Mechanical treatment

Industry

CPC
H01L21/4896

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4896Mechanical treatment

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having a semiconductor element and a wiring s...
- Patent number 12,057,324
- Issue date Aug 6, 2024
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Xuhui Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having semiconductor element with pins and fo...
- Patent number 11,581,196
- Issue date Feb 14, 2023
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Xuhui Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photovoltaic stringer and method for manufacturing photovoltaic ribbon
- Patent number 11,367,806
- Issue date Jun 21, 2022
- ZHEJIANG JINKO SOLAR CO., LTD.
- Wusong Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical wire connections for integrated circuit package
- Patent number 10,490,527
- Issue date Nov 26, 2019
- Intel IP Corporation
- Christian Geissler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire and method for manufacturing the same
- Patent number 10,483,130
- Issue date Nov 19, 2019
- KUNSHAN NEW FLAT PANEL DISPLAY TECHNOLOGY CENTER CO., LTD.
- Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit package with segmented external shield to provide internal...
- Patent number 10,134,682
- Issue date Nov 20, 2018
- Avago Technologies International Sales Pte. Limited
- Nitesh Kumbhat
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for producing a semiconductor module
- Patent number 10,032,743
- Issue date Jul 24, 2018
- Infineon Technologies AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Angled flying lead wire bonding process
- Patent number 7,495,342
- Issue date Feb 24, 2009
- International Business Machines Corporation
- Brian Samuel Beaman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Angled flying lead wire bonding process
- Patent number 6,708,403
- Issue date Mar 23, 2004
- International Business Machines Corporation
- Brian Samuel Beaman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic packaging methods and components
- Patent number 6,572,781
- Issue date Jun 3, 2003
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Angled flying lead wire bonding process
- Patent number 6,526,655
- Issue date Mar 4, 2003
- International Business Machines Corporation
- Brian Samuel Beaman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Angled flying lead wire bonding process
- Patent number 6,295,729
- Issue date Oct 2, 2001
- International Business Machines Corporation
- Brian Samuel Beaman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for forming and trimming leads
- Patent number 4,108,217
- Issue date Aug 22, 1978
- Formistor Corporation
- John Kellogg Westberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method for semiconductor device manufacture
- Patent number 3,996,659
- Issue date Dec 14, 1976
- Motorola, Inc.
- Stanley Gaicki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3545661
- Patent number 3,545,661
- Issue date Dec 8, 1970
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
3121563
- Patent number 3,121,563
- Issue date Feb 18, 1964
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HETEROGENEOUS PACKAGES HAVING THERMAL TOWERS
- Publication number 20230317551
- Publication date Oct 5, 2023
- Intel Corporation
- Vishnu Prasad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC...
- Publication number 20230230850
- Publication date Jul 20, 2023
- ams-OSRAM International GmbH
- Karlheinz ARNDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE STRUCTURE, WIRE STRUCTURE FORMATION METHOD, AND ELECTRONIC APP...
- Publication number 20230178495
- Publication date Jun 8, 2023
- SHINKAWA LTD.
- Sunki Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FORMATION METHOD THEREOF
- Publication number 20230137800
- Publication date May 4, 2023
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Xuhui PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FORMATION METHOD THEREOF
- Publication number 20210351042
- Publication date Nov 11, 2021
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Xuhui PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOVOLTAIC STRINGER AND METHOD FOR MANUFACTURING PHOTOVOLTAIC RIBBON
- Publication number 20210320220
- Publication date Oct 14, 2021
- ZHEJIANG JINKO SOLAR CO., LTD. JINKO SOLAR CO., LTD.
- Wusong TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL WIRE
- Publication number 20190385969
- Publication date Dec 19, 2019
- The Charles Stark Draper Laboratory, Inc.
- Caprice Gray Haley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180366345
- Publication date Dec 20, 2018
- Kunshan New Flat Panel Display Technology Center Co., Ltd.
- Kun HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT PACKAGE WITH SEGMENTED EXTERNAL SHIELD TO PROVIDE INTERNAL...
- Publication number 20170117230
- Publication date Apr 27, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Nitesh Kumbhat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Semiconductor Module
- Publication number 20140370663
- Publication date Dec 18, 2014
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANGLED FLYING LEAD WIRE BONDING PROCESS
- Publication number 20090189288
- Publication date Jul 30, 2009
- Brian Samuel Beaman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Angled flying lead wire bonding process
- Publication number 20040148773
- Publication date Aug 5, 2004
- Brian Samuel Beaman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Angled flying lead wire bonding process
- Publication number 20030106213
- Publication date Jun 12, 2003
- Brian Samuel Beaman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structural design and processes to control probe position accuracy...
- Publication number 20030048108
- Publication date Mar 13, 2003
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
Microelectronic packaging methods and components
- Publication number 20020074081
- Publication date Jun 20, 2002
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Angled flying lead wire bonding process
- Publication number 20010045012
- Publication date Nov 29, 2001
- Brian Samuel Beaman
- G01 - MEASURING TESTING

Mechanical treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package having a semiconductor element and a wiring s...

Semiconductor package having semiconductor element with pins and fo...

Photovoltaic stringer and method for manufacturing photovoltaic ribbon

Vertical wire connections for integrated circuit package

Wire and method for manufacturing the same

Circuit package with segmented external shield to provide internal...

Method for producing a semiconductor module

Angled flying lead wire bonding process

Angled flying lead wire bonding process

Microelectronic packaging methods and components

Angled flying lead wire bonding process

Angled flying lead wire bonding process

Method and apparatus for forming and trimming leads

Bonding method for semiconductor device manufacture

3545661

3121563

Patents Applicationslast 30 patents

HETEROGENEOUS PACKAGES HAVING THERMAL TOWERS

OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC...

WIRE STRUCTURE, WIRE STRUCTURE FORMATION METHOD, AND ELECTRONIC APP...

SEMICONDUCTOR PACKAGE AND FORMATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND FORMATION METHOD THEREOF

PHOTOVOLTAIC STRINGER AND METHOD FOR MANUFACTURING PHOTOVOLTAIC RIBBON

COAXIAL WIRE

WIRE AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT PACKAGE WITH SEGMENTED EXTERNAL SHIELD TO PROVIDE INTERNAL...

Method for Producing a Semiconductor Module

ANGLED FLYING LEAD WIRE BONDING PROCESS

Angled flying lead wire bonding process

Angled flying lead wire bonding process

Structural design and processes to control probe position accuracy...

Microelectronic packaging methods and components

Angled flying lead wire bonding process