Mechanical elements

Industry

CPC
H01L2023/4075

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2023/4075Mechanical elements

Industries

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board and electronic device
- Patent number 11,013,102
- Issue date May 18, 2021
- Seiko Epson Corporation
- Naoki Suematsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and electronic device
- Patent number 10,779,390
- Issue date Sep 15, 2020
- Seiko Epson Corporation
- Naoki Suematsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component coupled to heat dissipation unit
- Patent number 10,727,154
- Issue date Jul 28, 2020
- Asia Vital Components Co., Ltd.
- Sheng-Huang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Containers for holding and dispensing stacks of electronic device c...
- Patent number 10,214,340
- Issue date Feb 26, 2019
- Intel Corporation
- Mingjie Xu
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Configurable mounting hole structure for flush mount integration wi...
- Patent number 10,211,125
- Issue date Feb 19, 2019
- HEATSCAPE.COM, INC.
- Ali Mira
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Sprung washer and fixing device
- Patent number 9,382,938
- Issue date Jul 5, 2016
- Fujitsu Limited
- Mitsuaki Hayashi
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Semiconductor device and semiconductor device fabrication method
- Patent number 9,196,566
- Issue date Nov 24, 2015
- Fuji Electric Co., Ltd.
- Kousuke Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket assembly incorporated with rotationally mounted pressing member
- Patent number 8,398,411
- Issue date Mar 19, 2013
- Hon Hai Precision Ind. Co., Ltd.
- Cheng-Ching Chien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink and method of forming a heatsink using a wedge-lock system
- Patent number 8,347,502
- Issue date Jan 8, 2013
- GE Intelligent Platforms, Inc
- David S. Slaton
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipation device for semiconductor package module, and semic...
- Patent number 7,796,395
- Issue date Sep 14, 2010
- Hynix Semiconductor Inc.
- Moon Su Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink mechanism
- Patent number 7,600,557
- Issue date Oct 13, 2009
- Asia Vital Components Co., Ltd.
- Shih-Chieh Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement in semiconductor packages for inhibiting adhesion of li...
- Patent number 7,572,677
- Issue date Aug 11, 2009
- Texas Instruments Incorporated
- Tz-Cheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic part-mounted substrate, thermal conductive member for el...
- Patent number 7,286,354
- Issue date Oct 23, 2007
- Brother Kogyo Kabushiki Kaisha
- Hiroto Sugahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement in semiconductor packages for inhibiting adhesion of li...
- Patent number 7,126,217
- Issue date Oct 24, 2006
- Texas Instruments Incorporated
- Tz-Cheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Heat Dissipating Object with Self Sealing Plug Allowing for a Therm...
- Publication number 20230413476
- Publication date Dec 21, 2023
- Yuci SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE MOUNTING HOLE STRUCTURE FOR FLUSH MOUNT INTEGRATION WI...
- Publication number 20190027425
- Publication date Jan 24, 2019
- HEATSCAPE.COM, INC.
- Ali Mira
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD
- Publication number 20140374898
- Publication date Dec 25, 2014
- Kousuke KOMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPRUNG WASHER AND FIXING DEVICE
- Publication number 20140161558
- Publication date Jun 12, 2014
- Fujitsu Limited
- Mitsuaki Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK AND METHOD OF FORMING A HEATSINK USING A WEDGE-LOCK SYSTEM
- Publication number 20130092363
- Publication date Apr 18, 2013
- GE FANUC INTELLIGENT PLATFORMS, INC.
- David S. Slaton
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20130083504
- Publication date Apr 4, 2013
- Fujitsu Limited
- Kenji FUKUZONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET ASSEMBLY INCORPORATED WITH ROTATIONALLY MOUNTED PRESSING MEMBER
- Publication number 20100178780
- Publication date Jul 15, 2010
- HON HAI PRECISION INDUSTRY CO., LTD.
- CHENG-CHING CHIEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK AND METHOD OF FORMING A HEATSINK USING A WEDGE-LOCK SYSTEM
- Publication number 20090166021
- Publication date Jul 2, 2009
- David S. Slaton
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT DISSIPATION DEVICE FOR SEMICONDUCTOR PACKAGE MODULE, AND SEMIC...
- Publication number 20090168364
- Publication date Jul 2, 2009
- Moon Soo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK MECHANISM
- Publication number 20090151492
- Publication date Jun 18, 2009
- Shih-Chieh Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangement in Semiconductor Packages for Inhibiting Adhesion of Li...
- Publication number 20070004083
- Publication date Jan 4, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Tz-Cheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic part-mounted substrate, thermal conductive member for el...
- Publication number 20060092235
- Publication date May 4, 2006
- BROTHER KOGYO KABUSHIKI KAISHA
- Hiroto Sugahara
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Arrangement in semiconductor packages for inhibiting adhesion of li...
- Publication number 20060027921
- Publication date Feb 9, 2006
- Tz-Cheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Mechanical elements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board and electronic device

Printed circuit board and electronic device

Component coupled to heat dissipation unit

Containers for holding and dispensing stacks of electronic device c...

Configurable mounting hole structure for flush mount integration wi...

Sprung washer and fixing device

Semiconductor device and semiconductor device fabrication method

Socket assembly incorporated with rotationally mounted pressing member

Heat sink and method of forming a heatsink using a wedge-lock system

Heat dissipation device for semiconductor package module, and semic...

Heat sink mechanism

Arrangement in semiconductor packages for inhibiting adhesion of li...

Electronic part-mounted substrate, thermal conductive member for el...

Arrangement in semiconductor packages for inhibiting adhesion of li...

Patents Applicationslast 30 patents

Heat Dissipating Object with Self Sealing Plug Allowing for a Therm...

CONFIGURABLE MOUNTING HOLE STRUCTURE FOR FLUSH MOUNT INTEGRATION WI...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD

SPRUNG WASHER AND FIXING DEVICE

HEAT SINK AND METHOD OF FORMING A HEATSINK USING A WEDGE-LOCK SYSTEM

ELECTRONIC DEVICE

SOCKET ASSEMBLY INCORPORATED WITH ROTATIONALLY MOUNTED PRESSING MEMBER

HEAT SINK AND METHOD OF FORMING A HEATSINK USING A WEDGE-LOCK SYSTEM

HEAT DISSIPATION DEVICE FOR SEMICONDUCTOR PACKAGE MODULE, AND SEMIC...

HEAT SINK MECHANISM

Arrangement in Semiconductor Packages for Inhibiting Adhesion of Li...

Electronic part-mounted substrate, thermal conductive member for el...

Arrangement in semiconductor packages for inhibiting adhesion of li...