Marks, test patterns, inspection means or identification means

Industry

CPC
H05K1/0266

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0266Marks, test patterns, inspection means or identification means

Industries

Patents Grantslast 30 patents

Information Patent Grant
Educational electronics systems and methods
- Patent number 12,137,520
- Issue date Nov 5, 2024
- HEATHKIT COMPANY, INC.
- Andrew S. Cromarty
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Rigid flexible printed circuit board and electronic device includin...
- Patent number 12,041,717
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Hyunmo Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate and method for manufacturing the same
- Patent number 11,997,798
- Issue date May 28, 2024
- Advanced Semiconductor Engineering, Inc.
- Wu Chou Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution plate
- Patent number 11,997,789
- Issue date May 28, 2024
- Dominik Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic printed circuit board
- Patent number 11,945,500
- Issue date Apr 2, 2024
- ThyssenKrupp Presta AG
- Robert Galehr
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 11,930,589
- Issue date Mar 12, 2024
- Ibiden Co., Ltd.
- Yoshihiko Hayashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Educational electronics systems and methods
- Patent number 11,864,311
- Issue date Jan 2, 2024
- HEATHKIT COMPANY, INC.
- Andrew S. Cromarty
- G01 - MEASURING TESTING
Information Patent Grant
Wiring circuit board and producing method thereof
- Patent number 11,825,598
- Issue date Nov 21, 2023
- Nitto Denko Corporation
- Ryosuke Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, semiconductor device and method of manufacturing cir...
- Patent number 11,792,920
- Issue date Oct 17, 2023
- Shinko Electric Industries Co., Ltd.
- Shinichiro Sekijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, electronic device, and electronic module
- Patent number 11,735,507
- Issue date Aug 22, 2023
- Kyocera Corporation
- Seiichirou Itou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED lighting systems and methods
- Patent number 11,690,172
- Issue date Jun 27, 2023
- Metrospec Technology, LLC
- Henry V. Holec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board assembly for edge-coupling to an integrated c...
- Patent number 11,678,433
- Issue date Jun 13, 2023
- D-Wave Systems Inc.
- Richard D. Neufeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and wiring substrate
- Patent number 11,668,984
- Issue date Jun 6, 2023
- Japan Display Inc.
- Hideaki Abe
- G02 - OPTICS
Information Patent Grant
Dynamic nameplate
- Patent number 11,611,262
- Issue date Mar 21, 2023
- AURAS TECHNOLOGY CO., LTD.
- Mu-Shu Fan
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Fiducials for laminate structures
- Patent number 11,596,058
- Issue date Feb 28, 2023
- Qorvo US, Inc.
- John August Orlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip on film package structure and method for reading a code-includ...
- Patent number 11,576,263
- Issue date Feb 7, 2023
- Novatek Microelectronics Corp.
- Te-Hsien Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 11,516,914
- Issue date Nov 29, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seong Ho Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Redistribution plate
- Patent number 11,510,318
- Issue date Nov 22, 2022
- Dominik Schmidt
- G01 - MEASURING TESTING
Information Patent Grant
Display device and method for manufacturing display device
- Patent number 11,487,170
- Issue date Nov 1, 2022
- Japan Display Inc.
- Yasushi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including bonded parts and method for detecting t...
- Patent number 11,470,716
- Issue date Oct 11, 2022
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Huan Meng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate
- Patent number 11,432,406
- Issue date Aug 30, 2022
- Advanced Semiconductor Engineering, Inc.
- Wu Chou Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Producing method of wiring circuit board and wiring circuit board a...
- Patent number 11,369,024
- Issue date Jun 21, 2022
- Nitto Denko Corporation
- Takahiro Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a multilayer structure with embedded funct...
- Patent number 11,357,111
- Issue date Jun 7, 2022
- TACTOTEK OY
- Janne Asikkala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring circuit board
- Patent number 11,337,302
- Issue date May 17, 2022
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a labeled printed circuit board
- Patent number 11,330,719
- Issue date May 10, 2022
- Notion Systems GmbH
- David Hahn
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Display device and wiring substrate
- Patent number 11,327,373
- Issue date May 10, 2022
- Japan Display Inc.
- Hideaki Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting machine
- Patent number 11,284,549
- Issue date Mar 22, 2022
- FUJI CORPORATION
- Jinya Imura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High-frequency device and multiplexer
- Patent number 11,264,968
- Issue date Mar 1, 2022
- Taiyo Yuden Co., Ltd.
- Hideyuki Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED lighting systems and method
- Patent number 11,266,014
- Issue date Mar 1, 2022
- Metrospec Technology, LLC
- Henry V. Holec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner and display device including the same
- Patent number 11,254,093
- Issue date Feb 22, 2022
- Samsung Display Co., Ltd.
