM CORPORATION
- Miyoko HARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20250031306
- Publication date Jan 23, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Xiao-Juan ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANTENNA MODULE AND PORTABLE ELECTRIC DEVICE USING THE SAME
- Publication number 20250023223
- Publication date Jan 16, 2025
- QuantumZ Inc.
- Kun Yen TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20250008647
- Publication date Jan 2, 2025
- Murata Manufacturing Co., Ltd.
- Kosuke NISHIO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILM, LAMINATE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240407090
- Publication date Dec 5, 2024
- FUJIFILM CORPORATION
- Yasuyuki SASADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20240383035
- Publication date Nov 21, 2024
- Resonac Corporation
- Yoshinori EJIRI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
WIRING BOARD, MANUFACTURING METHOD OF SAME, FILM, AND LAMINATE
- Publication number 20240373550
- Publication date Nov 7, 2024
- FUJIFILM CORPORATION
- Yasuyuki SASADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE FILMS FOR MOBILE ELECTRONIC DEVICE COMPONENTS
- Publication number 20240373551
- Publication date Nov 7, 2024
- CYTEC INDUSTRIES INC.
- Nan Chen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MULTILAYER BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240324100
- Publication date Sep 26, 2024
- AZOTEK CO., LTD.
- Hung-Jung LEE
- B32 - LAYERED PRODUCTS
Information Patent Application
MULTILAYER BOARD
- Publication number 20240292535
- Publication date Aug 29, 2024
- Murata Manufacturing Co., Ltd.
- Kosuke NISHIO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for preparing novel material layer structure of circuit boar...
- Publication number 20240284599
- Publication date Aug 22, 2024
- LongKai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND ANTENNA DEVICE COMPRISING SAME
- Publication number 20240260175
- Publication date Aug 1, 2024
- LG Innotek Co., Ltd.
- In Jae LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board for Use at 5G Frequencies
- Publication number 20240244743
- Publication date Jul 18, 2024
- Ticona LLC
- Xiaowei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN SHEET AND RESIN MULTILAYER SUBSTRATE
- Publication number 20240206060
- Publication date Jun 20, 2024
- Murata Manufacturing Co., Ltd.
- Ryosuke TAKADA
- B32 - LAYERED PRODUCTS
Information Patent Application
LIQUID CRYSTAL POLYMER EMBEDDED MICROELECTRONICS DEVICE
- Publication number 20240147614
- Publication date May 2, 2024
- LCP Medical Technologies, LLC
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240090121
- Publication date Mar 14, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Dae Jung BYUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE COMPOSITE SUBSTRATE FOR WEARABLE ANTENNA
- Publication number 20240088544
- Publication date Mar 14, 2024
- Jabil Inc.
- Yen San Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID CRYSTAL POLYMER FILM, LIQUID CRYSTAL POLYMER FILM WITH CONDU...
- Publication number 20240076552
- Publication date Mar 7, 2024
- Murata Manufacturing Co., Ltd.
- Takeshi EDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Device Having Conductive Contact Soldered to Printed Cir...
- Publication number 20240080976
- Publication date Mar 7, 2024
- Apple Inc.
- Peter A. Dvorak
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
LCP EXTRUDED FILM AND METHOD FOR MANUFACTURING THE SAME, LCP EXTRUD...
- Publication number 20240032191
- Publication date Jan 25, 2024
- Denka Company Limited
- Yusuke MASUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYMER FILM, LAMINATE, AND METHOD FOR MANUFACTURING SAME
- Publication number 20230364887
- Publication date Nov 16, 2023
- FUJIFILM CORPORATION
- Yasuyuki Sasada
- B32 - LAYERED PRODUCTS
Information Patent Application
PRINTED CIRCUIT BOARD AND SUBSTRATE INCLUDING ELECTRONIC COMPONENT...
- Publication number 20230354513
- Publication date Nov 2, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Dae Jung BYUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Structure
- Publication number 20230354515
- Publication date Nov 2, 2023
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER FILM AND LAMINATE
- Publication number 20230303836
- Publication date Sep 28, 2023
- FUJIFILM CORPORATION
- Yasuyuki SASADA
- B32 - LAYERED PRODUCTS
Information Patent Application
MULTILAYER BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20230309219
- Publication date Sep 28, 2023
- AZOTEK CO., LTD.
- Hung-Jung LEE
- B32 - LAYERED PRODUCTS
Information Patent Application
3D FILTER AND FABRICATION METHOD THEREOF
- Publication number 20230299450
- Publication date Sep 21, 2023
- QuantumZ Inc.
- Gang-Lin ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID CRYSTAL POLYMER FILM, POLYMER FILM, AND LAMINATE
- Publication number 20230292434
- Publication date Sep 14, 2023
- FUJIFILM CORPORATION
- Yasuyuki SASADA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE
- Publication number 20230284381
- Publication date Sep 7, 2023
- Murata Manufacturing Co., Ltd.
- Kosuke NISHIO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN FILM WITH CONDUCTOR LAYER, MULTILAYER SUBSTRATE, AND METHOD F...
- Publication number 20230262876
- Publication date Aug 17, 2023
- Murata Manufacturing Co., Ltd.
- Mineto MITSUHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID CRYSTAL POLYMER FILM, LIQUID CRYSTAL POLYMER FILM WITH CONDU...
- Publication number 20230235229
- Publication date Jul 27, 2023
- Murata Manufacturing Co., Ltd.
- Takeshi EDA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Liquid crystal polymer [LCP]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Rigid flexible printed circuit board and electronic device comprisi...

Metal clad laminate and production method thereof

Wiring board and method for manufacturing wiring board

Resin multilayer substrate and method for manufacturing resin multi...

Bent laminated printed circuit board

Metal-coated liquid-crystal polymer film

Printed circuit board, antenna structure including the same and ima...

Electronic component and method for manufacturing electronic component

Multilayer board and manufacturing method thereof

Resin multilayer substrate

Transmission line substrate and electronic device

Substrate

Circuit structure

Low dielectric resin composition, molded article, film, multilayer...

Liquid crystal polymer embedded microelectronics device

Flexible laminated board and multilayer circuit board

Wiring board

Multilayer resin substrate, and method of manufacturing multilayer...

Liquid crystal polymer film and laminate comprising the same

Liquid crystal polymer film and laminate comprising the same

Method for manufacturing multilayer substrate and multilayer substrate

Circuit board for use at 5G frequencies

Thermoplastic liquid crystal polymer film and circuit board using same

Printed circuit board

Liquid crystal polymer film and laminate comprising the same

Laminate, circuit board, and liquid crystal polymer film applied to...

Multilayer printed wiring board, multilayer metal-clad laminated bo...

Circuit board with embedded electronic component and method for man...

Resin multilayer substrate

Printed circuit board and substrate including electronic component...

Patents Applicationslast 30 patents

FILM AND LAMINATE

FLEXIBLE CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

ANTENNA MODULE AND PORTABLE ELECTRIC DEVICE USING THE SAME

MULTILAYER SUBSTRATE

FILM, LAMINATE, AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

WIRING BOARD, MANUFACTURING METHOD OF SAME, FILM, AND LAMINATE

COMPOSITE FILMS FOR MOBILE ELECTRONIC DEVICE COMPONENTS

MULTILAYER BOARD AND MANUFACTURING METHOD THEREOF

MULTILAYER BOARD

Method for preparing novel material layer structure of circuit boar...

CIRCUIT BOARD AND ANTENNA DEVICE COMPRISING SAME

Circuit Board for Use at 5G Frequencies

RESIN SHEET AND RESIN MULTILAYER SUBSTRATE

LIQUID CRYSTAL POLYMER EMBEDDED MICROELECTRONICS DEVICE

PRINTED CIRCUIT BOARD

FLEXIBLE COMPOSITE SUBSTRATE FOR WEARABLE ANTENNA

LIQUID CRYSTAL POLYMER FILM, LIQUID CRYSTAL POLYMER FILM WITH CONDU...

Electronic Device Having Conductive Contact Soldered to Printed Cir...

LCP EXTRUDED FILM AND METHOD FOR MANUFACTURING THE SAME, LCP EXTRUD...

POLYMER FILM, LAMINATE, AND METHOD FOR MANUFACTURING SAME

PRINTED CIRCUIT BOARD AND SUBSTRATE INCLUDING ELECTRONIC COMPONENT...

Circuit Structure

POLYMER FILM AND LAMINATE

MULTILAYER BOARD AND MANUFACTURING METHOD THEREOF

3D FILTER AND FABRICATION METHOD THEREOF

LIQUID CRYSTAL POLYMER FILM, POLYMER FILM, AND LAMINATE

MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE

RESIN FILM WITH CONDUCTOR LAYER, MULTILAYER SUBSTRATE, AND METHOD F...

LIQUID CRYSTAL POLYMER FILM, LIQUID CRYSTAL POLYMER FILM WITH CONDU...