Means for thermal insulation

Industry

CPC
H05K2201/062

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/062Means for thermal insulation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Ground discontinuities for thermal isolation
- Patent number 12,193,142
- Issue date Jan 7, 2025
- International Business Machines Corporation
- Trevor Timpane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Test element support
- Patent number 11,911,768
- Issue date Feb 27, 2024
- Roche Diagnostics Operations, Inc.
- Reiner Stein
- G01 - MEASURING TESTING
Information Patent Grant
Thermal dissipation and shielding improvement using merged PCB bott...
- Patent number 11,723,143
- Issue date Aug 8, 2023
- Avago Technologies International Sales Pte. Limited
- Chang Kyu Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with signal integrity immunity to temperature
- Patent number 11,665,811
- Issue date May 30, 2023
- Dell Products L.P.
- Bhyrav Mutnury
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole and surface mount printed circuit card connections for...
- Patent number 11,570,894
- Issue date Jan 31, 2023
- Rockwell Collins, Inc.
- James B. Mayfield
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ground discontinuities for thermal isolation
- Patent number 11,558,955
- Issue date Jan 17, 2023
- International Business Machines Corporation
- Trevor Timpane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ceramic thermal insulation
- Patent number 11,548,826
- Issue date Jan 10, 2023
- Oulun Yliopisto
- Jari Hannu
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Printed-circuit board
- Patent number 11,343,901
- Issue date May 24, 2022
- Nippon Mektron, Ltd.
- Kenji Kiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal relief for through-hole and surface mounting
- Patent number 11,284,502
- Issue date Mar 22, 2022
- Western Digital Technologies, Inc.
- Chun Sean Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit boards for power supplies
- Patent number 11,277,900
- Issue date Mar 15, 2022
- ABB POWER ELECTRONICS INC.
- Robert Joseph Roessler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and electronic device
- Patent number 11,272,609
- Issue date Mar 8, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yohei Koshio
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrical circuit board with low thermal conductivity and method o...
- Patent number 11,259,398
- Issue date Feb 22, 2022
- Magna Seating Inc
- Eric Kozlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power circuit device
- Patent number 11,206,729
- Issue date Dec 21, 2021
- Mitsubishi Electric Corporation
- Shota Sato
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Radio frequency module and communication device
- Patent number 11,139,231
- Issue date Oct 5, 2021
- Murata Manufacturing Co., Ltd.
- Akifumi Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly having sectional thermal management
- Patent number 11,006,513
- Issue date May 11, 2021
- Deere & Company
- Christopher J. Schmit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with transistor components arranged side by side
- Patent number 10,973,113
- Issue date Apr 6, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit boards for power supplies
- Patent number 10,827,602
- Issue date Nov 3, 2020
- ABB POWER ELECTRONICS INC.
- Robert Joseph Roessler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive structure with self-healing properties and method for ma...
- Patent number 10,743,407
- Issue date Aug 11, 2020
- Interface Technology (ChengDu) Co., Ltd.
- Wen-Hsin Hsiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB apparatus and methods and computer program products for manufac...
- Patent number 10,616,990
- Issue date Apr 7, 2020
- Elta Systems Ltd.
- Yaniv Boaron
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic controlling apparatus
- Patent number 10,548,213
- Issue date Jan 28, 2020
- Mitsubishi Electric Corporation
- Tomohiko Nagashima
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Control module for an electric appliance
- Patent number 10,479,169
- Issue date Nov 19, 2019
- Valeo Systemes Thermiques
- Stéphane De Souza
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate
- Patent number 10,477,669
- Issue date Nov 12, 2019
- Shimadzu Corporation
- Kazuyuki Hashizume
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High performance compliant substrate
- Patent number 10,410,977
- Issue date Sep 10, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with cooling system for electronic cards
- Patent number 10,383,260
- Issue date Aug 13, 2019
- ALSTOM TRANSPORT TECHNOLOGIES
- Christophe Audemar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control module for an electric appliance
- Patent number 10,322,619
- Issue date Jun 18, 2019
- Valeo Systemes Thermiques
- Bertrand Puzenat
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electric motor controller
- Patent number 10,193,412
- Issue date Jan 29, 2019
- Mitsubishi Electric Corporation
- Rei Araki
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Circuit assembly, electrical junction box, and manufacturing method...
- Patent number 10,194,523
- Issue date Jan 29, 2019
- AutoNetworks Technologies, Ltd.
- Tatsuya Sumida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Computing system with superconducting and non-superconducting compo...
- Patent number 10,165,667
- Issue date Dec 25, 2018
- MICROSOFT TECHNOLOGIES LICENSING, LLC.
- Martin B. Christiansen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reduced thermal transfer to Peltier cooled FETs
- Patent number 10,130,003
- Issue date Nov 13, 2018
- Honeywell International Inc.
- Peter Charles Strickland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device having sealed heat-generation element
- Patent number 10,109,557
- Issue date Oct 23, 2018
- Denso Corporation
