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Package structure
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Patent number 11,955,401
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Issue date Apr 9, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd
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Shih-Hui Wang
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H01 - BASIC ELECTRIC ELEMENTS
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Stacked semiconductor package
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Patent number 11,955,449
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Issue date Apr 9, 2024
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Samsung Electronics Co, Ltd.
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Jihwan Suh
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H01 - BASIC ELECTRIC ELEMENTS
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Multilayer substrate
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Patent number 11,901,325
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Issue date Feb 13, 2024
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Dexerials Corporation
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Seiichiro Shinohara
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and method
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Patent number 11,855,014
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Issue date Dec 26, 2023
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Chen-Hua Yu
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H01 - BASIC ELECTRIC ELEMENTS
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Techniques for processing devices
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Patent number 11,855,064
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Issue date Dec 26, 2023
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ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
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Cyprian Emeka Uzoh
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H01 - BASIC ELECTRIC ELEMENTS
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