manufactured by mounting on or attaching to a structure having a conductive layer

Industry

CPC
H05K1/188

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/188manufactured by mounting on or attaching to a structure having a conductive layer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic component embedded substrate
- Patent number 12,185,471
- Issue date Dec 31, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid flexible printed circuit board and electronic device comprisi...
- Patent number 12,185,464
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Youngsun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board having embedded component
- Patent number 12,185,478
- Issue date Dec 31, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cyclic imide resin composition, prepreg, copper-clad laminate and p...
- Patent number 12,146,057
- Issue date Nov 19, 2024
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Iguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition and article made therefrom
- Patent number 12,091,545
- Issue date Sep 17, 2024
- ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.
- Xingxing Yao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Metal-ceramic substrate with a foil formed for direct cooling as su...
- Patent number 12,087,660
- Issue date Sep 10, 2024
- Heraeus Deutschland GmbH & Co. KG
- Peter Dietrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board producing apparatus
- Patent number 12,075,569
- Issue date Aug 27, 2024
- FUJIFILM Business Innovation Corp.
- Yasuo Matsumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,063,743
- Issue date Aug 13, 2024
- Nichia Corporation
- Masakazu Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device including semiconductor chips and method for producing such...
- Patent number 12,027,481
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a block device with a shield and method of fabri...
- Patent number 11,985,804
- Issue date May 14, 2024
- QUALCOMM Incorporated
- Anirudh Bhat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Curable resin composition, dry film, resin-clad copper foil, cured...
- Patent number 11,891,474
- Issue date Feb 6, 2024
- TAIYO HOLDINGS CO., LTD.
- Kazuhisa Yamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Driver board assemblies and methods of forming a driver board assembly
- Patent number 11,864,323
- Issue date Jan 2, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition and article made therefrom
- Patent number 11,753,543
- Issue date Sep 12, 2023
- ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.
- Xingxing Yao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing an electronic module and electronic module
- Patent number 11,716,816
- Issue date Aug 1, 2023
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processor interposer and electronic system including the processor...
- Patent number 11,683,889
- Issue date Jun 20, 2023
- Infineon Technologies Austria AG
- Danny Clavette
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic element mounting substrate and electronic device
- Patent number 11,617,267
- Issue date Mar 28, 2023
- Kyocera Corporation
- Yukio Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Poly-supported copper foil
- Patent number 11,584,109
- Issue date Feb 21, 2023
- Advanced Copper Foil Inc.
- Kieran Healy
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit board
- Patent number 11,576,257
- Issue date Feb 7, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Wei-Liang Wu
- G02 - OPTICS
Information Patent Grant
Multi-layer 3D foil package
- Patent number 11,570,898
- Issue date Jan 31, 2023
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Christof Landesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device including semiconductor chips and method for producing such...
- Patent number 11,569,186
- Issue date Jan 31, 2023
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component embedded in component carrier and having an exposed side...
- Patent number 11,570,897
- Issue date Jan 31, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Bettina Schuster
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded power device module, processor substrate and electronic sy...
- Patent number 11,552,049
- Issue date Jan 10, 2023
- Infineon Technologies Austria AG
- Danny Clavette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making contact with a component embedded in a printed ci...
- Patent number 11,523,520
- Issue date Dec 6, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board
- Patent number 11,483,928
- Issue date Oct 25, 2022
- Sumitomo Electric Printed Circuits, Inc.
- Yoshiro Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Poly-supported copper foil
- Patent number 11,453,204
- Issue date Sep 27, 2022
- Advanced Copper Foil Inc.
- Kieran Healy
- B32 - LAYERED PRODUCTS
Information Patent Grant
Embedded circuit board and method of manufacturing same
- Patent number 11,452,211
- Issue date Sep 20, 2022
- SHENNAN CIRCUITS CO., LTD.
- Lixiang Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,439,019
- Issue date Sep 6, 2022
- Nichia Corporation
- Masakazu Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,439,022
- Issue date Sep 6, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Young Il Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing circuit board
- Patent number 11,399,430
- Issue date Jul 26, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Wei-Liang Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD ASSEMBLY, DISPLAY MODULE AND MANUFACTURING METHOD THE...
- Publication number 20240389236
- Publication date Nov 21, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Qijun ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...
- Publication number 20240355767
- Publication date Oct 24, 2024
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Foil for Circuit Board, Metal Foil with Carrier, Copper-Clad...
- Publication number 20240244755
- Publication date Jul 18, 2024
- Qiang GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORELESS PLANAR COIL AND POWER TRANSFORMER
- Publication number 20240242876
- Publication date Jul 18, 2024
- ABB Schweiz AG
- Huan Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240206064
- Publication date Jun 20, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED SUBSTRATE
- Publication number 20240090135
- Publication date Mar 14, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LITHOGRAPHIC STRAIN GAUGE IN AN ELECTRICALLY CONDUCTING SUBSTRATE
- Publication number 20230417609
- Publication date Dec 28, 2023
- Microsoft Technology Licensing, LLC
- Luke Thomas GREGORY
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20230397338
- Publication date Dec 7, 2023
- TDK Corporation
- Atsuhiro TSUYOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT B...
- Publication number 20230337363
- Publication date Oct 19, 2023
- UNIMICRON GERMANY GMBH
- Oliver HOLZ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC MOUNTING SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20230232536
- Publication date Jul 20, 2023
- Kyocera Corporation
- Yukio MORITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Asymmetric Build-Up And Methods for Determin...
- Publication number 20230217589
- Publication date Jul 6, 2023
- AT&S (China) Co. Ltd.
- Diego LORENZONI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230199956
- Publication date Jun 22, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Sang Hoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...
- Publication number 20230170319
- Publication date Jun 1, 2023
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED SUBSTRATE
- Publication number 20230140708
- Publication date May 4, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESISTOR-EMBEDDED CIRCUIT BOARD AND METHOD FOR PROCESSING THE RESIS...
- Publication number 20230064497
- Publication date Mar 2, 2023
- SHENNAN CIRCUITS CO., LTD.
- Ke Leng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Protection Structure for an Aperture for an Optical Component Embed...
- Publication number 20230038270
- Publication date Feb 9, 2023
- AT&S (China) Co. Ltd.
- Seok Kim TAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A BLOCK DEVICE WITH A SHIELD
- Publication number 20230023868
- Publication date Jan 26, 2023
- QUALCOMM Incorporated
- Anirudh Bhat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED SUBSTRATE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE
- Publication number 20230028233
- Publication date Jan 26, 2023
- Huawei Technologies Co., Ltd
- Chao SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220369466
- Publication date Nov 17, 2022
- Nichia Corporation.
- Masakazu SAKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLY-SUPPORTED COPPER FOIL
- Publication number 20220347972
- Publication date Nov 3, 2022
- Advanced Copper Foil Inc.
- Kieran HEALY
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTRONIC ELEMENT MOUNTING SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20220304159
- Publication date Sep 22, 2022
- Kyocera Corporation
- Yukio MORITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20220279647
- Publication date Sep 1, 2022
- Avary Holding (Shenzhen) Co., Limited.
- WEI-LIANG WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CYCLIC IMIDE RESIN COMPOSITION, PREPREG, COPPER-CLAD LAMINATE AND P...
- Publication number 20220195189
- Publication date Jun 23, 2022
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki IGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20220174813
- Publication date Jun 2, 2022
- Avary Holding (Shenzhen) Co., Limited.
- WEI-LIANG WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE WITH PASSIVE COMPONENT BETWEEN SUBSTRATES
- Publication number 20220139814
- Publication date May 5, 2022
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURABLE RESIN COMPOSITION, DRY FILM, RESIN-CLAD COPPER FOIL, CURED...
- Publication number 20220049048
- Publication date Feb 17, 2022
- Taiyo Ink MFG. Co., Ltd.
- Kazuhisa YAMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DRIVER BOARD ASSEMBLIES AND METHODS OF FORMING A DRIVER BOARD ASSEMBLY
- Publication number 20220022323
- Publication date Jan 20, 2022
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME
- Publication number 20220015238
- Publication date Jan 13, 2022
- SHENNAN CIRCUITS CO., LTD.
- LIXIANG HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSOR INTERPOSER AND ELECTRONIC SYSTEM INCLUDING THE PROCESSOR...
- Publication number 20220007512
- Publication date Jan 6, 2022
- Danny Clavette
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board structure and method for manufacturing a circuit boar...
- Publication number 20210392752
- Publication date Dec 16, 2021
- ImberaTek LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS

manufactured by mounting on or attaching to a structure having a conductive layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic component embedded substrate

Rigid flexible printed circuit board and electronic device comprisi...

Printed circuit board having embedded component

Cyclic imide resin composition, prepreg, copper-clad laminate and p...

Resin composition and article made therefrom

Metal-ceramic substrate with a foil formed for direct cooling as su...

Circuit board producing apparatus

Printed circuit board

Device including semiconductor chips and method for producing such...

Package comprising a block device with a shield and method of fabri...

Curable resin composition, dry film, resin-clad copper foil, cured...

Driver board assemblies and methods of forming a driver board assembly

Circuit board structure and method for manufacturing a circuit boar...

Resin composition and article made therefrom

Method for manufacturing an electronic module and electronic module

Processor interposer and electronic system including the processor...

Electronic element mounting substrate and electronic device

Poly-supported copper foil

Circuit board

Multi-layer 3D foil package

Device including semiconductor chips and method for producing such...

Component embedded in component carrier and having an exposed side...

Embedded power device module, processor substrate and electronic sy...

Method for making contact with a component embedded in a printed ci...

Flexible printed circuit board

Poly-supported copper foil

Embedded circuit board and method of manufacturing same

Printed circuit board and method of manufacturing the same

Printed circuit board

Method for manufacturing circuit board

Patents Applicationslast 30 patents

CIRCUIT BOARD ASSEMBLY, DISPLAY MODULE AND MANUFACTURING METHOD THE...

DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...

Metal Foil for Circuit Board, Metal Foil with Carrier, Copper-Clad...

CORELESS PLANAR COIL AND POWER TRANSFORMER

PRINTED WIRING BOARD

ELECTRONIC COMPONENT EMBEDDED SUBSTRATE

LITHOGRAPHIC STRAIN GAUGE IN AN ELECTRICALLY CONDUCTING SUBSTRATE

ELECTRONIC COMPONENT

METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT B...

ELECTRONIC MOUNTING SUBSTRATE AND ELECTRONIC DEVICE

Component Carrier With Asymmetric Build-Up And Methods for Determin...

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...

ELECTRONIC COMPONENT EMBEDDED SUBSTRATE

RESISTOR-EMBEDDED CIRCUIT BOARD AND METHOD FOR PROCESSING THE RESIS...

Protection Structure for an Aperture for an Optical Component Embed...

PACKAGE COMPRISING A BLOCK DEVICE WITH A SHIELD

EMBEDDED SUBSTRATE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD

POLY-SUPPORTED COPPER FOIL

ELECTRONIC ELEMENT MOUNTING SUBSTRATE AND ELECTRONIC DEVICE

CIRCUIT BOARD

CYCLIC IMIDE RESIN COMPOSITION, PREPREG, COPPER-CLAD LAMINATE AND P...

METHOD FOR MANUFACTURING CIRCUIT BOARD

ELECTRONIC PACKAGE WITH PASSIVE COMPONENT BETWEEN SUBSTRATES

CURABLE RESIN COMPOSITION, DRY FILM, RESIN-CLAD COPPER FOIL, CURED...

DRIVER BOARD ASSEMBLIES AND METHODS OF FORMING A DRIVER BOARD ASSEMBLY

EMBEDDED CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME

PROCESSOR INTERPOSER AND ELECTRONIC SYSTEM INCLUDING THE PROCESSOR...

Circuit board structure and method for manufacturing a circuit boar...