Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier

Industry

CPC
H05K3/007

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/007Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing photoelectric composite circuit board
- Patent number 12,153,252
- Issue date Nov 26, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Wei-Liang Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure-sensitive adhesive sheet-including wiring circuit board an...
- Patent number 12,144,125
- Issue date Nov 12, 2024
- Nitto Denko Corporation
- Takahiro Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Panel molded electronic assemblies with multi-surface conductive co...
- Patent number 12,096,549
- Issue date Sep 17, 2024
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding component in component carrier by component fixation stru...
- Patent number 12,075,561
- Issue date Aug 27, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Timo Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-demand method of making PCB pallets using additive manufacturing
- Patent number 12,041,723
- Issue date Jul 16, 2024
- JABIL INC.
- Luke Rodgers
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Methods of forming flexible interconnect circuits
- Patent number 12,035,459
- Issue date Jul 9, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive film and method for forming permanent mask resist
- Patent number 12,032,292
- Issue date Jul 9, 2024
- Resonac Corporation
- Hideki Etori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device including semiconductor chips and method for producing such...
- Patent number 12,027,481
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming interconnect circuits
- Patent number 11,979,976
- Issue date May 7, 2024
- CelLink Corporation
- Kevin Michael Coakley
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Stacking arrays and separator bodies during processing of component...
- Patent number 11,943,874
- Issue date Mar 26, 2024
- AT&S (Chongqing) Company Limited
- Amin Nickkolgh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing circuit board
- Patent number 11,924,960
- Issue date Mar 5, 2024
- Autonetworks Technologies, Ltd.
- Akira Haraguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive resin composition, dry film using same, printed wiri...
- Patent number 11,921,424
- Issue date Mar 5, 2024
- Hitachi Chemical Company, Ltd. (FIPAS)
- Nobuhito Komuro
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,917,756
- Issue date Feb 27, 2024
- Ibiden Co., Ltd.
- Yuji Ikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for producing an etch resist pattern on a metallic surface
- Patent number 11,807,947
- Issue date Nov 7, 2023
- Kateeva, Inc.
- Nava Shpaisman
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Composite layer circuit element and manufacturing method thereof
- Patent number 11,764,077
- Issue date Sep 19, 2023
- INNOLUX CORPORATION
- Chuan-Ming Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of metal structure
- Patent number 11,758,666
- Issue date Sep 12, 2023
- Innolux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board utilizing optical signals in addition to electrical s...
- Patent number 11,754,781
- Issue date Sep 12, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Wei-Liang Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Panel-molded electronic assemblies
- Patent number 11,751,338
- Issue date Sep 5, 2023
- Vicor Corporation
- Patrizio Vinciarelli
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of circuit carrier board structure
- Patent number 11,678,441
- Issue date Jun 13, 2023
- Unimicron Technology Corp.
- Wei-Ti Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of metal structure
- Patent number 11,672,081
- Issue date Jun 6, 2023
- Innolux Corporation
- Hsueh-Hsuan Chou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing laminate having patterned metal foil, and lami...
- Patent number 11,664,240
- Issue date May 30, 2023
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing printed circuit board
- Patent number 11,641,716
- Issue date May 2, 2023
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Kou Noguchi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Composite part with integral electronic instrumentation circuit and...
- Patent number 11,639,916
- Issue date May 2, 2023
- SAFRAN
- Sabri Janfaoui
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Process for fabrication of a printed circuit board using a semi-add...
- Patent number 11,638,354
- Issue date Apr 25, 2023
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
On-demand method of making PCB pallets using additive manufacturing
- Patent number 11,589,487
- Issue date Feb 21, 2023
- Jabil Inc.
- Luke Rodgers
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Device including semiconductor chips and method for producing such...
- Patent number 11,569,186
- Issue date Jan 31, 2023
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern forming method
- Patent number 11,561,468
- Issue date Jan 24, 2023
- Canon Kabushiki Kaisha
- Tomohiro Saito
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Package stack structure and method for manufacturing the same
- Patent number 11,516,925
- Issue date Nov 29, 2022
- Siliconware Precision Industries Co., Ltd.
- Han-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with electronic component embedded therein
- Patent number 11,490,503
- Issue date Nov 1, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chang Hwa Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal substrate and method of manufacturing the same
- Patent number 11,483,934
- Issue date Oct 25, 2022
- AZOTEK CO., LTD.
- Hung-Jung Lee
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
Manufacturing a Component Carrier by a Nano Imprint Lithography Pro...
- Publication number 20240381538
- Publication date Nov 14, 2024
- AT&S Austria Technologie & Systemtechnik
- Heinrich TRISCHLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...
- Publication number 20240355767
- Publication date Oct 24, 2024
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING POWER MODULE
- Publication number 20240306304
- Publication date Sep 12, 2024
- HYUNDAI MOBIS CO., LTD.
- Chan Yang CHOE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Circuit Methods And Devices
- Publication number 20240276632
- Publication date Aug 15, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASE BOARD FLOATING ARM
- Publication number 20240276647
- Publication date Aug 15, 2024
- Sheng Chuan Technology Co., Ltd.
- Hsin-Jung Peng
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
Method for preparing novel material layer structure of high-frequen...
- Publication number 20240244757
- Publication date Jul 18, 2024
- LongKai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD AND METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20240206053
- Publication date Jun 20, 2024
- Nitto Denko Corporation
- Takahiro IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT CIRCUIT METHODS AND DEVICES
- Publication number 20240098873
- Publication date Mar 21, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROCESSING SUBSTRATE
- Publication number 20240040704
- Publication date Feb 1, 2024
- VIA MECHANICS, LTD.
- Yasushi ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE
- Publication number 20240035167
- Publication date Feb 1, 2024
- Kateeva, Inc.
- Nava Shpaisman
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20230397328
- Publication date Dec 7, 2023
- FUJIKURA LTD.
- Kazutoshi Koshimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE LAYER CIRCUIT ELEMENT
- Publication number 20230377904
- Publication date Nov 23, 2023
- InnoLux Corporation
- Chuan-Ming Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230380071
- Publication date Nov 23, 2023
- InnoLux Corporation
- Hsueh-Hsuan CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PHOTOELECTRIC COMPOSITE CIRCUIT BOARD
- Publication number 20230375780
- Publication date Nov 23, 2023
- Avary Holding (Shenzhen) Co., Limited.
- WEI-LIANG WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM USING SAME, PRINTED WIRI...
- Publication number 20230350292
- Publication date Nov 2, 2023
- Resonac Corporation
- Nobuhito KOMURO
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20230247754
- Publication date Aug 3, 2023
- AUTONETWORKS TECHNOLOGIES, LTD.
- Akira Haraguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230199957
- Publication date Jun 22, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...
- Publication number 20230170319
- Publication date Jun 1, 2023
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Printed Circuit Boards
- Publication number 20230159779
- Publication date May 25, 2023
- AGFA-GEVAERT N.V.
- Carlo Uyttendaele
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD
- Publication number 20230083007
- Publication date Mar 16, 2023
- InnoLux Corporation
- Jia Sin Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Universal Pin Production Support (UPPS)
- Publication number 20230067686
- Publication date Mar 2, 2023
- Matthew Miller Reggio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method And Apparatus For Singulation Detachment
- Publication number 20230025354
- Publication date Jan 26, 2023
- Hutchinson Technology Incorporated
- Erich W. Bierbrauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220359361
- Publication date Nov 10, 2022
- Advanced Semiconductor Engineering, Inc.
- Chun-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD UTILIZING OPTICAL SIGNALS IN ADDITION TO ELECTRICAL S...
- Publication number 20220357508
- Publication date Nov 10, 2022
- Avary Holding (Shenzhen) Co., Limited.
- WEI-LIANG WU
- G02 - OPTICS
Information Patent Application
Method for preparing novel material layer structure of high-frequen...
- Publication number 20220304161
- Publication date Sep 22, 2022
- LongKai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOPOLYMER FOR ANTI-YELLOWING AND ANTI-THERMAL CRACKING APPLICATIONS
- Publication number 20220289884
- Publication date Sep 15, 2022
- NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
- Liang ZHANG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TEMPORARY CARRIER PLATE AND MANUFACTURING METHOD THEREOF, AND MANUF...
- Publication number 20220287184
- Publication date Sep 8, 2022
- Nantong ACCESS Semiconductor CO.,LTD.
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE
- Publication number 20220136113
- Publication date May 5, 2022
- Kateeva, Inc.
- Nava Shpaisman
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
MANUFACTURING METHOD OF METAL STRUCTURE
- Publication number 20220087028
- Publication date Mar 17, 2022
- InnoLux Corporation
- Hsueh-Hsuan CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER SUBSTRATE STRUCTURE WHICH CAN BE PEELED OFF PRECISELY A...
- Publication number 20220087027
- Publication date Mar 17, 2022
- Princo Corp.
- Pei-Liang CHIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing photoelectric composite circuit board

Pressure-sensitive adhesive sheet-including wiring circuit board an...

Panel molded electronic assemblies with multi-surface conductive co...

Embedding component in component carrier by component fixation stru...

On-demand method of making PCB pallets using additive manufacturing

Methods of forming flexible interconnect circuits

Photosensitive film and method for forming permanent mask resist

Device including semiconductor chips and method for producing such...

Methods of forming interconnect circuits

Stacking arrays and separator bodies during processing of component...

Circuit board and method for manufacturing circuit board

Photosensitive resin composition, dry film using same, printed wiri...

Printed wiring board and method for manufacturing printed wiring board

Methods for producing an etch resist pattern on a metallic surface

Composite layer circuit element and manufacturing method thereof

Manufacturing method of metal structure

Circuit board utilizing optical signals in addition to electrical s...

Panel-molded electronic assemblies

Manufacturing method of circuit carrier board structure

Manufacturing method of metal structure

Method for producing laminate having patterned metal foil, and lami...

Method for manufacturing printed circuit board

Composite part with integral electronic instrumentation circuit and...

Process for fabrication of a printed circuit board using a semi-add...

On-demand method of making PCB pallets using additive manufacturing

Device including semiconductor chips and method for producing such...

Pattern forming method

Package stack structure and method for manufacturing the same

Substrate with electronic component embedded therein

Metal substrate and method of manufacturing the same

Patents Applicationslast 30 patents

Manufacturing a Component Carrier by a Nano Imprint Lithography Pro...

DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...

APPARATUS AND METHOD FOR MANUFACTURING POWER MODULE

Interconnect Circuit Methods And Devices

BASE BOARD FLOATING ARM

Method for preparing novel material layer structure of high-frequen...

WIRING CIRCUIT BOARD AND METHOD FOR PRODUCING WIRING CIRCUIT BOARD

INTERCONNECT CIRCUIT METHODS AND DEVICES

METHOD OF PROCESSING SUBSTRATE

METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

COMPOSITE LAYER CIRCUIT ELEMENT

ELECTRONIC DEVICE

METHOD FOR MANUFACTURING PHOTOELECTRIC COMPOSITE CIRCUIT BOARD

PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM USING SAME, PRINTED WIRI...

CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD

MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREFOR

DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...

Method of Manufacturing Printed Circuit Boards

METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD

Universal Pin Production Support (UPPS)

Method And Apparatus For Singulation Detachment

SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT BOARD UTILIZING OPTICAL SIGNALS IN ADDITION TO ELECTRICAL S...

Method for preparing novel material layer structure of high-frequen...

PHOTOPOLYMER FOR ANTI-YELLOWING AND ANTI-THERMAL CRACKING APPLICATIONS

TEMPORARY CARRIER PLATE AND MANUFACTURING METHOD THEREOF, AND MANUF...

METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE

MANUFACTURING METHOD OF METAL STRUCTURE

MULTI-LAYER SUBSTRATE STRUCTURE WHICH CAN BE PEELED OFF PRECISELY A...