- Cheol Ho Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
BGA Element Self-Alignment Structure and Alignment Method
- Publication number 20240334592
- Publication date Oct 3, 2024
- SHENZHEN SIPTORY TECHNOLOGY CO., LTD
- Dongdong Shao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY CONTROL DEVICE AND VEHICLE EMPLOYING DEVICE
- Publication number 20240324114
- Publication date Sep 26, 2024
- Futaijing Precision Electronics (Yantai) Co., Ltd.
- DIAN-RONG HAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD ASSEMBLY SHEET
- Publication number 20240260173
- Publication date Aug 1, 2024
- Nitto Denko Corporation
- Yusaku TAMAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY SHEET
- Publication number 20240244756
- Publication date Jul 18, 2024
- Nitto Denko Corporation
- Chihiro WATANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE
- Publication number 20240098894
- Publication date Mar 21, 2024
- SAMSUNG DISPLAY CO., LTD.
- Hyung Jin KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE, METHOD OF TRIMMING SAME, AND MULTI-LAYERED WIRING...
- Publication number 20240080990
- Publication date Mar 7, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Toshimi NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER STRUCTURE
- Publication number 20240049382
- Publication date Feb 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Chin-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A METHOD FOR MAKING A LIGHTING DEVICE
- Publication number 20240032199
- Publication date Jan 25, 2024
- SIGNFY HOLDING B.V.
- Aldegonda Lucia WEIJERS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD
- Publication number 20240014047
- Publication date Jan 11, 2024
- TOPPAN INC.
- Yuki UMEMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT MODULE
- Publication number 20230413418
- Publication date Dec 21, 2023
- MURATA MANUFACTURING CO., LTD.
- Toru Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP-CHIP BONDING STRUCTURE AND CIRCUIT BOARD THEREOF
- Publication number 20230380053
- Publication date Nov 23, 2023
- Chipbond Technology Corporation
- Chun-Te Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE AND MOBILE TERMINAL
- Publication number 20230380069
- Publication date Nov 23, 2023
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO.,LTD
- Cuilin ZHU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD AND FLEXIBL...
- Publication number 20230309222
- Publication date Sep 28, 2023
- Doosan Corporation
- Euidock RYU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IDENTIFICATION CIRCUIT AND IDENTIFICATION METHOD
- Publication number 20230269865
- Publication date Aug 24, 2023
- YOKOGAWA ELECTRIC CORPORATION
- Taisuke Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20230199945
- Publication date Jun 22, 2023
- LG ENERGY SOLUTION, LTD.
- Ga Young WOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOPOGRAPHY-BASED DEPOSITION HEIGHT ADJUSTMENT
- Publication number 20230189446
- Publication date Jun 15, 2023
- Mycronic AB
- Gustaf MARTENSSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE
- Publication number 20230143214
- Publication date May 11, 2023
- HYUNSEOP SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION METHOD FOR CHIP AND CIRCUIT BOARD, AND CIRCUIT BOARD ASS...
- Publication number 20230081618
- Publication date Mar 16, 2023
- INTELLIMICRO MEDICAL CO., LTD.
- Yu-chong Tai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDISTRIBUTION PLATE
- Publication number 20230054628
- Publication date Feb 23, 2023
- Translarity, Inc.
- Dominik Schmidt
- G01 - MEASURING TESTING
Information Patent Application
RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDIN...
- Publication number 20230007766
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- Hyunmo YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220418115
- Publication date Dec 29, 2022
- Advanced Semiconductor Engineering, Inc.
- Wu Chou HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED LIGHTING SYSTEMS AND METHODS
- Publication number 20220394847
- Publication date Dec 8, 2022
- METROSPEC TECHNOLOGY, LLC
- Henry V. Holec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING CIR...
- Publication number 20220369454
- Publication date Nov 17, 2022
- Shinko Electric Industries Co., Ltd.
- Shinichiro Sekijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND WIRING SUBSTRATE
- Publication number 20220229324
- Publication date Jul 21, 2022
- Japan Display Inc.
- Hideaki ABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INK JET PRINTING OF A SUBSTRATE
- Publication number 20220192035
- Publication date Jun 16, 2022
- Notion Systems GmbH
- David Hahn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD AND PRODUCING METHOD THEREOF
- Publication number 20220192010
- Publication date Jun 16, 2022
- Nitto Denko Corporation
- Ryosuke SASAOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING BONDED PARTS AND METHOD FOR DETECTING T...
- Publication number 20220132658
- Publication date Apr 28, 2022
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Huan MENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD
- Publication number 20220132715
- Publication date Apr 28, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- HIDEKI SUMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220095462
- Publication date Mar 24, 2022
- Advanced Semiconductor Engineering, Inc.
- Wu Chou HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220078903
- Publication date Mar 10, 2022
- IBIDEN CO., LTD.
- Yoshihiko HAYASHI
- G06 - COMPUTING CALCULATING COUNTING

Marks, test patterns, inspection means or identification means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Educational electronics systems and methods

Rigid flexible printed circuit board and electronic device includin...

Package substrate and method for manufacturing the same

Redistribution plate

Electronic printed circuit board

Printed wiring board and method for manufacturing the same

Educational electronics systems and methods

Wiring circuit board and producing method thereof

Circuit board, semiconductor device and method of manufacturing cir...

Wiring substrate, electronic device, and electronic module

LED lighting systems and methods

Printed circuit board assembly for edge-coupling to an integrated c...

Display device and wiring substrate

Dynamic nameplate

Fiducials for laminate structures

Chip on film package structure and method for reading a code-includ...

Printed circuit board

Redistribution plate

Display device and method for manufacturing display device

Electronic device including bonded parts and method for detecting t...

Package substrate

Producing method of wiring circuit board and wiring circuit board a...

Method for manufacturing a multilayer structure with embedded funct...

Wiring circuit board

Method for producing a labeled printed circuit board

Display device and wiring substrate

Component mounting machine

High-frequency device and multiplexer

LED lighting systems and method

Liner and display device including the same

Patents Applicationslast 30 patents

BGA Element Self-Alignment Structure and Alignment Method

DISPLAY CONTROL DEVICE AND VEHICLE EMPLOYING DEVICE

METHOD FOR PRODUCING WIRING CIRCUIT BOARD ASSEMBLY SHEET

ASSEMBLY SHEET

DISPLAY DEVICE

WIRING SUBSTRATE, METHOD OF TRIMMING SAME, AND MULTI-LAYERED WIRING...

CARRIER STRUCTURE

A METHOD FOR MAKING A LIGHTING DEVICE

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

ELECTRONIC CIRCUIT MODULE

FLIP-CHIP BONDING STRUCTURE AND CIRCUIT BOARD THEREOF

DISPLAY MODULE AND MOBILE TERMINAL

METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD AND FLEXIBL...

IDENTIFICATION CIRCUIT AND IDENTIFICATION METHOD

METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD

TOPOGRAPHY-BASED DEPOSITION HEIGHT ADJUSTMENT

DISPLAY DEVICE

CONNECTION METHOD FOR CHIP AND CIRCUIT BOARD, AND CIRCUIT BOARD ASS...

REDISTRIBUTION PLATE

RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDIN...

PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

LED LIGHTING SYSTEMS AND METHODS

CIRCUIT BOARD, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING CIR...

DISPLAY DEVICE AND WIRING SUBSTRATE

METHOD FOR INK JET PRINTING OF A SUBSTRATE

WIRING CIRCUIT BOARD AND PRODUCING METHOD THEREOF

ELECTRONIC DEVICE INCLUDING BONDED PARTS AND METHOD FOR DETECTING T...

COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD

PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME