Means for supporting or holding work during breaking

Industry

CPC
B28D5/0052

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B28Stoneworking B28DWORKING STONE OR STONE-LIKE MATERIALS B28D5/00Fine working of gems, jewels, crystals

Current Industry

B28D5/0052Means for supporting or holding work during breaking

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing substrate
- Patent number 12,214,526
- Issue date Feb 4, 2025
- Disco Corporation
- Hayato Iga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing glass plate and apparatus for manufacturin...
- Patent number 12,139,432
- Issue date Nov 12, 2024
- Nippon Electric Glass Co., Ltd.
- Taisei Matsubushi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wafer producing method and wafer producing apparatus
- Patent number 12,097,642
- Issue date Sep 24, 2024
- Disco Corporation
- Keiji Nomaru
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dividing device for wafer
- Patent number 12,036,700
- Issue date Jul 16, 2024
- NAKAMURA-TOME PRECISION INDUSTRY CO., LTD.
- Tsuyoshi Naya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer forming method
- Patent number 11,969,916
- Issue date Apr 30, 2024
- Disco Corporation
- Keiji Nomaru
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip manufacturing device and method of manufacturing...
- Patent number 11,973,309
- Issue date Apr 30, 2024
- Mitsubishi Electric Corporation
- Tetsuya Uetsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing ingot block, method for manufacturing semi...
- Patent number 11,587,792
- Issue date Feb 21, 2023
- Sumco Corporation
- Yasuhiro Saito
- C30 - CRYSTAL GROWTH
Information Patent Grant
Wafer processing method
- Patent number 11,420,294
- Issue date Aug 23, 2022
- Disco Corporation
- Jingshi Chi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die matrix expander with partitioned subring
- Patent number 11,171,031
- Issue date Nov 9, 2021
- Texas Instruments Incorporated
- Matthew John Sherbin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for cleaving a liquid sample
- Patent number 11,119,012
- Issue date Sep 14, 2021
- IB Labs, Inc.
- Dimitry Boguslavsky
- G01 - MEASURING TESTING
Information Patent Grant
Device and method for cleaving a substrate
- Patent number 10,773,420
- Issue date Sep 15, 2020
- LATTICEGEAR, LLC
- Gal Moyal
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Photovoltaic structure cleaving system
- Patent number 10,672,938
- Issue date Jun 2, 2020
- SolarCity Corporation
- Pablo Gonzalez
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Cutting apparatus and groove detecting method
- Patent number 10,665,508
- Issue date May 26, 2020
- Disco Corporation
- Makoto Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Frame mounting after foil expansion
- Patent number 10,600,670
- Issue date Mar 24, 2020
- Infineon Technologies AG
- Thomas Fischer
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wafer processing method
- Patent number 10,562,207
- Issue date Feb 18, 2020
- Disco Corporation
- Kazuma Sekiya
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for dividing substrate along division lines using abrasive m...
- Patent number 10,515,841
- Issue date Dec 24, 2019
- Disco Corporation
- Byeongdeck Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for cleaving a crystalline sample
- Patent number 10,213,940
- Issue date Feb 26, 2019
- IB Labs, Inc.
- Dimitry Boguslavsky
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Brittle plate processing method and brittle plate processing apparatus
- Patent number 9,957,187
- Issue date May 1, 2018
- Ashi Glass Company, Limited
- Takashi Yamamoto
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Photovoltaic structure cleaving system
- Patent number 9,685,579
- Issue date Jun 20, 2017
- SolarCity Corporation
- Pablo Gonzalez
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wafer divider and wafer division method
- Patent number 9,472,459
- Issue date Oct 18, 2016
- Disco Corporation
- Naotoshi Kirihara
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Substrate cutting device and method
- Patent number 8,991,673
- Issue date Mar 31, 2015
- Soitec
- Olivier Rayssac
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Laser processing method
- Patent number 8,969,752
- Issue date Mar 3, 2015
- Hamamatsu Photonics K.K.
- Kenshi Fukumitsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for cutting glass sheet
- Patent number 8,910,845
- Issue date Dec 16, 2014
- Nippon Electric Glass Co., Ltd.
- Takayoshi Saitoh
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Material sheet handling system and processing methods
- Patent number 8,528,886
- Issue date Sep 10, 2013
- Corning Incorporated
- Chester Hann Huei Chang
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Flat display panel cutting apparatus
- Patent number 8,496,150
- Issue date Jul 30, 2013
- Samsung Display Co., Ltd.
- Jae-Pil Lee
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method and apparatus for ultra thin wafer backside processing
- Patent number 8,361,903
- Issue date Jan 29, 2013
- Alpha and Omega Semiconductor Incorporated
- Tao Feng
- B24 - GRINDING POLISHING
Information Patent Grant
System for breaking a semiconductor wafer or other workpiece along...
- Patent number 8,220,685
- Issue date Jul 17, 2012
- Micro Processing Technology, Inc.
- Paul C. Lindsey, Jr.
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Substrate cutting device and method
- Patent number 8,083,115
- Issue date Dec 27, 2011
- S.O.I. Tec Silicon on Insulator Technologies
- Olivier Rayssac
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for producing semiconductor chip with adhesive film, adhesiv...
- Patent number 8,071,465
- Issue date Dec 6, 2011
- Hitachi Chemical Company, Ltd.
- Keiichi Hatakeyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing method
- Patent number 7,939,430
- Issue date May 10, 2011
- Hamamatsu Photonics K.K.
- Takeshi Sakamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BETA GALLIUM OXIDE SUBSTRATE MANUFACTURING METHOD
- Publication number 20250033245
- Publication date Jan 30, 2025
- Disco Corporation
- Yuya SETO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PRODUCTION METHOD
- Publication number 20240316824
- Publication date Sep 26, 2024
- DENSO CORPORATION
- Koichiro Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR SILICON CARBIDE INGOT PEELING
- Publication number 20240149494
- Publication date May 9, 2024
- Industrial Technology Research Institute
- WENG-JUNG LU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PEELING APPARATUS
- Publication number 20230373129
- Publication date Nov 23, 2023
- Disco Corporation
- Koyo HONOKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR CUTTING SUBSTRATE ELEMENTS
- Publication number 20230302683
- Publication date Sep 28, 2023
- STMicroelectronics (Grenoble 2) SAS
- Melodie CHAPERON
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
DIVIDING APPARATUS
- Publication number 20230278260
- Publication date Sep 7, 2023
- Disco Corporation
- Shinya ARUGA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATE
- Publication number 20230137722
- Publication date May 4, 2023
- Disco Corporation
- Hayato IGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIVIDING METHOD OF WORKPIECE
- Publication number 20230102150
- Publication date Mar 30, 2023
- Disco Corporation
- Yohei MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING GLASS PLATE AND APPARATUS FOR MANUFACTURIN...
- Publication number 20230084567
- Publication date Mar 16, 2023
- Nippon Electric Glass Co., Ltd.
- Taisei MATSUBUSHI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR WAFERS
- Publication number 20230073379
- Publication date Mar 9, 2023
- DENSO CORPORATION
- Sodai NOMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PEELING APPARATUS
- Publication number 20220410431
- Publication date Dec 29, 2022
- Disco Corporation
- Koyo HONOKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PEELING METHOD AND PEELING APPARATUS
- Publication number 20220379520
- Publication date Dec 1, 2022
- Disco Corporation
- Ryohei YAMAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP MANUFACTURING DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20210391684
- Publication date Dec 16, 2021
- Mitsubishi Electric Corporation
- Tetsuya UETSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER FORMING METHOD
- Publication number 20210316476
- Publication date Oct 14, 2021
- Disco Corporation
- Keiji Nomaru
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PRODUCING METHOD AND WAFER PRODUCING APPARATUS
- Publication number 20210221026
- Publication date Jul 22, 2021
- Disco Corporation
- Keiji Nomaru
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIVIDING DEVICE FOR WAFER
- Publication number 20210129380
- Publication date May 6, 2021
- NAKAMURA-TOME PRECISION INDUSTRY CO., LTD.
- Tsuyoshi NAYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE MATRIX EXPANDER WITH PARTITIONED SUBRING
- Publication number 20200027772
- Publication date Jan 23, 2020
- TEXAS INSTRUMENTS INCORPORATED
- MATTHEW JOHN SHERBIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20190160597
- Publication date May 30, 2019
- Disco Corporation
- Jingshi CHI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CUTTING APPARATUS AND GROOVE DETECTING METHOD
- Publication number 20190067108
- Publication date Feb 28, 2019
- Disco Corporation
- Makoto Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE AND METHOD FOR CLEAVING A SUBSTRATE
- Publication number 20190054658
- Publication date Feb 21, 2019
- LatticeGear, LLC
- Gal Moyal
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
BRITTLE PLATE PROCESSING METHOD AND BRITTLE PLATE PROCESSING APPARATUS
- Publication number 20160280578
- Publication date Sep 29, 2016
- Asahi Glass Company, Limited
- Takashi YAMAMOTO
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
WAFER DIVIDER AND WAFER DIVISION METHOD
- Publication number 20160247723
- Publication date Aug 25, 2016
- Disco Corporation
- Naotoshi Kirihara
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Device and Method for Cleaving a Crystalline Sample
- Publication number 20160089813
- Publication date Mar 31, 2016
- IB LABS, INC.
- Dimitry BOGUSLAVSKY
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
MATERIAL SHEET HANDLING SYSTEM AND PROCESSING METHODS
- Publication number 20130302971
- Publication date Nov 14, 2013
- Corning Incorporated
- Chester Hann Huei Chang
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
DICING PROCESS AND DICING APPARATUS
- Publication number 20130029476
- Publication date Jan 31, 2013
- LEXTAR ELECTRONICS CORP.
- Chien-Sen WENG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR CUTTING GLASS SHEET
- Publication number 20120318838
- Publication date Dec 20, 2012
- NIPPON ELECTRIC GLASS CO., LTD.
- Takayoshi Saitoh
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SUBSTRATE CUTTING DEVICE AND METHOD
- Publication number 20120048906
- Publication date Mar 1, 2012
- Olivier Rayssac
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIV...
- Publication number 20110318879
- Publication date Dec 29, 2011
- Keiichi HATAKEYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIV...
- Publication number 20100267199
- Publication date Oct 21, 2010
- Keiichi Hatakeyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR ULTRA THIN WAFER BACKSIDE PROCESSING
- Publication number 20100221431
- Publication date Sep 2, 2010
- Tao Feng
- B28 - WORKING CEMENT, CLAY, OR STONE

Means for supporting or holding work during breaking

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing substrate

Method for manufacturing glass plate and apparatus for manufacturin...

Wafer producing method and wafer producing apparatus

Dividing device for wafer

Wafer forming method

Semiconductor chip manufacturing device and method of manufacturing...

Method for manufacturing ingot block, method for manufacturing semi...

Wafer processing method

Die matrix expander with partitioned subring

Device and method for cleaving a liquid sample

Device and method for cleaving a substrate

Photovoltaic structure cleaving system

Cutting apparatus and groove detecting method

Frame mounting after foil expansion

Wafer processing method

Method for dividing substrate along division lines using abrasive m...

Device and method for cleaving a crystalline sample

Brittle plate processing method and brittle plate processing apparatus

Photovoltaic structure cleaving system

Wafer divider and wafer division method

Substrate cutting device and method

Laser processing method

Method for cutting glass sheet

Material sheet handling system and processing methods

Flat display panel cutting apparatus

Method and apparatus for ultra thin wafer backside processing

System for breaking a semiconductor wafer or other workpiece along...

Substrate cutting device and method

Method for producing semiconductor chip with adhesive film, adhesiv...

Laser processing method

Patents Applicationslast 30 patents

BETA GALLIUM OXIDE SUBSTRATE MANUFACTURING METHOD

WAFER PRODUCTION METHOD

APPARATUS AND METHOD FOR SILICON CARBIDE INGOT PEELING

PEELING APPARATUS

METHOD FOR CUTTING SUBSTRATE ELEMENTS

DIVIDING APPARATUS

METHOD OF MANUFACTURING SUBSTRATE

DIVIDING METHOD OF WORKPIECE

METHOD FOR MANUFACTURING GLASS PLATE AND APPARATUS FOR MANUFACTURIN...

METHOD OF MANUFACTURING SEMICONDUCTOR WAFERS

PEELING APPARATUS

PEELING METHOD AND PEELING APPARATUS

SEMICONDUCTOR CHIP MANUFACTURING DEVICE AND METHOD OF MANUFACTURING...

WAFER FORMING METHOD

WAFER PRODUCING METHOD AND WAFER PRODUCING APPARATUS

DIVIDING DEVICE FOR WAFER

DIE MATRIX EXPANDER WITH PARTITIONED SUBRING

WAFER PROCESSING METHOD

CUTTING APPARATUS AND GROOVE DETECTING METHOD

DEVICE AND METHOD FOR CLEAVING A SUBSTRATE

BRITTLE PLATE PROCESSING METHOD AND BRITTLE PLATE PROCESSING APPARATUS

WAFER DIVIDER AND WAFER DIVISION METHOD

Device and Method for Cleaving a Crystalline Sample

MATERIAL SHEET HANDLING SYSTEM AND PROCESSING METHODS

DICING PROCESS AND DICING APPARATUS

METHOD FOR CUTTING GLASS SHEET

SUBSTRATE CUTTING DEVICE AND METHOD

METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIV...

METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIV...

METHOD AND APPARATUS FOR ULTRA THIN WAFER BACKSIDE PROCESSING