TREA

Means for supporting or holding work during breaking

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  • B28D5/0052
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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B28Stoneworking B28DWORKING STONE OR STONE-LIKE MATERIALS B28D5/00Fine working of gems, jewels, crystals

Current Industry

B28D5/0052Means for supporting or holding work during breaking
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    RAPID WAFERING OF WIDE BANDGAP SUBSTRATES
    • Publication number 20250229457
    • Publication date Jul 17, 2025
    • John Farah
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    MANUFACTURING METHOD OF WAFER
    • Publication number 20250187230
    • Publication date Jun 12, 2025
    • Disco Corporation
    • Asahi NOMOTO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BETA GALLIUM OXIDE SUBSTRATE MANUFACTURING METHOD
    • Publication number 20250033245
    • Publication date Jan 30, 2025
    • Disco Corporation
    • Yuya SETO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PRODUCTION METHOD
    • Publication number 20240316824
    • Publication date Sep 26, 2024
    • DENSO CORPORATION
    • Koichiro Yasuda
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    APPARATUS AND METHOD FOR SILICON CARBIDE INGOT PEELING
    • Publication number 20240149494
    • Publication date May 9, 2024
    • Industrial Technology Research Institute
    • WENG-JUNG LU
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PEELING APPARATUS
    • Publication number 20230373129
    • Publication date Nov 23, 2023
    • Disco Corporation
    • Koyo HONOKI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR CUTTING SUBSTRATE ELEMENTS
    • Publication number 20230302683
    • Publication date Sep 28, 2023
    • STMicroelectronics (Grenoble 2) SAS
    • Melodie CHAPERON
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    DIVIDING APPARATUS
    • Publication number 20230278260
    • Publication date Sep 7, 2023
    • Disco Corporation
    • Shinya ARUGA
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    METHOD OF MANUFACTURING SUBSTRATE
    • Publication number 20230137722
    • Publication date May 4, 2023
    • Disco Corporation
    • Hayato IGA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DIVIDING METHOD OF WORKPIECE
    • Publication number 20230102150
    • Publication date Mar 30, 2023
    • Disco Corporation
    • Yohei MASUDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING GLASS PLATE AND APPARATUS FOR MANUFACTURIN...
    • Publication number 20230084567
    • Publication date Mar 16, 2023
    • Nippon Electric Glass Co., Ltd.
    • Taisei MATSUBUSHI
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    METHOD OF MANUFACTURING SEMICONDUCTOR WAFERS
    • Publication number 20230073379
    • Publication date Mar 9, 2023
    • DENSO CORPORATION
    • Sodai NOMURA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PEELING APPARATUS
    • Publication number 20220410431
    • Publication date Dec 29, 2022
    • Disco Corporation
    • Koyo HONOKI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PEELING METHOD AND PEELING APPARATUS
    • Publication number 20220379520
    • Publication date Dec 1, 2022
    • Disco Corporation
    • Ryohei YAMAMOTO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR CHIP MANUFACTURING DEVICE AND METHOD OF MANUFACTURING...
    • Publication number 20210391684
    • Publication date Dec 16, 2021
    • Mitsubishi Electric Corporation
    • Tetsuya UETSUJI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER FORMING METHOD
    • Publication number 20210316476
    • Publication date Oct 14, 2021
    • Disco Corporation
    • Keiji Nomaru
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PRODUCING METHOD AND WAFER PRODUCING APPARATUS
    • Publication number 20210221026
    • Publication date Jul 22, 2021
    • Disco Corporation
    • Keiji Nomaru
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DIVIDING DEVICE FOR WAFER
    • Publication number 20210129380
    • Publication date May 6, 2021
    • NAKAMURA-TOME PRECISION INDUSTRY CO., LTD.
    • Tsuyoshi NAYA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DIE MATRIX EXPANDER WITH PARTITIONED SUBRING
    • Publication number 20200027772
    • Publication date Jan 23, 2020
    • TEXAS INSTRUMENTS INCORPORATED
    • MATTHEW JOHN SHERBIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20190160597
    • Publication date May 30, 2019
    • Disco Corporation
    • Jingshi CHI
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    CUTTING APPARATUS AND GROOVE DETECTING METHOD
    • Publication number 20190067108
    • Publication date Feb 28, 2019
    • Disco Corporation
    • Makoto Tanaka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DEVICE AND METHOD FOR CLEAVING A SUBSTRATE
    • Publication number 20190054658
    • Publication date Feb 21, 2019
    • LatticeGear, LLC
    • Gal Moyal
    • B26 - HAND CUTTING TOOLS CUTTING SEVERING
  • Information Patent Application

    BRITTLE PLATE PROCESSING METHOD AND BRITTLE PLATE PROCESSING APPARATUS
    • Publication number 20160280578
    • Publication date Sep 29, 2016
    • Asahi Glass Company, Limited
    • Takashi YAMAMOTO
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    WAFER DIVIDER AND WAFER DIVISION METHOD
    • Publication number 20160247723
    • Publication date Aug 25, 2016
    • Disco Corporation
    • Naotoshi Kirihara
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    Device and Method for Cleaving a Crystalline Sample
    • Publication number 20160089813
    • Publication date Mar 31, 2016
    • IB LABS, INC.
    • Dimitry BOGUSLAVSKY
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    MATERIAL SHEET HANDLING SYSTEM AND PROCESSING METHODS
    • Publication number 20130302971
    • Publication date Nov 14, 2013
    • Corning Incorporated
    • Chester Hann Huei Chang
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    DICING PROCESS AND DICING APPARATUS
    • Publication number 20130029476
    • Publication date Jan 31, 2013
    • LEXTAR ELECTRONICS CORP.
    • Chien-Sen WENG
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    METHOD FOR CUTTING GLASS SHEET
    • Publication number 20120318838
    • Publication date Dec 20, 2012
    • NIPPON ELECTRIC GLASS CO., LTD.
    • Takayoshi Saitoh
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    SUBSTRATE CUTTING DEVICE AND METHOD
    • Publication number 20120048906
    • Publication date Mar 1, 2012
    • Olivier Rayssac
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIV...
    • Publication number 20110318879
    • Publication date Dec 29, 2011
    • Keiichi HATAKEYAMA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR