liquid deposition

Industry

CPC
H01L21/02282

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02282liquid deposition

Industries

Patents Grantslast 30 patents

Information Patent Grant
Cyclic spin-on coating process for forming dielectric material
- Patent number 12,170,199
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Je-Ming Kuo
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Chuck assembly, planarization process, apparatus and method of manu...
- Patent number 12,165,903
- Issue date Dec 10, 2024
- Canon Kabushiki Kaisha
- Seth J. Bamesberger
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Superstrate and method of making it
- Patent number 12,136,564
- Issue date Nov 5, 2024
- Canon Kabushiki Kaisha
- Fen Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial protection layer for environmentally sensitive surfaces...
- Patent number 12,119,218
- Issue date Oct 15, 2024
- Lam Research Corporation
- Stephen M. Sirard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ CMP self-assembled monolayer for enhancing metal-dielectric...
- Patent number 12,107,004
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Zhen Yu Guan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching pattern forming method in semiconductor manufacturing process
- Patent number 12,094,719
- Issue date Sep 17, 2024
- YOUNG CHANG CHEMICAL CO., LTD
- Su Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuitry, memory arrays comprising strings of memory ce...
- Patent number 12,087,632
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Corey Staller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for forming coating film and method for manufacturing s...
- Patent number 12,087,576
- Issue date Sep 10, 2024
- NISSAN CHEMICAL CORPORATION
- Tokio Nishita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
RF devices with nanotube particles for enhanced performance and met...
- Patent number 12,074,086
- Issue date Aug 27, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-k dielectric aerogel and preparation method therefor
- Patent number 12,054,585
- Issue date Aug 6, 2024
- TAIWAN AEROGEL TECHNOLOGY MATERIAL CO., LTD.
- Jean-Hong Chen
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Integrated circuitry, method used in the fabrication of a vertical...
- Patent number 12,057,493
- Issue date Aug 6, 2024
- Micron Technology, Inc.
- Masihhur R. Laskar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective liquiphobic surface modification of substrates
- Patent number 12,057,308
- Issue date Aug 6, 2024
- Brewer Science, Inc.
- Jinhua Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,057,342
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shiang-Bau Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure and semiconductor...
- Patent number 12,051,615
- Issue date Jul 30, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Mengzhu Qiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma doping of gap fill materials
- Patent number 12,040,182
- Issue date Jul 16, 2024
- Micron Technology, Inc.
- Santanu Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit
- Patent number 12,027,424
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Sheng Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 12,020,943
- Issue date Jun 25, 2024
- Tokyo Electron Limited
- Atsushi Yamashita
- B08 - CLEANING
Information Patent Grant
Display device with transparent electric insulating heat conductive...
- Patent number 12,009,371
- Issue date Jun 11, 2024
- HEFEI BOE JOINT TECHNOLOGY CO., LTD.
- Lifang Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filling openings by combining non-flowable and flowable processes
- Patent number 11,990,364
- Issue date May 21, 2024
- Intel Corporation
- Ebony L. Mays
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Porogen bonded gap filling material in semiconductor manufacturing
- Patent number 11,984,316
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filling openings by combining non-flowable and flowable processes
- Patent number 11,978,657
- Issue date May 7, 2024
- Intel Corporation
- Ebony L. Mays
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion layers for EUV lithography
- Patent number 11,972,948
- Issue date Apr 30, 2024
- Brewer Science, Inc.
- Andrea M. Chacko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor film composition, method for manufacturing semiconduc...
- Patent number 11,965,109
- Issue date Apr 23, 2024
- Mitsui Chemicals, Inc.
- Yasuhisa Kayaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with nanotube particles for enhanced performance and met...
- Patent number 11,961,781
- Issue date Apr 16, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor ele...
- Patent number 11,942,382
- Issue date Mar 26, 2024
- Mitsubishi Electric Corporation
- Noritsugu Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing an integrated circuit having stress tuning...
- Patent number 11,935,842
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,915,936
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Wei Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-assembled monolayers as sacrificial capping layers
- Patent number 11,915,973
- Issue date Feb 27, 2024
- Tokyo Electron Limited
- Ainhoa Romo Negreira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus having a functional structure delimited by a frame struct...
- Patent number 11,908,763
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Prashanth Makaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, substrate processing method and non...
- Patent number 11,869,764
- Issue date Jan 9, 2024
- Kokusai Electric Corporation
- Akinori Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SACRIFICIAL PROTECTION LAYER FOR ENVIRONMENTALLY SENSITIVE SURFACES...
- Publication number 20240429040
- Publication date Dec 26, 2024
- LAM RESEARCH CORPORATION
- Stephen M. Sirard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240395911
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20240395598
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shiang-Bau Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Acoustic Measurement of Fabrication Equipment Clearance
- Publication number 20240377364
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-Hao Deng
- B08 - CLEANING
Information Patent Application
Semiconductor Processing Using a Two-Dimensional Polymer
- Publication number 20240363333
- Publication date Oct 31, 2024
- TOKYO ELECTRON LIMITED
- Kandabara Tapily
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Material For Forming Organic Film, Substrate For Manufacturing Semi...
- Publication number 20240363335
- Publication date Oct 31, 2024
- Shin-Etsu Chemical Co., Ltd.
- Daisuke KORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INORGANIC/HYBRID STRESS FILMS
- Publication number 20240363340
- Publication date Oct 31, 2024
- TOKYO ELECTRON LIMITED
- Charlotte Cutler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuitry, Method Used In The Fabrication Of A Vertical...
- Publication number 20240355909
- Publication date Oct 24, 2024
- Micron Technology, Inc.
- Masihhur R. Laskar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT
- Publication number 20240347388
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Sheng CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATING METHOD AND TREATMENT LIQUID
- Publication number 20240339317
- Publication date Oct 10, 2024
- SCREEN Holdings Co., Ltd.
- Shogo KUNIEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLING OPENINGS BY COMBINING NON-FLOWABLE AND FLOWABLE PROCESSES
- Publication number 20240249972
- Publication date Jul 25, 2024
- Intel Corporation
- Ebony L. Mays
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF DEVICES WITH NANOTUBE PARTICLES FOR ENHANCED PERFORMANCE AND MET...
- Publication number 20240234241
- Publication date Jul 11, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESION LAYERS FOR EUV LITHOGRAPHY
- Publication number 20240222122
- Publication date Jul 4, 2024
- Brewer Science, Inc.
- Andrea M. Chacko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING A SUBSTRATE
- Publication number 20240192602
- Publication date Jun 13, 2024
- SEMES CO., LTD.
- Min Jung PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF INSULATION FILM
- Publication number 20240112906
- Publication date Apr 4, 2024
- ABIT TECHNOLOGIES CO., LTD
- Kiyokazu NAKAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CASSETTE STRUCTURES AND RELATED METHODS FOR BATCH PROCESSING IN EPI...
- Publication number 20240112931
- Publication date Apr 4, 2024
- Applied Materials, Inc.
- Vishwas Kumar PANDEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Improving Package Creepage Distance
- Publication number 20240105447
- Publication date Mar 28, 2024
- NEXPERIA B.V.
- Hans-Juergen Funke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, PROCESSING METHOD, AND NON-TRANSITO...
- Publication number 20240096615
- Publication date Mar 21, 2024
- Kokusai Electric Corporation
- Akinori TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPIN COATER AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USI...
- Publication number 20240071751
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Moosong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SACRIFICIAL LAYER FOR SUBSTRATE ANALYSIS
- Publication number 20240055305
- Publication date Feb 15, 2024
- Intel Corporation
- Santosh TRIPATHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR TEST SAMPLE AND MANUFACTURING METHOD THEREOF
- Publication number 20240055271
- Publication date Feb 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Rui DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SACRIFICIAL PROTECTION LAYER FOR ENVIRONMENTALLY SENSITIVE SURFACES...
- Publication number 20240030023
- Publication date Jan 25, 2024
- LAM RESEARCH CORPORATION
- Stephen M. Sirard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR TOOL HAVING CONTROLLABLE AMBIENT ENVIRONMENT PROCESSI...
- Publication number 20240018661
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiao-Chun Hsu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING PATTERNS
- Publication number 20230406970
- Publication date Dec 21, 2023
- Samsung SDI Co., Ltd.
- Seung-Wook SHIN
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Cyclic Spin-On Coating Process for Forming Dielectric Material
- Publication number 20230411150
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Je-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuitry, Method Used In The Fabrication Of A Vertical...
- Publication number 20230395699
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Masihhur R. Laskar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU CMP SELF-ASSEMBLED MONOLAYER FOR ENHANCING METAL-DIELECTRIC...
- Publication number 20230377959
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zhen Yu GUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Acoustic Measurement of Fabrication Equipment Clearance
- Publication number 20230366857
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-Hao Deng
- B08 - CLEANING
Information Patent Application
Method of Forming a Semiconductor Device
- Publication number 20230343636
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHUCK ASSEMBLY, PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANU...
- Publication number 20230335428
- Publication date Oct 19, 2023
- Canon Kabushiki Kaisha
- SETH J. BAMESBERGER
- H01 - BASIC ELECTRIC ELEMENTS

liquid deposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Cyclic spin-on coating process for forming dielectric material

Chuck assembly, planarization process, apparatus and method of manu...

Superstrate and method of making it

Sacrificial protection layer for environmentally sensitive surfaces...

In-situ CMP self-assembled monolayer for enhancing metal-dielectric...

Etching pattern forming method in semiconductor manufacturing process

Integrated circuitry, memory arrays comprising strings of memory ce...

Composition for forming coating film and method for manufacturing s...

RF devices with nanotube particles for enhanced performance and met...

Low-k dielectric aerogel and preparation method therefor

Integrated circuitry, method used in the fabrication of a vertical...

Selective liquiphobic surface modification of substrates

Semiconductor device and method

Method for manufacturing semiconductor structure and semiconductor...

Plasma doping of gap fill materials

Semiconductor integrated circuit

Substrate processing method and substrate processing apparatus

Display device with transparent electric insulating heat conductive...

Filling openings by combining non-flowable and flowable processes

Porogen bonded gap filling material in semiconductor manufacturing

Filling openings by combining non-flowable and flowable processes

Adhesion layers for EUV lithography

Semiconductor film composition, method for manufacturing semiconduc...

RF devices with nanotube particles for enhanced performance and met...

Semiconductor device and method for manufacturing semiconductor ele...

Methods of manufacturing an integrated circuit having stress tuning...

Semiconductor structure and manufacturing method thereof

Self-assembled monolayers as sacrificial capping layers

Apparatus having a functional structure delimited by a frame struct...

Substrate processing apparatus, substrate processing method and non...

Patents Applicationslast 30 patents

SACRIFICIAL PROTECTION LAYER FOR ENVIRONMENTALLY SENSITIVE SURFACES...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

Semiconductor Device and Method

Acoustic Measurement of Fabrication Equipment Clearance

Semiconductor Processing Using a Two-Dimensional Polymer

Material For Forming Organic Film, Substrate For Manufacturing Semi...

INORGANIC/HYBRID STRESS FILMS

Integrated Circuitry, Method Used In The Fabrication Of A Vertical...

SEMICONDUCTOR INTEGRATED CIRCUIT

SUBSTRATE TREATING METHOD AND TREATMENT LIQUID

FILLING OPENINGS BY COMBINING NON-FLOWABLE AND FLOWABLE PROCESSES

RF DEVICES WITH NANOTUBE PARTICLES FOR ENHANCED PERFORMANCE AND MET...

ADHESION LAYERS FOR EUV LITHOGRAPHY

APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING A SUBSTRATE

MANUFACTURING METHOD OF INSULATION FILM

CASSETTE STRUCTURES AND RELATED METHODS FOR BATCH PROCESSING IN EPI...

Method of Improving Package Creepage Distance

SUBSTRATE PROCESSING APPARATUS, PROCESSING METHOD, AND NON-TRANSITO...

SPIN COATER AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USI...

SACRIFICIAL LAYER FOR SUBSTRATE ANALYSIS

SEMICONDUCTOR TEST SAMPLE AND MANUFACTURING METHOD THEREOF

SACRIFICIAL PROTECTION LAYER FOR ENVIRONMENTALLY SENSITIVE SURFACES...

SEMICONDUCTOR TOOL HAVING CONTROLLABLE AMBIENT ENVIRONMENT PROCESSI...

METHOD OF FORMING PATTERNS

Cyclic Spin-On Coating Process for Forming Dielectric Material

Integrated Circuitry, Method Used In The Fabrication Of A Vertical...

IN-SITU CMP SELF-ASSEMBLED MONOLAYER FOR ENHANCING METAL-DIELECTRIC...

Acoustic Measurement of Fabrication Equipment Clearance

Method of Forming a Semiconductor Device

CHUCK ASSEMBLY, PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANU...