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  • H05K2201/0206
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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/0206Materials
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    CIRCUIT CARRIER BOARD
    • Publication number 20240292517
    • Publication date Aug 29, 2024
    • ASIA PACIFIC MICROSYSTEMS, INC.
    • Jer-Wei HSIEH
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD STRUCTURE AND DISPLAY DEVICE
    • Publication number 20240284596
    • Publication date Aug 22, 2024
    • CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    • Liang GAO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20240032201
    • Publication date Jan 25, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Do Jae Yoo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT ASSEMBLY
    • Publication number 20240032210
    • Publication date Jan 25, 2024
    • AUTONETWORKS TECHNOLOGIES, LTD.
    • Taiji YANAGIDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PACKAGE SUBSTRATE AND COMMUNICATION DEVICE
    • Publication number 20230299018
    • Publication date Sep 21, 2023
    • Huawei Technologies Co., Ltd
    • Chen KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLEXIBLE SUBSTRATE AND DISPLAY DEVICE
    • Publication number 20210273183
    • Publication date Sep 2, 2021
    • CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    • Ke CAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ANGLED FIBERGLASS CLOTH WEAVES
    • Publication number 20180228023
    • Publication date Aug 9, 2018
    • International Business Machines Corporation
    • MICHAEL A. CHRISTO
    • D03 - WEAVING
  • Information Patent Application

    COMPOSITION FOR FORMING A CONDUCTIVE FILM, A CONDUCTIVE FILM, A MET...
    • Publication number 20160081189
    • Publication date Mar 17, 2016
    • JSR Corporation
    • Sugirou SHIMODA
    • C03 - GLASS MINERAL OR SLAG WOOL
  • Information Patent Application

    SOLDER PASTE AND ELECTRONIC PART
    • Publication number 20160066421
    • Publication date Mar 3, 2016
    • FUJITSU LIMITED
    • Kazuhiro Kitamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COMPOSITION FOR FORMING SILVER ION DIFFUSION-SUPPRESSING LAYER, FIL...
    • Publication number 20150014030
    • Publication date Jan 15, 2015
    • FUJIFILM CORPORATION
    • Yasuhiro MITAMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20150014027
    • Publication date Jan 15, 2015
    • Shinko Electric Industries Co., Ltd.
    • Kentaro Kaneko
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR