Means against parasitic impedance Means against eddy currents

Industry

CPC
H05K2201/0792

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0792Means against parasitic impedance Means against eddy currents

Industries

Patents Grantslast 30 patents

Information Patent Grant
Sensor interposer employing castellated through-vias
- Patent number 11,950,363
- Issue date Apr 2, 2024
- DexCom, Inc.
- Sean Frick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive component
- Patent number 11,800,635
- Issue date Oct 24, 2023
- Murata Manufacturing Co., Ltd.
- Jyou Kikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,437,811
- Issue date Sep 6, 2022
- BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
- Chaoxi Chen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Wideband termination for high power applications
- Patent number 11,406,008
- Issue date Aug 2, 2022
- TTM Technologies Inc.
- Omar Eldaiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-overlapping power/ground planes for localized power distributio...
- Patent number 11,330,699
- Issue date May 10, 2022
- San Diego State University Research Foundation
- Arif Ege Engin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor interposer employing castellated through-vias
- Patent number 11,224,125
- Issue date Jan 11, 2022
- DexCom, Inc.
- Sean Frick
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Electronic apparatus equipped with flexible boards
- Patent number 11,147,155
- Issue date Oct 12, 2021
- Canon Kabushiki Kaisha
- Hideaki Momose
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Low parasitic inductance structure for power switched circuits
- Patent number 11,019,718
- Issue date May 25, 2021
- Efficient Power Conversion Corporation
- John S. Glaser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wideband termination for high power applications
- Patent number 10,772,193
- Issue date Sep 8, 2020
- TTM Technologies Inc.
- Omar Eldaiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor interposer employing castellated through-vias
- Patent number 10,660,201
- Issue date May 19, 2020
- DexCom, Inc.
- Sean Frick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulated metal printed circuit board
- Patent number 10,638,604
- Issue date Apr 28, 2020
- BorgWarner, Inc.
- Jeffrey Carter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a surface mount technology (SMT) pad struc...
- Patent number 10,617,003
- Issue date Apr 7, 2020
- Dell Products, L.P.
- Vijendera Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor and printed circuit board
- Patent number 10,475,569
- Issue date Nov 12, 2019
- Taiyo Yuden Co., Ltd.
- Masuo Yatabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter
- Patent number 10,244,617
- Issue date Mar 26, 2019
- Omron Corporation
- Shingo Nagaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for controlling at least one diode
- Patent number 9,819,146
- Issue date Nov 14, 2017
- Brightloop
- Florent Liffran
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Multilayer wiring board with enclosed Ur-variant dual conductive layer
- Patent number 9,622,344
- Issue date Apr 11, 2017
- Kabushiki Kaisha Nihon Micronics
- Tatsuo Inoue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 9,538,634
- Issue date Jan 3, 2017
- Canon Kabushiki Kaisha
- Hiroyuki Yamaguchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method of improving isolation between circuits on a printed circuit...
- Patent number 9,462,675
- Issue date Oct 4, 2016
- Leviton Manufacturing Co., Inc.
- Adam W. Gibson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Guarded printed circuit board islands
- Patent number 9,326,369
- Issue date Apr 26, 2016
- Keithley Instruments, Inc.
- James A. Niemann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 9,155,196
- Issue date Oct 6, 2015
- Ibiden Co., Ltd.
- Haruhiko Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing circuit board having holes to increase res...
- Patent number 9,119,334
- Issue date Aug 25, 2015
- Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Bhyrav M. Mutnury
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate module
- Patent number 9,119,318
- Issue date Aug 25, 2015
- Murata Manufacturing Co., Ltd.
- Takeshi Kogure
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuitry arrangement for reducing a tendency towards oscillations
- Patent number 8,964,400
- Issue date Feb 24, 2015
- SMA Solar Technology AG
- Regine Mallwitz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor modules and methods of formation thereof
- Patent number 8,766,430
- Issue date Jul 1, 2014
- Infineon Technologies AG
- Ralf Otremba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-contact power receiving apparatus
- Patent number 8,723,374
- Issue date May 13, 2014
- Murata Manufacturing Co., Ltd.
- Takeshi Kurihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board having holes to increase resonant frequency of via stubs
- Patent number 8,542,494
- Issue date Sep 24, 2013
- International Business Machines Corporation
- Bhyrav M. Mutnury
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultra-low current printed circuit board
- Patent number 8,507,802
- Issue date Aug 13, 2013
- Keithley Instruments, Inc.
- William Knauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display with reduced parasitic effects
- Patent number 8,384,634
- Issue date Feb 26, 2013
- Apple Inc.
- Yongman Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate device with a transmission line connected to a connector...
- Patent number 8,258,888
- Issue date Sep 4, 2012
- NEC Corporation
- Hidetaka Ootsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Land grid feedthrough low ESL technology
- Patent number 8,238,116
- Issue date Aug 7, 2012
- AVX Corporation
- Carl L. Eggerding
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS
- Publication number 20240196531
- Publication date Jun 13, 2024
- Dexcom, Inc.
- Sean Frick
- G01 - MEASURING TESTING
Information Patent Application
System and Method for Reducing Power Losses for Magnetics Integrate...
- Publication number 20230343506
- Publication date Oct 26, 2023
- Rockwell Automation Technologies, Inc.
- Gennadi Sizov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE COMPONENT
- Publication number 20210329773
- Publication date Oct 21, 2021
- Murata Manufacturing Co., Ltd.
- Jyou KIKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-OVERLAPPING POWER/GROUND PLANES FOR LOCALIZED POWER DISTRIBUTIO...
- Publication number 20210153341
- Publication date May 20, 2021
- San Diego State University Research Foundation
- Arif Ege ENGIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIDEBAND TERMINATION FOR HIGH POWER APPLICATIONS
- Publication number 20210127482
- Publication date Apr 29, 2021
- TTM TECHNOLOGIES, INC.
- Omar Eldaiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW PARASITIC INDUCTANCE STRUCTURE FOR POWER SWITCHED CIRCUITS
- Publication number 20200367354
- Publication date Nov 19, 2020
- Efficient Power Conversion Corporation
- John S. Glaser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Reducing Power Losses for Magnetics Integrate...
- Publication number 20200350111
- Publication date Nov 5, 2020
- Rockwell Automation Technologies, Inc.
- Gennadi Sizov
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ELECTRONIC APPARATUS EQUIPPED WITH FLEXIBLE BOARDS
- Publication number 20200344871
- Publication date Oct 29, 2020
- Canon Kabushiki Kaisha
- Hideaki Momose
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20200313427
- Publication date Oct 1, 2020
- Beijing Xiaomi Mobile Software Co., Ltd.
- Chaoxi CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE MOUNT TECHNOLOGY (SMT) PAD DESIGN FOR NEXT GENERATION SPEEDS
- Publication number 20190289714
- Publication date Sep 19, 2019
- DELL PRODUCTS, L.P.
- VIJENDERA KUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH SIGNAL TRANSMISSION PATHS RELATING TO PARAS...
- Publication number 20190080999
- Publication date Mar 14, 2019
- SK HYNIX INC.
- Juil EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARD
- Publication number 20150173174
- Publication date Jun 18, 2015
- SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
- SU WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GUARDED PRINTED CIRCUIT BOARD ISLANDS
- Publication number 20140376201
- Publication date Dec 25, 2014
- James A. Niemann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20140353022
- Publication date Dec 4, 2014
- IBIDEN CO., LTD.
- Haruhiko MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR OPTIMIZING ELECTRICALLY INOPERATIVE ZONES...
- Publication number 20140262499
- Publication date Sep 18, 2014
- BOULDER WIND POWER, INC.
- James S. Smith
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MULTILAYER SUBSTRATE MODULE
- Publication number 20140202750
- Publication date Jul 24, 2014
- Murata Manufacturing Co., Ltd.
- Takeshi KOGURE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUITRY ARRANGEMENT FOR REDUCING A TENDENCY TOWARDS OSCILLATIONS
- Publication number 20140192487
- Publication date Jul 10, 2014
- Regine Mallwitz
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PARASITIC INDUCTANCE REDUCTION FOR MULTILAYERED BOARD LAYOUT DESIGN...
- Publication number 20140183550
- Publication date Jul 3, 2014
- Efficient Power Conversion Corporation
- David Reusch
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20140049929
- Publication date Feb 20, 2014
- Canon Kabushiki Kaisha
- Hiroyuki Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Modules and Methods of Formation Thereof
- Publication number 20130334677
- Publication date Dec 19, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board having holes to increase resonant frequency of via stubs
- Publication number 20130248236
- Publication date Sep 26, 2013
- International Business Machines Corporation
- Bhyrav M. Mutnury
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20130168143
- Publication date Jul 4, 2013
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Wook Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20120188729
- Publication date Jul 26, 2012
- NEC Corporation
- Toshihiko Nakano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-CONTACT POWER RECEIVING APPARATUS
- Publication number 20110278951
- Publication date Nov 17, 2011
- Murata Manufacturing Co., Ltd.
- Takeshi KURIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board having holes to increase resonant frequency of via stubs
- Publication number 20110267783
- Publication date Nov 3, 2011
- Bhyrav M. Mutnury
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF IMPROVING ISOLATION BETWEEN CIRCUITS ON A PRINTED CIRCUIT...
- Publication number 20110099803
- Publication date May 5, 2011
- Leviton Manufacturing Co., Inc.
- Adam W. Gibson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF IMPROVING ISOLATION BETWEEN CIRCUITS ON A PRINTED CIRCUIT...
- Publication number 20100291795
- Publication date Nov 18, 2010
- Leviton Manufacturing Co., Inc.
- Adam W. Gibson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING STRUCTURE AND OPTICAL DISK APPARATUS
- Publication number 20100290331
- Publication date Nov 18, 2010
- Yasuhiro KAIZAKI
- G11 - INFORMATION STORAGE
Information Patent Application
MIRROR IMAGE SHIELDING STRUCTURE
- Publication number 20100226112
- Publication date Sep 9, 2010
- Industrial Technology Research Institute
- Uei-Ming Jow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR PROVIDING CONTROLLED IMPEDANCE IN AN ELECTRICAL CONTACT
- Publication number 20100136840
- Publication date Jun 3, 2010
- David A. Johnson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Means against parasitic impedance Means against eddy currents

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Sensor interposer employing castellated through-vias

Integrated passive component

Electronic device

Wideband termination for high power applications

Non-overlapping power/ground planes for localized power distributio...

Sensor interposer employing castellated through-vias

Electronic apparatus equipped with flexible boards

Low parasitic inductance structure for power switched circuits

Wideband termination for high power applications

Sensor interposer employing castellated through-vias

Insulated metal printed circuit board

Method for manufacturing a surface mount technology (SMT) pad struc...

Inductor and printed circuit board

Power converter

Device for controlling at least one diode

Multilayer wiring board with enclosed Ur-variant dual conductive layer

Printed circuit board

Method of improving isolation between circuits on a printed circuit...

Guarded printed circuit board islands

Wiring board

Method for manufacturing circuit board having holes to increase res...

Multilayer substrate module

Circuitry arrangement for reducing a tendency towards oscillations

Semiconductor modules and methods of formation thereof

Non-contact power receiving apparatus

Circuit board having holes to increase resonant frequency of via stubs

Ultra-low current printed circuit board

Display with reduced parasitic effects

Substrate device with a transmission line connected to a connector...

Land grid feedthrough low ESL technology

Patents Applicationslast 30 patents

SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS

System and Method for Reducing Power Losses for Magnetics Integrate...

INTEGRATED PASSIVE COMPONENT

NON-OVERLAPPING POWER/GROUND PLANES FOR LOCALIZED POWER DISTRIBUTIO...

WIDEBAND TERMINATION FOR HIGH POWER APPLICATIONS

LOW PARASITIC INDUCTANCE STRUCTURE FOR POWER SWITCHED CIRCUITS

System and Method for Reducing Power Losses for Magnetics Integrate...

ELECTRONIC APPARATUS EQUIPPED WITH FLEXIBLE BOARDS

ELECTRONIC DEVICE

SURFACE MOUNT TECHNOLOGY (SMT) PAD DESIGN FOR NEXT GENERATION SPEEDS

PACKAGE SUBSTRATES WITH SIGNAL TRANSMISSION PATHS RELATING TO PARAS...

MULTI-LAYER PRINTED CIRCUIT BOARD

GUARDED PRINTED CIRCUIT BOARD ISLANDS

WIRING BOARD

METHODS AND APPARATUS FOR OPTIMIZING ELECTRICALLY INOPERATIVE ZONES...

MULTILAYER SUBSTRATE MODULE

CIRCUITRY ARRANGEMENT FOR REDUCING A TENDENCY TOWARDS OSCILLATIONS

PARASITIC INDUCTANCE REDUCTION FOR MULTILAYERED BOARD LAYOUT DESIGN...

PRINTED CIRCUIT BOARD

Semiconductor Modules and Methods of Formation Thereof

Circuit board having holes to increase resonant frequency of via stubs

CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

NON-CONTACT POWER RECEIVING APPARATUS

Circuit board having holes to increase resonant frequency of via stubs

METHOD OF IMPROVING ISOLATION BETWEEN CIRCUITS ON A PRINTED CIRCUIT...

METHOD OF IMPROVING ISOLATION BETWEEN CIRCUITS ON A PRINTED CIRCUIT...

WIRING STRUCTURE AND OPTICAL DISK APPARATUS

MIRROR IMAGE SHIELDING STRUCTURE

APPARATUS FOR PROVIDING CONTROLLED IMPEDANCE IN AN ELECTRICAL CONTACT