Metal fusion bonding

Industry

CPC
Y10S228/00

This industry / category may be too specific. Please go to a parent level for more data

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method for forming non-bonded regions in multi-layered metallic armor
- Patent number 11,865,809
- Issue date Jan 9, 2024
- The Boeing Company
- Marc R. Matsen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire loop forming systems and methods of using the same
- Patent number 8,998,063
- Issue date Apr 7, 2015
- Orthodyne Electronics Corporation
- Jonathan Michael Byars
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Automated brazing system
- Patent number 8,960,522
- Issue date Feb 24, 2015
- Carrier Corporation
- Michael F. Taras
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding refractory ceramic and metal
- Patent number 8,899,470
- Issue date Dec 2, 2014
- Corning Incorporated
- David M. Lineman
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method of manufacturing semiconductor device, and wire bonder
- Patent number 8,881,966
- Issue date Nov 11, 2014
- Renesas Electronics Corporation
- Kazuyuki Misumi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Systems and methods for joining metal
- Patent number 8,499,995
- Issue date Aug 6, 2013
- Trane International, Inc.
- Riaan Oosthuysen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective cure of adhesive in modular assemblies
- Patent number 8,322,393
- Issue date Dec 4, 2012
- Tesla Motors, Inc.
- Weston Arthur Hermann
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wire bonding apparatus with a textured capillary surface enabling h...
- Patent number 8,267,303
- Issue date Sep 18, 2012
- National Semiconductor Corporation
- Ken Pham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual capillary IC wirebonding
- Patent number 8,225,982
- Issue date Jul 24, 2012
- Texas Instruments Incorporated
- Rex W Pirkle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for joining metal
- Patent number 8,205,784
- Issue date Jun 26, 2012
- Trane International Inc.
- Riaan Oosthuysen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical bond connection system
- Patent number 8,181,845
- Issue date May 22, 2012
- Robert Bosch GmbH
- Manfred Reinold
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Conductive bumps, wire loops, and methods of forming the same
- Patent number 8,152,046
- Issue date Apr 10, 2012
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Source blank for stainless steel three-ply clad sheet, production m...
- Patent number 8,100,313
- Issue date Jan 24, 2012
- Sumitomo Metal Industries, Ltd.
- Motomichi Kanbe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of teaching eyepoints for wire bonding and related semicondu...
- Patent number 8,100,317
- Issue date Jan 24, 2012
- Kulicke and Soffa Industries, Inc.
- Michael T. Deley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective cure of adhesive in modular assemblies
- Patent number 8,057,630
- Issue date Nov 15, 2011
- Tesla Motors, Inc.
- Weston Arthur Hermann
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Dual capillary IC wirebonding
- Patent number 8,008,183
- Issue date Aug 30, 2011
- Texas Instruments Incorporated
- Rex Warren Pirkle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Work clamp and wire bonding apparatus
- Patent number 7,975,899
- Issue date Jul 12, 2011
- Kaijo Corporation
- Riki Jindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vacuum wire tensioner for wire bonder
- Patent number 7,954,689
- Issue date Jun 7, 2011
- ASM Technology Singapore Pte. Ltd.
- Ka Shing Kenny Kwan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of teaching eyepoints for wire bonding and related semicondu...
- Patent number 7,931,186
- Issue date Apr 26, 2011
- Kulicke and Soffa Industries, Inc.
- Michael T. Deley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding deflector for a wire bonder
- Patent number 7,918,378
- Issue date Apr 5, 2011
- National Semiconductor Corporation
- Ken Pham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for ultrasonic welding of terminals
- Patent number 7,896,219
- Issue date Mar 1, 2011
- GM Global Technology Operations LLC
- Robert J. Scheuerman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compliant wirebond pedestal
- Patent number 7,847,378
- Issue date Dec 7, 2010
- Texas Instruments Incorporated
- Jeffrey W. Marsh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of correcting bonding coordinates using reference bond pads
- Patent number 7,817,846
- Issue date Oct 19, 2010
- Samsung Techwin Co., Ltd.
- Yong-bok Chung
