Marks, inscriptions, etc. for information

Industry

CPC
H05K2201/09936

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09936Marks, inscriptions, etc. for information

Industries

Patents Grantslast 30 patents

Information Patent Grant
Traceability of subsequent layer structure manufacturing of main bo...
- Patent number 11,937,369
- Issue date Mar 19, 2024
- AT&S(China) Co. Ltd.
- Seok Kim Tay
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Radio frequency module
- Patent number 11,903,120
- Issue date Feb 13, 2024
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus including a display panel with multiple pads
- Patent number 11,894,294
- Issue date Feb 6, 2024
- Samsung Display Co., Ltd.
- Hanho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,696,405
- Issue date Jul 4, 2023
- Samsung Display Co., Ltd.
- Tae Hyun Ryu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display device and wiring substrate
- Patent number 11,668,984
- Issue date Jun 6, 2023
- Japan Display Inc.
- Hideaki Abe
- G02 - OPTICS
Information Patent Grant
Scratch-off design for tamper identification
- Patent number 11,593,576
- Issue date Feb 28, 2023
- Touchcode Holdings, LLC
- Wayne L. Nemeth
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing apparatus for display device and method of using the...
- Patent number 11,570,907
- Issue date Jan 31, 2023
- Samsung Display Co., Ltd.
- Jun Hee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integral features providing improved flexible printed circuit foldi...
- Patent number 11,533,807
- Issue date Dec 20, 2022
- Aptiv Technologies Limited
- David R. Peterson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuits marked with connections to vehicle circuits
- Patent number 11,437,742
- Issue date Sep 6, 2022
- Aptiv Technologies Limited
- David R. Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a multilayer structure with embedded funct...
- Patent number 11,357,111
- Issue date Jun 7, 2022
- TACTOTEK OY
- Janne Asikkala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a labeled printed circuit board
- Patent number 11,330,719
- Issue date May 10, 2022
- Notion Systems GmbH
- David Hahn
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Display device and wiring substrate
- Patent number 11,327,373
- Issue date May 10, 2022
- Japan Display Inc.
- Hideaki Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency device and multiplexer
- Patent number 11,264,968
- Issue date Mar 1, 2022
- Taiyo Yuden Co., Ltd.
- Hideyuki Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner and display device including the same
- Patent number 11,254,093
- Issue date Feb 22, 2022
- Samsung Display Co., Ltd.
- Cheol Ho Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
PCB board, manufacturing method of PCB board and electrical device
- Patent number 11,122,681
- Issue date Sep 14, 2021
- ZOPOISE TECHNOLOGY (ZHUZHOU) CO., LTD.
- Bruce Pi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flat harness
- Patent number 11,102,881
- Issue date Aug 24, 2021
- Yazaki Corporation
- Naoto Kogure
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing apparatus for display device and method of using the...
- Patent number 11,096,289
- Issue date Aug 17, 2021
- Samsung Display Co. Ltd.
- Jun Hee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Virtual silk screen for printed circuit boards
- Patent number 11,083,080
- Issue date Aug 3, 2021
- ARRIS Enterprises LLC
- Humberto Corral
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System and method for in-molded electronic unit using stretchable s...
- Patent number 11,039,531
- Issue date Jun 15, 2021
- Flex Ltd.
- Jesus Tan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic control unit
- Patent number 11,013,106
- Issue date May 18, 2021
- Aptiv Technologies Limited
- Moritz Schrey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sacrificial structure with dummy core and two sections of separate...
- Patent number 10,973,133
- Issue date Apr 6, 2021
- AT&S (China) Co. Ltd.
- Annie Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device and wiring substrate
- Patent number 10,921,657
- Issue date Feb 16, 2021
- Japan Display Inc.
- Hideaki Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical circuit board printer
- Patent number 10,917,975
- Issue date Feb 9, 2021
- Shenzhen Jingjiang Yunchuang Technology Co., Ltd.
- Xue-Qin Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Motherboard to be cut
- Patent number 10,869,396
- Issue date Dec 15, 2020
- BOE Technology Group Co., Ltd.
- Fuzheng Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive devices and methods of fabricating same
- Patent number 10,845,924
- Issue date Nov 24, 2020
- Sun Chemical Corporation
- Mathew Mathew
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic circuit module
- Patent number 10,834,821
- Issue date Nov 10, 2020
- Murata Manufacturing Co., Ltd.
- Mitsuaki Kidoguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Virtual silk screen for printed circuit boards
- Patent number 10,779,398
- Issue date Sep 15, 2020
- ARRIS Enterprises LLC
- Humberto Cruz Corral
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Solder mask void regions for printed circuit boards
- Patent number 10,757,801
- Issue date Aug 25, 2020
- Hewlett Packard Enterprise Development LP
- David W. Engler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module and method of manufacturing electronic module
- Patent number 10,660,227
- Issue date May 19, 2020
- Murata Manufacturing Co., Ltd.
- Issei Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer structure with embedded multilayer electronics
- Patent number 10,642,433
- Issue date May 5, 2020
- TACTOTEK OY
- Jarmo Sääski
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE, METHOD OF TRIMMING SAME, AND MULTI-LAYERED WIRING...
- Publication number 20240080990
- Publication date Mar 7, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Toshimi NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE
- Publication number 20230328889
- Publication date Oct 12, 2023
- SAMSUNG DISPLAY CO., LTD.
- Tae Hyun RYU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20230292432
- Publication date Sep 14, 2023
- Murata Manufacturing Co., Ltd.
- Ikuo DEGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAYER-TO-LAYER REGISTRATION MEASUREMENT MARK
- Publication number 20230262882
- Publication date Aug 17, 2023
- International Business Machines Corporation
- Hiroyuki Mori
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20230199945
- Publication date Jun 22, 2023
- LG ENERGY SOLUTION, LTD.
- Ga Young WOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE
- Publication number 20230189429
- Publication date Jun 15, 2023
- Murata Manufacturing Co., Ltd.
- Tadashi NOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRAL FEATURES PROVIDING IMPROVED FLEXIBLE PRINTED CIRCUIT FOLDI...
- Publication number 20230125061
- Publication date Apr 20, 2023
- Aptiv Technologies Limited
- David R. Peterson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT ASSEMBLY AND ELECTRICAL JUNCTION BOX
- Publication number 20230009555
- Publication date Jan 12, 2023
- SUMITOMO WIRING SYSTEMS, LTD.
- Shinya Hamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING APPARATUS FOR DISPLAY DEVICE AND METHOD OF USING THE...
- Publication number 20210345497
- Publication date Nov 4, 2021
- Samsung Display Co. Ltd.
- Jun Hee LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUITS MARKED WITH CONNECTIONS TO VEHICLE CIRCUITS
- Publication number 20210210878
- Publication date Jul 8, 2021
- Aptiv Technologies Limited
- David R. Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRAL FEATURES PROVIDING IMPROVED FLEXIBLE PRINTED CIRCUIT FOLDI...
- Publication number 20210212195
- Publication date Jul 8, 2021
- Aptiv Technologies Limited
- David R. Peterson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Traceability of Subsequent Layer Structure Manufacturing of Main Bo...
- Publication number 20210084752
- Publication date Mar 18, 2021
- AT&S (China) Co. Ltd.
- Seok Kim Tay
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VIRTUAL SILK SCREEN FOR PRINTED CIRCUIT BOARDS
- Publication number 20200413532
- Publication date Dec 31, 2020
- ARRIS Enterprises LLC
- Humberto CORRAL
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
FLAT HARNESS
- Publication number 20200404776
- Publication date Dec 24, 2020
- YAZAKI CORPORATION
- Naoto Kogure
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A LABELED PRINTED CIRCUIT BOARD
- Publication number 20200396845
- Publication date Dec 17, 2020
- Notion Systems GmbH
- David Hahn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB BOARD, MANUFACTURING METHOD OF PCB BOARD AND ELECTRICAL DEVICE
- Publication number 20200389971
- Publication date Dec 10, 2020
- ZOPOISE TECHNOLOGY (ZHUZHOU) CO., LTD.
- Bruce PI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RADIO FREQUENCY MODULE
- Publication number 20200375022
- Publication date Nov 26, 2020
- MURATA MANUFACTURING CO., LTD.
- Tadashi NOMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY DEVICE AND MULTIPLEXER
- Publication number 20200252044
- Publication date Aug 6, 2020
- Taiyo Yuden Co., Ltd.
- Hideyuki SEKINE
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
VIRTUAL SILK SCREEN FOR PRINTED CIRCUIT BOARDS
- Publication number 20200205281
- Publication date Jun 25, 2020
- Humberto Cruz Corral
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER MASK VOID REGIONS FOR PRINTED CIRCUIT BOARDS
- Publication number 20200084876
- Publication date Mar 12, 2020
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- David W. Engler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL CIRCUIT BOARD PRINTER
- Publication number 20190357359
- Publication date Nov 21, 2019
- FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD.
- XUE-QIN ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR CONTROLLING THE ASSEMBLY OF A PRINTED CIRCUIT BOARD BY R...
- Publication number 20190343014
- Publication date Nov 7, 2019
- CONTINENTAL AUTOMOTIVE FRANCE
- Pierre Perales
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTRONIC MODULE AND METHOD OF MANUFACTURING ELECTRONIC MODULE
- Publication number 20190289737
- Publication date Sep 19, 2019
- MURATA MANUFACTURING CO., LTD.
- Issei Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Motherboard To Be Cut, Method Of Manufacturing Substrate And Method...
- Publication number 20190159343
- Publication date May 23, 2019
- BOE TECHNOLOGY GROUP CO., LTD.
- Fuzheng Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE, BINDING TEST METHOD AND DISPLAY DEVICE
- Publication number 20190116662
- Publication date Apr 18, 2019
- BOE TECHNOLOGY GROUP CO., LTD.
- Kun LI
- G01 - MEASURING TESTING
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20190037693
- Publication date Jan 31, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Dae-Kyung KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITIVE DEVICES AND METHODS OF FABRICATING SAME
- Publication number 20180314359
- Publication date Nov 1, 2018
- SUN CHEMICAL CORPORATION
- Mathew MATHEW
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
GLASS SUBSTRATE AND MANUFACTURING METHOD OF GLASS SUBSTRATE
- Publication number 20180312432
- Publication date Nov 1, 2018
- Asahi Glass Company, Limited
- Kohei HORIUCHI
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
Sacrificial Structure With Dummy Core and Two Sections of Separate...
- Publication number 20180255649
- Publication date Sep 6, 2018
- AT&S (China) Co. Ltd.
- Annie Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductor-Structure Element Having an Internal Layer Substrate Lami...
- Publication number 20180242456
- Publication date Aug 23, 2018
- Schweizer Electronic AG
- Thomas GOTTWALD
- H01 - BASIC ELECTRIC ELEMENTS

Marks, inscriptions, etc. for information

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Traceability of subsequent layer structure manufacturing of main bo...

Radio frequency module

Display apparatus including a display panel with multiple pads

Display device

Display device and wiring substrate

Scratch-off design for tamper identification

Manufacturing apparatus for display device and method of using the...

Integral features providing improved flexible printed circuit foldi...

Flexible printed circuits marked with connections to vehicle circuits

Method for manufacturing a multilayer structure with embedded funct...

Method for producing a labeled printed circuit board

Display device and wiring substrate

High-frequency device and multiplexer

Liner and display device including the same

PCB board, manufacturing method of PCB board and electrical device

Flat harness

Manufacturing apparatus for display device and method of using the...

Virtual silk screen for printed circuit boards

System and method for in-molded electronic unit using stretchable s...

Electronic control unit

Sacrificial structure with dummy core and two sections of separate...

Display device and wiring substrate

Vertical circuit board printer

Motherboard to be cut

Capacitive devices and methods of fabricating same

Electronic circuit module

Virtual silk screen for printed circuit boards

Solder mask void regions for printed circuit boards

Electronic module and method of manufacturing electronic module

Multilayer structure with embedded multilayer electronics

Patents Applicationslast 30 patents

WIRING SUBSTRATE, METHOD OF TRIMMING SAME, AND MULTI-LAYERED WIRING...

DISPLAY DEVICE

ELECTRONIC COMPONENT

LAYER-TO-LAYER REGISTRATION MEASUREMENT MARK

METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD

MODULE

INTEGRAL FEATURES PROVIDING IMPROVED FLEXIBLE PRINTED CIRCUIT FOLDI...

CIRCUIT ASSEMBLY AND ELECTRICAL JUNCTION BOX

MANUFACTURING APPARATUS FOR DISPLAY DEVICE AND METHOD OF USING THE...

FLEXIBLE PRINTED CIRCUITS MARKED WITH CONNECTIONS TO VEHICLE CIRCUITS

INTEGRAL FEATURES PROVIDING IMPROVED FLEXIBLE PRINTED CIRCUIT FOLDI...

Traceability of Subsequent Layer Structure Manufacturing of Main Bo...

VIRTUAL SILK SCREEN FOR PRINTED CIRCUIT BOARDS

FLAT HARNESS

METHOD FOR PRODUCING A LABELED PRINTED CIRCUIT BOARD

PCB BOARD, MANUFACTURING METHOD OF PCB BOARD AND ELECTRICAL DEVICE

RADIO FREQUENCY MODULE

HIGH-FREQUENCY DEVICE AND MULTIPLEXER

VIRTUAL SILK SCREEN FOR PRINTED CIRCUIT BOARDS

SOLDER MASK VOID REGIONS FOR PRINTED CIRCUIT BOARDS

VERTICAL CIRCUIT BOARD PRINTER

METHOD FOR CONTROLLING THE ASSEMBLY OF A PRINTED CIRCUIT BOARD BY R...

ELECTRONIC MODULE AND METHOD OF MANUFACTURING ELECTRONIC MODULE

Motherboard To Be Cut, Method Of Manufacturing Substrate And Method...

CIRCUIT BOARD STRUCTURE, BINDING TEST METHOD AND DISPLAY DEVICE

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

CAPACITIVE DEVICES AND METHODS OF FABRICATING SAME

GLASS SUBSTRATE AND MANUFACTURING METHOD OF GLASS SUBSTRATE

Sacrificial Structure With Dummy Core and Two Sections of Separate...

Conductor-Structure Element Having an Internal Layer Substrate Lami...