- Tetsuto Yamagishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COATING AGENT AND METHOD FOR MANUFACTURING MODULE USING THE COATING...
- Publication number 20250048560
- Publication date Feb 6, 2025
- SEKISUI CHEMICAL CO., LTD.
- Satoru KUROZUMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL INTERFACE ARRANGEMENT
- Publication number 20250024584
- Publication date Jan 16, 2025
- Genomtec S.A.
- Henryk Roguszczak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD
- Publication number 20240414841
- Publication date Dec 12, 2024
- MITSUBISHI MATERIALS CORPORATION
- Akira Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD
- Publication number 20240397606
- Publication date Nov 28, 2024
- Omron Corporation
- Junya MISHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY DEVICE HAVING THERMAL INSULATION FUNCTION
- Publication number 20240237186
- Publication date Jul 11, 2024
- ELEMENTS PERFORMANCE TECHNOLOGY INC.
- JERRYSON LEE
- F21 - LIGHTING
Information Patent Application
POWER SUPPLY DEVICE HAVING THERMAL INSULATION FUNCTION
- Publication number 20240138049
- Publication date Apr 25, 2024
- ELEMENTS PERFORMANCE TECHNOLOGY INC.
- JERRYSON LEE
- F21 - LIGHTING
Information Patent Application
POWER ADAPTER AND ELECTRONIC DEVICE SYSTEM
- Publication number 20240098879
- Publication date Mar 21, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Chunxia Xu
- B60 - VEHICLES IN GENERAL
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...
- Publication number 20240064907
- Publication date Feb 22, 2024
- FICT LIMITED
- Taiji Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sensor Node Thermal Management and Illumination
- Publication number 20230243706
- Publication date Aug 3, 2023
- Dwellwell Analytics, Inc.
- Daniel Simpkins
- G01 - MEASURING TESTING
Information Patent Application
PRINTED CIRCUIT BOARD WITH SIGNAL INTEGRITY IMMUNITY TO TEMPERATURE
- Publication number 20230133833
- Publication date May 4, 2023
- Dell Products L.P.
- Bhyrav MUTNURY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COATING AGENT AND METHOD FOR MANUFACTURING MODULE USING THE COATING...
- Publication number 20220124911
- Publication date Apr 21, 2022
- SEKISUI CHEMICAL CO., LTD.
- Satoru KUROZUMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER OVERLAY MODULE AND METHOD OF ASSEMBLING
- Publication number 20220070996
- Publication date Mar 3, 2022
- GE AVIATION SYSTEMS LLC
- David Richard Esler
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THROUGH-HOLE AND SURFACE MOUNT PRINTED CIRCUIT CARD CONNECTIONS FOR...
- Publication number 20210360789
- Publication date Nov 18, 2021
- Rockwell Collins, Inc.
- James B. Mayfield
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARDS FOR POWER SUPPLIES
- Publication number 20210274636
- Publication date Sep 2, 2021
- ABB POWER ELECTRONICS INC.
- Robert Joseph Roessler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL RELIEF FOR THROUGH-HOLE AND SURFACE MOUNTING
- Publication number 20210251068
- Publication date Aug 12, 2021
- Western Digital Technologies, Inc.
- Chun Sean Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED-CIRCUIT BOARD
- Publication number 20210243879
- Publication date Aug 5, 2021
- NIPPON MEKTRON, LTD.
- Kenji KIYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY HAVING SECTIONAL THERMAL MANAGEMENT
- Publication number 20210136907
- Publication date May 6, 2021
- Deere & Company
- Christopher J. Schmit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CIRCUIT BOARD WITH LOW THERMAL CONDUCTIVITY AND METHOD O...
- Publication number 20210105889
- Publication date Apr 8, 2021
- Magna Seating Inc.
- Eric Kozlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC DEVICE
- Publication number 20200367356
- Publication date Nov 19, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- Yohei KOSHIO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD STRUCTURE FOR HUMAN BODY INFRARED SENSOR TO REDUCE A...
- Publication number 20200337146
- Publication date Oct 22, 2020
- Brickcom Corporation
- YUNG-HSIANG HUANG
- G01 - MEASURING TESTING
Information Patent Application
CONDUCTIVE STRUCTURE WITH SELF-HEALING PROPERTIES AND METHOD FOR MA...
- Publication number 20200187348
- Publication date Jun 11, 2020
- Interface Technology (ChengDu) Co., Ltd.
- Wen-Hsin Hsiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC THERMAL INSULATION
- Publication number 20200123061
- Publication date Apr 23, 2020
- OULUN YLIOPISTO
- Jari HANNU
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20200035592
- Publication date Jan 30, 2020
- MURATA MANUFACTURING CO., LTD.
- Akifumi HONDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEST ELEMENT SUPPORT
- Publication number 20190232292
- Publication date Aug 1, 2019
- Roche Diagnostics Operations, Inc.
- Reiner Stein
- G01 - MEASURING TESTING
Information Patent Application
PCB APPARATUS AND METHODS AND COMPUTER PROGRAM PRODUCTS FOR MANUFAC...
- Publication number 20190191540
- Publication date Jun 20, 2019
- ELTA SYSTEMS LTD.
- Yaniv BOARON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER CIRCUIT DEVICE
- Publication number 20190110355
- Publication date Apr 11, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Shota SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
A METHOD OF THERMAL DECOUPLING OF PRINTED CIRCUITS AND A PRINTED CI...
- Publication number 20190059163
- Publication date Feb 21, 2019
- OSRAM GMBH
- Thomas Rieger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CONTROLLING APPARATUS
- Publication number 20190029107
- Publication date Jan 24, 2019
- Mitsubishi Electric Corporation
- Tomohiko NAGASHIMA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20180332699
- Publication date Nov 15, 2018
- Unlimiter MFA Co., Ltd.
- KUO-PING YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE WITH SWITCHABLE HEAT PATH
- Publication number 20180177037
- Publication date Jun 21, 2018
- Sonja Koller
- G06 - COMPUTING CALCULATING COUNTING

Means for thermal insulation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ground discontinuities for thermal isolation

Test element support

Thermal dissipation and shielding improvement using merged PCB bott...

Printed circuit board with signal integrity immunity to temperature

Through-hole and surface mount printed circuit card connections for...

Ground discontinuities for thermal isolation

Ceramic thermal insulation

Printed-circuit board

Thermal relief for through-hole and surface mounting

Printed circuit boards for power supplies

Circuit board and electronic device

Electrical circuit board with low thermal conductivity and method o...

Power circuit device

Radio frequency module and communication device

Electronic assembly having sectional thermal management

Component carrier with transistor components arranged side by side

Printed circuit boards for power supplies

Conductive structure with self-healing properties and method for ma...

PCB apparatus and methods and computer program products for manufac...

Electronic controlling apparatus

Control module for an electric appliance

Circuit substrate

High performance compliant substrate

Power module with cooling system for electronic cards

Control module for an electric appliance

Electric motor controller

Circuit assembly, electrical junction box, and manufacturing method...

Computing system with superconducting and non-superconducting compo...

Reduced thermal transfer to Peltier cooled FETs

Electronic device having sealed heat-generation element

Patents Applicationslast 30 patents

COATING AGENT AND METHOD FOR MANUFACTURING MODULE USING THE COATING...

THERMAL INTERFACE ARRANGEMENT

COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD

MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD

POWER SUPPLY DEVICE HAVING THERMAL INSULATION FUNCTION

POWER SUPPLY DEVICE HAVING THERMAL INSULATION FUNCTION

POWER ADAPTER AND ELECTRONIC DEVICE SYSTEM

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...

Sensor Node Thermal Management and Illumination

PRINTED CIRCUIT BOARD WITH SIGNAL INTEGRITY IMMUNITY TO TEMPERATURE

COATING AGENT AND METHOD FOR MANUFACTURING MODULE USING THE COATING...

POWER OVERLAY MODULE AND METHOD OF ASSEMBLING

THROUGH-HOLE AND SURFACE MOUNT PRINTED CIRCUIT CARD CONNECTIONS FOR...

PRINTED CIRCUIT BOARDS FOR POWER SUPPLIES

THERMAL RELIEF FOR THROUGH-HOLE AND SURFACE MOUNTING

PRINTED-CIRCUIT BOARD

ELECTRONIC ASSEMBLY HAVING SECTIONAL THERMAL MANAGEMENT

ELECTRICAL CIRCUIT BOARD WITH LOW THERMAL CONDUCTIVITY AND METHOD O...

CIRCUIT BOARD AND ELECTRONIC DEVICE

CIRCUIT BOARD STRUCTURE FOR HUMAN BODY INFRARED SENSOR TO REDUCE A...

CONDUCTIVE STRUCTURE WITH SELF-HEALING PROPERTIES AND METHOD FOR MA...

CERAMIC THERMAL INSULATION

RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE

TEST ELEMENT SUPPORT

PCB APPARATUS AND METHODS AND COMPUTER PROGRAM PRODUCTS FOR MANUFAC...

POWER CIRCUIT DEVICE

A METHOD OF THERMAL DECOUPLING OF PRINTED CIRCUITS AND A PRINTED CI...

ELECTRONIC CONTROLLING APPARATUS

PRINTED CIRCUIT BOARD

DEVICE WITH SWITCHABLE HEAT PATH