Means for bonding not being attached to, or not being formed on, the surface to be connected

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/71Means for bonding not being attached to, or not being formed on, the surface to be connected

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,735,561
- Issue date Aug 22, 2023
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Small pitch integrated knife edge temporary bonding microstructures
- Patent number 11,555,830
- Issue date Jan 17, 2023
- HRL Laboratories, LLC
- Erik S. Daniel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,367,704
- Issue date Jun 21, 2022
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge cut debond using a temporary filler material with no adhesive...
- Patent number 11,094,684
- Issue date Aug 17, 2021
- Micron Technology, Inc.
- Chandra S. Tiwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,707,185
- Issue date Jul 7, 2020
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,497,666
- Issue date Dec 3, 2019
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for direct bonding of substrates including thinning of the e...
- Patent number 10,497,609
- Issue date Dec 3, 2019
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Frank Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge cut debond using a temporary filler material with no adhesive...
- Patent number 10,403,618
- Issue date Sep 3, 2019
- Micron Technology, Inc.
- Chandra S. Tiwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor dev...
- Patent number 10,186,496
- Issue date Jan 22, 2019
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 9,653,384
- Issue date May 16, 2017
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-embedded packages with backside die connection
- Patent number 9,437,516
- Issue date Sep 6, 2016
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 9,324,677
- Issue date Apr 26, 2016
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer, an electronic component, and a component carri...
- Patent number 7,397,111
- Issue date Jul 8, 2008
- Infineon Technologies, AG
- Simon Jerebic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an interconnection element
- Patent number 7,325,302
- Issue date Feb 5, 2008
- FormFactor, Inc.
- Gaetan L. Mathieu
- G01 - MEASURING TESTING
Information Patent Grant
Interconnect for microelectronic structures with enhanced spring ch...
- Patent number 7,048,548
- Issue date May 23, 2006
- FormFactor, Inc.
- Gaetan L. Mathieu
- G01 - MEASURING TESTING
Information Patent Grant
Interconnect for microelectronic structures with enhanced spring ch...
- Patent number 6,827,584
- Issue date Dec 7, 2004
- FormFactor, Inc.
- Gaetan L. Mathieu
- G01 - MEASURING TESTING
Information Patent Grant
Chip to multilevel circuit board bonding
- Patent number 4,907,128
- Issue date Mar 6, 1990
- Grumman Aerospace Corporation
- Allen L. Solomon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3375145
- Patent number 3,375,145
- Issue date Mar 26, 1968
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOCALIZED DAMPING ELEMENTS FOR MITIGATING INTERCONNECT VIBRATION DA...
- Publication number 20240355759
- Publication date Oct 24, 2024
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230343744
- Publication date Oct 26, 2023
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230115289
- Publication date Apr 13, 2023
- Mitsubishi Electric Corporation
- Koji YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220278072
- Publication date Sep 1, 2022
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20220059406
- Publication date Feb 24, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMALL PITCH INTEGRATED KNIFE EDGE TEMPORARY BONDING MICROSTRUCTURES
- Publication number 20210063439
- Publication date Mar 4, 2021
- HRL LABORATORIES, LLC
- Erik S. DANIEL
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200321308
- Publication date Oct 8, 2020
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200066675
- Publication date Feb 27, 2020
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge Cut Debond Using a Temporary Filler Material With No Adhesive...
- Publication number 20190341378
- Publication date Nov 7, 2019
- Micron Technology, Inc.
- Chandra S. Tiwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190157239
- Publication date May 23, 2019
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge Cut Debond Using a Temporary Filler Material With No Adhesive...
- Publication number 20190088637
- Publication date Mar 21, 2019
- Micron Technology, Inc.
- Chandra S. Tiwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-Embedded Packages with Backside Die Connection
- Publication number 20150194362
- Publication date Jul 9, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140021627
- Publication date Jan 23, 2014
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME ASSEMBLY FOR A SEMICONDUCTOR PACKAGE
- Publication number 20110042793
- Publication date Feb 24, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Kai Man WONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect For Microelectronic Structures With Enhanced Spring Ch...
- Publication number 20080120833
- Publication date May 29, 2008
- FormFactor, Inc.
- Gaetan L. Mathieu
- G01 - MEASURING TESTING
Information Patent Application
Interconnect for microelectronic structures with enhanced spring ch...
- Publication number 20060211278
- Publication date Sep 21, 2006
- FormFactor, Inc.
- Gaetan L. Mathieu
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor wafer, an electronic component, and a component carri...
- Publication number 20060131712
- Publication date Jun 22, 2006
- Simon Jerebic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect for microelectronic structures with enhanced spring ch...
- Publication number 20040102064
- Publication date May 27, 2004
- FormFactor, Inc.
- Gaetan L. Mathieu
- G01 - MEASURING TESTING
Information Patent Application
INTERCONNECT FOR MICROELECTRONIC STRUCTURES WITH ENHANCED SPRING CH...
- Publication number 20020164893
- Publication date Nov 7, 2002
- GAETAN L. MATHIEU
- G01 - MEASURING TESTING

Means for bonding not being attached to, or not being formed on, the surface to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing semiconductor device

Small pitch integrated knife edge temporary bonding microstructures

Semiconductor device and method for manufacturing semiconductor device

Edge cut debond using a temporary filler material with no adhesive...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Method for direct bonding of substrates including thinning of the e...

Edge cut debond using a temporary filler material with no adhesive...

Semiconductor device and method for manufacturing semiconductor dev...

Semiconductor device and method for manufacturing semiconductor device

Chip-embedded packages with backside die connection

Semiconductor device and method for manufacturing semiconductor device

Semiconductor wafer, an electronic component, and a component carri...

Method of forming an interconnection element

Interconnect for microelectronic structures with enhanced spring ch...

Interconnect for microelectronic structures with enhanced spring ch...

Chip to multilevel circuit board bonding

3375145

Patents Applicationslast 30 patents

LOCALIZED DAMPING ELEMENTS FOR MITIGATING INTERCONNECT VIBRATION DA...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

SMALL PITCH INTEGRATED KNIFE EDGE TEMPORARY BONDING MICROSTRUCTURES

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Edge Cut Debond Using a Temporary Filler Material With No Adhesive...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Edge Cut Debond Using a Temporary Filler Material With No Adhesive...

Chip-Embedded Packages with Backside Die Connection

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

LEAD FRAME ASSEMBLY FOR A SEMICONDUCTOR PACKAGE

Interconnect For Microelectronic Structures With Enhanced Spring Ch...

Interconnect for microelectronic structures with enhanced spring ch...

Semiconductor wafer, an electronic component, and a component carri...

Interconnect for microelectronic structures with enhanced spring ch...

INTERCONNECT FOR MICROELECTRONIC STRUCTURES WITH ENHANCED SPRING CH...