Locally raised area or protrusion of insulating substrate

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CPC
H05K2201/09045

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09045Locally raised area or protrusion of insulating substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Connection body and harness
- Patent number 12,334,659
- Issue date Jun 17, 2025
- Japan Aviation Electronics Industry, Limited
- Kentaro Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible substrate
- Patent number 12,211,797
- Issue date Jan 28, 2025
- Japan Display Inc.
- Takumi Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible wiring board
- Patent number 12,185,458
- Issue date Dec 31, 2024
- Murata Manufacturing Co., Ltd.
- Ryo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for temperature measurement
- Patent number 12,171,060
- Issue date Dec 17, 2024
- SMA Solar Technology AG
- Felix Muehlhausen
- G01 - MEASURING TESTING
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 12,144,108
- Issue date Nov 12, 2024
- Dai Nippon Printing Co., Ltd.
- Naoko Okimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reciprocal PCB manufacturing process
- Patent number 12,096,566
- Issue date Sep 17, 2024
- Intel Corporation
- Tyler Leuten
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and fabrication thereof
- Patent number 12,063,739
- Issue date Aug 13, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Kok Wee Yeo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D-printed, PCB composite structures, and formation methods
- Patent number 12,035,465
- Issue date Jul 9, 2024
- Continental Automotive Systems, Inc.
- Stanton F Rak
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Fingerprint identification apparatus and electronic device
- Patent number 11,917,763
- Issue date Feb 27, 2024
- Shenzhen Goodix Technology Co., Ltd.
- Fanzhou Zeng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnects for electrical components positioned adjacent to vehi...
- Patent number 11,865,872
- Issue date Jan 9, 2024
- TDK Corporation
- Vibhu Vivek
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power electronic switching device, power semiconductor module there...
- Patent number 11,800,644
- Issue date Oct 24, 2023
- Semikron Elektronik GmbH & Co. KG
- Markus Düsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-electronic package with substrate protrusion to facilitate di...
- Patent number 11,776,821
- Issue date Oct 3, 2023
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple in-mold electronics structure and method of manufacturing...
- Patent number 11,765,819
- Issue date Sep 19, 2023
- INTOPS.CO., LTD.
- Sung-hoon Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with antenna, and antenna module
- Patent number 11,605,873
- Issue date Mar 14, 2023
- Murata Manufacturing Co., Ltd.
- Yoshitaka Echikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of three-dimensional kirigami structures with tunable p...
- Patent number 11,433,633
- Issue date Sep 6, 2022
- Massachusetts Institute of Technology
- Samuel Eli Calisch
- A43 - FOOTWEAR
Information Patent Grant
Power supply module used in a smart terminal and power supply modul...
- Patent number 11,419,214
- Issue date Aug 16, 2022
- Delta Electronics (Shanghai) Co., Ltd.
- Pengkai Ji
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Tamper proof payment reader
- Patent number 11,347,948
- Issue date May 31, 2022
- Molex, LLC
- Tsuey Choo Lily Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Micro-electronic package with substrate protrusion to facilitate di...
- Patent number 11,282,717
- Issue date Mar 22, 2022
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor unit, vehicle positioning device, and vehicle
- Patent number 11,231,434
- Issue date Jan 25, 2022
- Seiko Epson Corporation
- Taketo Chino
- G05 - CONTROLLING REGULATING
Information Patent Grant
Stretchable electronics and method for fabricating the same
- Patent number 11,006,520
- Issue date May 11, 2021
- Electronics and Telecommunications Research Institute
- Seongdeok Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molded substrate and mounting structure for capacitor
- Patent number 10,984,949
- Issue date Apr 20, 2021
- FANUC CORPORATION
- Yuuki Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sheet-shaped stretchable structure, and resin composition for stret...
- Patent number 10,966,317
- Issue date Mar 30, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takatoshi Abe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Power supply module used in a smart terminal and power supply modul...
- Patent number 10,856,417
- Issue date Dec 1, 2020
- Delta Electronics (Shanghai) Co., Ltd.
- Pengkai Ji
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Wiring board and manufacturing method thereof
- Patent number 10,849,224
- Issue date Nov 24, 2020
- NGK Spark Plug Co., Ltd.
- Takahiro Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and manufacturing method thereof
- Patent number 10,813,217
- Issue date Oct 20, 2020
- NGK Spark Plug Co., Ltd.
- Takahiro Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a component embedded package carrier
- Patent number 10,798,822
- Issue date Oct 6, 2020
- Subtron Technology Co., Ltd.
- Jing-Cyuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin multilayer substrate and an electronic device and a joint str...
- Patent number 10,756,462
- Issue date Aug 25, 2020
- Murata Manufacturing Co., Ltd.
- Chu Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic unit
- Patent number 10,714,461
- Issue date Jul 14, 2020
- Vishay Semiconductor GmbH
- Christoph Paul Gebauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of a multi-layer circuit board
- Patent number 10,609,824
- Issue date Mar 31, 2020
- Winbond Electronics Corp.
- Yu-Ming Chen
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Versatile and reliable intelligent package
- Patent number 10,607,950
- Issue date Mar 31, 2020
- Stora Enso Oyj
- Juha Maijala
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITE MEMBER
- Publication number 20250234453
- Publication date Jul 17, 2025
- Hitachi, Ltd
- Daigo KOMESU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20250203770
- Publication date Jun 19, 2025
- Chipbond Technology Corporation
- Ting-Yi Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIMPLE ON CIRCUIT BOARD FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOAR...
- Publication number 20250151191
- Publication date May 8, 2025
- Dell Products L.P.
- Earl BOONE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250081335
- Publication date Mar 6, 2025
- Industrial Technology Research Institute
- Yi-Rong Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC SUB-ASSEMBLY INCLUDING CERAMIC SUBSTRATE WITH CONDUCTIVE...
- Publication number 20240407096
- Publication date Dec 5, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Ihab KHOURY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20240164028
- Publication date May 16, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Seon Ha Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240155777
- Publication date May 9, 2024
- InnoLux Corporation
- Yuan-Lin WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT, DISPLAY APPARATUS, AND IMAGING APPARATUS
- Publication number 20240107670
- Publication date Mar 28, 2024
- Canon Kabushiki Kaisha
- JUN TSUKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BUMP STRUCTURE OF CIRCUIT BOARD AND MANUFACTURING METHOD...
- Publication number 20240074047
- Publication date Feb 29, 2024
- ADVANCED FLEXIBLE CIRCUITS CO., LTD.
- KUO-FU SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BASE MEMBER, ELECTRONIC DEVICE, AND STRUCTURE
- Publication number 20240032190
- Publication date Jan 25, 2024
- Canon Kabushiki Kaisha
- KOICHI ODAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnects for Electrical Components Positioned Adjacent to Vehi...
- Publication number 20230286333
- Publication date Sep 14, 2023
- TDK Corporation
- Vibhu Vivek
- B60 - VEHICLES IN GENERAL
Information Patent Application
CONNECTION BODY AND HARNESS
- Publication number 20230187855
- Publication date Jun 15, 2023
- Japan Aviation Electronics Industry, Limited
- Kentaro TODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR TEMPERATURE MEASUREMENT
- Publication number 20230021547
- Publication date Jan 26, 2023
- SMA Solar Technology AG
- Felix Muehlhausen
- G01 - MEASURING TESTING
Information Patent Application
MULTIPLE IN-MOLD ELECTRONICS STRUCTURE AND METHOD OF MANUFACTURING...
- Publication number 20230020151
- Publication date Jan 19, 2023
- INTOPS CO., LTD.
- sung-hoon Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND FABRICATION THEREOF
- Publication number 20220377889
- Publication date Nov 24, 2022
- DELPHI TECHNOLOGIES IP LIMITED
- Kok Wee YEO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE SUBSTRATE
- Publication number 20220359404
- Publication date Nov 10, 2022
- Japan Display Inc.
- Takumi SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20220353987
- Publication date Nov 3, 2022
- KYOCERA CORPORATION
- Seiichirou ITOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO-ELECTRONIC PACKAGE WITH SUBSTRATE PROTRUSION TO FACILITATE DI...
- Publication number 20220165585
- Publication date May 26, 2022
- Intel Corporation
- Ziyin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnects for Electrical Components Positioned Adjacent to Vehi...
- Publication number 20220134810
- Publication date May 5, 2022
- TDK Corporation
- Vibhu Vivek
- B60 - VEHICLES IN GENERAL
Information Patent Application
POWER ELECTRONIC SWITCHING DEVICE, POWER SEMICONDUCTOR MODULE THERE...
- Publication number 20220046798
- Publication date Feb 10, 2022
- SEMIKRON ELEKTRONIK GMBH & CO. KG
- Markus Düsel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TAMPER PROOF PAYMENT READER
- Publication number 20210303805
- Publication date Sep 30, 2021
- Molex, LLC
- Tsuey Choo Lily CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STRETCHABLE WIRING BODY AND STRETCHABLE BOARD
- Publication number 20210136912
- Publication date May 6, 2021
- FUJIKURA LTD.
- Kazutoshi Koshimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FINGERPRINT IDENTIFICATION APPARATUS AND ELECTRONIC DEVICE
- Publication number 20210004558
- Publication date Jan 7, 2021
- Shenzhen Goodix Technology Co., Ltd.
- Fanzhou ZENG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE WITH ANTENNA, AND ANTENNA MODULE
- Publication number 20200343618
- Publication date Oct 29, 2020
- MURATA MANUFACTURING CO., LTD.
- Yoshitaka ECHIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN MOLDED SUBSTRATE AND MOUNTING STRUCTURE FOR CAPACITOR
- Publication number 20200227206
- Publication date Jul 16, 2020
- FANUC CORPORATION
- Yuuki INOUE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RECIPROCAL PCB MANUFACTURING PROCESS
- Publication number 20200120808
- Publication date Apr 16, 2020
- Intel Corporation
- Tyler Leuten
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN MULTILAYER SUBSTRATE AND AN ELECTRONIC DEVICE AND A JOINT STR...
- Publication number 20200076097
- Publication date Mar 5, 2020
- Murata Manufacturing Co., Ltd.
- Chu XU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BODY ASSEMBLY, WIRING BOARD, AND TOUCH SENSOR
- Publication number 20200064971
- Publication date Feb 27, 2020
- FUJIKURA LTD.
- Yuki Suto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STRETCHABLE ELECTRONICS AND METHOD FOR FABRICATING THE SAME
- Publication number 20190342993
- Publication date Nov 7, 2019
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Seongdeok AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT STRUCTURE OF A RESIN MULTILAYER SUBSTRATE AND A CIRCUIT BOARD
- Publication number 20190334262
- Publication date Oct 31, 2019
- Murata Manufacturing Co., Ltd.
- Chu XU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Locally raised area or protrusion of insulating substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connection body and harness

Flexible substrate

Flexible wiring board

Device for temperature measurement

Wiring board and method for manufacturing wiring board

Reciprocal PCB manufacturing process

Printed circuit board and fabrication thereof

3D-printed, PCB composite structures, and formation methods

Fingerprint identification apparatus and electronic device

Interconnects for electrical components positioned adjacent to vehi...

Power electronic switching device, power semiconductor module there...

Micro-electronic package with substrate protrusion to facilitate di...

Multiple in-mold electronics structure and method of manufacturing...

Substrate with antenna, and antenna module

Fabrication of three-dimensional kirigami structures with tunable p...

Power supply module used in a smart terminal and power supply modul...

Tamper proof payment reader

Micro-electronic package with substrate protrusion to facilitate di...

Sensor unit, vehicle positioning device, and vehicle

Stretchable electronics and method for fabricating the same

Resin molded substrate and mounting structure for capacitor

Sheet-shaped stretchable structure, and resin composition for stret...

Power supply module used in a smart terminal and power supply modul...

Wiring board and manufacturing method thereof

Wiring board and manufacturing method thereof

Method of manufacturing a component embedded package carrier

Resin multilayer substrate and an electronic device and a joint str...

Electronic unit

Manufacturing method of a multi-layer circuit board

Versatile and reliable intelligent package

Patents Applicationslast 30 patents

COMPOSITE MEMBER

FLEXIBLE CIRCUIT BOARD

DIMPLE ON CIRCUIT BOARD FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOAR...

ELECTRONIC DEVICE

ELECTRONIC SUB-ASSEMBLY INCLUDING CERAMIC SUBSTRATE WITH CONDUCTIVE...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME

ELECTRONIC DEVICE

ELECTRONIC COMPONENT, DISPLAY APPARATUS, AND IMAGING APPARATUS

CONDUCTIVE BUMP STRUCTURE OF CIRCUIT BOARD AND MANUFACTURING METHOD...

BASE MEMBER, ELECTRONIC DEVICE, AND STRUCTURE

Interconnects for Electrical Components Positioned Adjacent to Vehi...

CONNECTION BODY AND HARNESS

DEVICE FOR TEMPERATURE MEASUREMENT

MULTIPLE IN-MOLD ELECTRONICS STRUCTURE AND METHOD OF MANUFACTURING...

PRINTED CIRCUIT BOARD AND FABRICATION THEREOF

FLEXIBLE SUBSTRATE

WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

MICRO-ELECTRONIC PACKAGE WITH SUBSTRATE PROTRUSION TO FACILITATE DI...

Interconnects for Electrical Components Positioned Adjacent to Vehi...

POWER ELECTRONIC SWITCHING DEVICE, POWER SEMICONDUCTOR MODULE THERE...

TAMPER PROOF PAYMENT READER

STRETCHABLE WIRING BODY AND STRETCHABLE BOARD

FINGERPRINT IDENTIFICATION APPARATUS AND ELECTRONIC DEVICE

SUBSTRATE WITH ANTENNA, AND ANTENNA MODULE

RESIN MOLDED SUBSTRATE AND MOUNTING STRUCTURE FOR CAPACITOR

RECIPROCAL PCB MANUFACTURING PROCESS

RESIN MULTILAYER SUBSTRATE AND AN ELECTRONIC DEVICE AND A JOINT STR...

WIRING BODY ASSEMBLY, WIRING BOARD, AND TOUCH SENSOR

STRETCHABLE ELECTRONICS AND METHOD FOR FABRICATING THE SAME

JOINT STRUCTURE OF A RESIN MULTILAYER SUBSTRATE AND A CIRCUIT BOARD