Manufacturing methods

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H01L24/35

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/35Manufacturing methods

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device packages including conductors electrically con...
- Patent number 12,062,635
- Issue date Aug 13, 2024
- Micron Technology, Inc.
- Po Chih Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with branch electrode terminal and method of m...
- Patent number 11,901,326
- Issue date Feb 13, 2024
- Mitsubishi Electric Corporation
- Shinsuke Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package comprising power module and passive el...
- Patent number 11,848,296
- Issue date Dec 19, 2023
- Advanced Semiconductor Engineering, Inc.
- Han-Chee Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and processes for increasing semiconductor device reliability
- Patent number 11,784,155
- Issue date Oct 10, 2023
- Wolfspeed, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging device, chip packaging method, and package chip
- Patent number 11,764,184
- Issue date Sep 19, 2023
- HOSIN GLOBAL ELECTRONICS CO., LTD
- Chen-Nan Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,735,505
- Issue date Aug 22, 2023
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive manufacturing of a frontside or backside interconnect of a...
- Patent number 11,688,713
- Issue date Jun 27, 2023
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip bond semiconductor packages and assembly tools
- Patent number 11,676,934
- Issue date Jun 13, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Albert Louis Bove
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module, method of manufacturing connector, and method of...
- Patent number 11,437,340
- Issue date Sep 6, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and processes for increasing semiconductor device reliability
- Patent number 11,289,441
- Issue date Mar 29, 2022
- Wolfspeed, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-clip structure for die bonding
- Patent number 11,189,592
- Issue date Nov 30, 2021
- Infineon Technologies Austria AG
- Balehithlu Manjappaiah Upendra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for forming semiconductor device packages and related pa...
- Patent number 11,171,109
- Issue date Nov 9, 2021
- Micron Technology, Inc.
- Po Chih Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package comprising power module and passive el...
- Patent number 11,158,596
- Issue date Oct 26, 2021
- Advanced Semiconductor Engineering, Inc.
- Han-Chee Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,037,863
- Issue date Jun 15, 2021
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Porous Cu on Cu surface for semiconductor packages
- Patent number 10,914,018
- Issue date Feb 9, 2021
- Infineon Technologies AG
- Norbert Pielmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier for hybrid socket movement reduction
- Patent number 10,834,839
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Theron Lee Lewis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,727,163
- Issue date Jul 28, 2020
- Mitsubishi Electric Corporation
- Junji Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode terminal, semiconductor device, and power conversion appa...
- Patent number 10,714,447
- Issue date Jul 14, 2020
- Mitsubishi Electric Corporation
- Rei Yoneyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with vertical interconnect between carrier and clip
- Patent number 10,707,158
- Issue date Jul 7, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Damaging components with defective electrical couplings
- Patent number 10,529,632
- Issue date Jan 7, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection member with bulk body and electrically and thermally con...
- Patent number 10,366,946
- Issue date Jul 30, 2019
- Infineon Technologies AG
- Wu Hu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for mitigating ESD during wafer bonding
- Patent number 10,236,263
- Issue date Mar 19, 2019
- GLOBALFOUNDRIES Inc.
- Luke England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Damaging components with defective electrical couplings
- Patent number 10,103,072
- Issue date Oct 16, 2018
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging solutions for devices and systems comprising lateral GaN...
- Patent number 9,824,949
- Issue date Nov 21, 2017
- GaN Systems Inc.
- Cameron McKnight-MacNeil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and method of manufacturing power module
- Patent number 9,673,118
- Issue date Jun 6, 2017
- Mitsubishi Electric Corporation
- Masaki Taya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,633,967
- Issue date Apr 25, 2017
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,609,775
- Issue date Mar 28, 2017
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module package and method of manufacturing the same
- Patent number 9,524,929
- Issue date Dec 20, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip power semiconductor device
- Patent number 9,443,760
- Issue date Sep 13, 2016
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,402,311
- Issue date Jul 26, 2016
- NSK Ltd.
- Takashi Sunaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR FORMING A SEMICONDUCTOR DEVICE
- Publication number 20240355773
- Publication date Oct 24, 2024
- STATS ChipPAC Pte Ltd.
- KyungEun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING RIBBON...
- Publication number 20240250058
- Publication date Jul 25, 2024
- STMicroelectronics International N.V.
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20240178179
- Publication date May 30, 2024
- STMicroelectronics International N.V.
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR...
- Publication number 20240112990
- Publication date Apr 4, 2024
- Rohm Co., Ltd.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MANUFACTURING A TERMINAL APPARATUS FOR CON...
- Publication number 20240021436
- Publication date Jan 18, 2024
- ZF Friedrichshafen AG
- Ake Ewald
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20240021569
- Publication date Jan 18, 2024
- Fuji Electric Co., Ltd.
- Yoko NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE
- Publication number 20230282608
- Publication date Sep 7, 2023
- Infineon Technologies Austria AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND VEHICLE
- Publication number 20230260951
- Publication date Aug 17, 2023
- Fuji Electric Co., Ltd.
- Hitoshi NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING THE SAME
- Publication number 20230134075
- Publication date May 4, 2023
- NEXPERIA B.V.
- Chi Ho Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220254749
- Publication date Aug 11, 2022
- Mitsubishi Electric Corporation
- Shinsuke ASADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND PROCESSES FOR INCREASING SEMICONDUCTOR DEVICE RELIABILITY
- Publication number 20220216175
- Publication date Jul 7, 2022
- Wolfspeed, Inc.
- Sung Chul JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Clip Bond Having Multipl...
- Publication number 20220208716
- Publication date Jun 30, 2022
- UTAC Headquarters Pte. Ltd.
- Hyung Mook Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20220052013
- Publication date Feb 17, 2022
- Advanced Semiconductor Engineering, Inc.
- Han-Chee YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR FORMING SEMICONDUCTOR DEVICE PACKAGES AND RELATED PA...
- Publication number 20220037282
- Publication date Feb 3, 2022
- Micron Technology, Inc.
- Po Chih Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210313294
- Publication date Oct 7, 2021
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE COMPRISING POWER MODULE AND PASSIVE EL...
- Publication number 20210296278
- Publication date Sep 23, 2021
- Advanced Semiconductor Engineering, Inc.
- Han-Chee YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOLDABLE LAYERED CONNECTION, AND METHOD FOR MANUFACTURING A FOLDABL...
- Publication number 20210272922
- Publication date Sep 2, 2021
- INL-International Iberian Nanotechnology Laboratory
- Rosana Maria ALVES DIAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210265243
- Publication date Aug 26, 2021
- Kabushiki Kaisha Toshiba
- Hidetoshi KURAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION MEMBER, ELECTRICAL CONNECTION STRUCTURE, AND...
- Publication number 20210257327
- Publication date Aug 19, 2021
- Hitachi Metals, Ltd.
- Junya NISHINA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Additive Manufacturing of a Frontside or Backside Interconnect of a...
- Publication number 20210225798
- Publication date Jul 22, 2021
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Processes for Increasing Semiconductor Device Reliability
- Publication number 20210111144
- Publication date Apr 15, 2021
- Cree, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR FORMING SEMICONDUCTOR DEVICE PACKAGES AND RELATED PA...
- Publication number 20210091036
- Publication date Mar 25, 2021
- Micron Technology, Inc.
- Po Chih Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Clip with Angled Contact Surface and Raised Bridge Tec...
- Publication number 20210074667
- Publication date Mar 11, 2021
- Chai Chee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIPS FOR SEMICONDUCTOR PACKAGES
- Publication number 20210043549
- Publication date Feb 11, 2021
- INFINEON TECHNOLOGIES AG
- Ke Yan Tean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Porous Cu on Cu Surface for Semiconductor Packages
- Publication number 20200291538
- Publication date Sep 17, 2020
- INFINEON TECHNOLOGIES AG
- Norbert Pielmeier
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRONIC MODULE, METHOD OF MANUFACTURING CONNECTOR, AND METHOD OF...
- Publication number 20200273833
- Publication date Aug 27, 2020
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Kosuke IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Clip Structure for Die Bonding
- Publication number 20200105707
- Publication date Apr 2, 2020
- Balehithlu Manjappaiah Upendra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190139866
- Publication date May 9, 2019
- KABUSHIKI KAISHA TOSHIBA
- Hidetoshi KURAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connection member with bulk body and electrically and thermally con...
- Publication number 20190131218
- Publication date May 2, 2019
- INFINEON TECHNOLOGIES AG
- Wu Hu LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR MITIGATING ESD DURING WAFER BONDING
- Publication number 20190067217
- Publication date Feb 28, 2019
- GLOBALFOUNDRIES INC.
- Luke England
- H01 - BASIC ELECTRIC ELEMENTS

Manufacturing methods

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device packages including conductors electrically con...

Semiconductor device with branch electrode terminal and method of m...

Semiconductor device package comprising power module and passive el...

Systems and processes for increasing semiconductor device reliability

Chip packaging device, chip packaging method, and package chip

Semiconductor device

Additive manufacturing of a frontside or backside interconnect of a...

Clip bond semiconductor packages and assembly tools

Electronic module, method of manufacturing connector, and method of...

Systems and processes for increasing semiconductor device reliability

Multi-clip structure for die bonding

Techniques for forming semiconductor device packages and related pa...

Semiconductor device package comprising power module and passive el...

Semiconductor device

Porous Cu on Cu surface for semiconductor packages

Barrier for hybrid socket movement reduction

Semiconductor device

Electrode terminal, semiconductor device, and power conversion appa...

Package with vertical interconnect between carrier and clip

Damaging components with defective electrical couplings

Connection member with bulk body and electrically and thermally con...

Methods and structures for mitigating ESD during wafer bonding

Damaging components with defective electrical couplings

Packaging solutions for devices and systems comprising lateral GaN...

Power module and method of manufacturing power module

Semiconductor module

Semiconductor module

Semiconductor module package and method of manufacturing the same

Multichip power semiconductor device

Semiconductor module

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND A METHOD FOR FORMING A SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING RIBBON...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR...

METHOD AND APPARATUS FOR MANUFACTURING A TERMINAL APPARATUS FOR CON...

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

SEMICONDUCTOR DIE PACKAGE

SEMICONDUCTOR APPARATUS AND VEHICLE

SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SYSTEMS AND PROCESSES FOR INCREASING SEMICONDUCTOR DEVICE RELIABILITY

Semiconductor Device and Method of Forming Clip Bond Having Multipl...

SEMICONDUCTOR DEVICE PACKAGE

TECHNIQUES FOR FORMING SEMICONDUCTOR DEVICE PACKAGES AND RELATED PA...

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE PACKAGE COMPRISING POWER MODULE AND PASSIVE EL...

FOLDABLE LAYERED CONNECTION, AND METHOD FOR MANUFACTURING A FOLDABL...

SEMICONDUCTOR DEVICE

ELECTRICAL CONNECTION MEMBER, ELECTRICAL CONNECTION STRUCTURE, AND...

Additive Manufacturing of a Frontside or Backside Interconnect of a...

Systems and Processes for Increasing Semiconductor Device Reliability

TECHNIQUES FOR FORMING SEMICONDUCTOR DEVICE PACKAGES AND RELATED PA...

Interconnect Clip with Angled Contact Surface and Raised Bridge Tec...

CLIPS FOR SEMICONDUCTOR PACKAGES

Porous Cu on Cu Surface for Semiconductor Packages

ELECTRONIC MODULE, METHOD OF MANUFACTURING CONNECTOR, AND METHOD OF...

Multi-Clip Structure for Die Bonding

SEMICONDUCTOR DEVICE

Connection member with bulk body and electrically and thermally con...

METHODS AND STRUCTURES FOR MITIGATING ESD DURING WAFER BONDING