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Holding tool for fixing an electronic component and circular table...
- Patent number 7,789,289
- Issue date Sep 7, 2010
- Smartrac Technology Germany GmbH
- Frank Bajahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer thermal insulation for a bonding system
- Patent number 7,681,775
- Issue date Mar 23, 2010
- ASM Technology Singapore Pte. Ltd.
- Ka Shing Kenny Kwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concave face wire bond capillary and method
- Patent number 7,677,429
- Issue date Mar 16, 2010
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tail wire cutting method and bonding apparatus
- Patent number 7,658,314
- Issue date Feb 9, 2010
- Kabushiki Kaisha Shinkawa
- Shinsuke Tei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead plate-attached coin-type battery whose lead plate is attached...
- Patent number 7,625,666
- Issue date Dec 1, 2009
- Sanyo Electric Co. Ltd.
- Tomoyuki Shose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding method
- Patent number 7,621,436
- Issue date Nov 24, 2009
- Kabushiki Kaisha Shinkawa
- Tatsunari Mii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal insulation for a bonding tool
- Patent number 7,614,540
- Issue date Nov 10, 2009
- ASM Technology Singapore Pte. Ltd.
- Ka Shing Kenny Kwan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDED REFRACTORY CERAMIC AND METAL ARTICLE
- Publication number 20140331718
- Publication date Nov 13, 2014
- David Myron Lineman
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
AUTOMATED BRAZING SYSTEM
- Publication number 20140084043
- Publication date Mar 27, 2014
- Michael F. Taras
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE LOOP FORMING SYSTEMS AND METHODS OF USING THE SAME
- Publication number 20130200134
- Publication date Aug 8, 2013
- Orthodyne Electronics Corporation
- Jonathan Michael Byars
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Systems and Methods For Joining Metal
- Publication number 20120273553
- Publication date Nov 1, 2012
- Trane International Inc.
- Riaan Oosthuysen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE CURE OF ADHESIVE IN MODULAR ASSEMBLIES
- Publication number 20120037310
- Publication date Feb 16, 2012
- TESLA MOTORS, INC.
- Weston A. Hermann
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
WIRE BONDING METHOD AND CAPILLARY ENABLING HIGH-SPEED WEDGE BONDING...
- Publication number 20120031955
- Publication date Feb 9, 2012
- National Semiconductor Corporation
- Ken Pham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BUMPS, WIRE LOOPS, AND METHODS OF FORMING THE SAME
- Publication number 20120006882
- Publication date Jan 12, 2012
- KULICKE AND SOFFA INDUSTRIES, INC.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dual Capillary IC Wirebonding
- Publication number 20110272449
- Publication date Nov 10, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Rex Warren PIRKLE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE CURE OF ADHESIVE IN MODULAR ASSEMBLIES
- Publication number 20110214808
- Publication date Sep 8, 2011
- Tesla Motors, Inc.
- Weston A. Hermann
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDU...
- Publication number 20110174865
- Publication date Jul 21, 2011
- KULICKE AND SOFFA INDUSTRIES, INC.
- Michael T. Deley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL BOND CONNECTION SYSTEM
- Publication number 20110121059
- Publication date May 26, 2011
- Manfred Reinold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Ultrasonic Welding of Terminals
- Publication number 20100224671
- Publication date Sep 9, 2010
- GM Global Technology Operations, Inc.
- Robert J. Scheuerman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND WIRE BONDER
- Publication number 20100203681
- Publication date Aug 12, 2010
- RENEASAS TECHNOLOGY CORP.
- KAZUYUKI MISUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDU...
- Publication number 20100181365
- Publication date Jul 22, 2010
- KULICKE AND SOFFA INDUSTRIES, INC.
- Michael T. Deley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Compliant Wirebond Pedestal
- Publication number 20090309211
- Publication date Dec 17, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey W. Marsh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Horn-holder pivot type bonding apparatus
- Publication number 20090272498
- Publication date Nov 5, 2009
- KABUSHIKI KAISHA SHINKAWA
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for bonding refractory ceramic and metal
- Publication number 20090142608
- Publication date Jun 4, 2009
- David M. Lineman
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Work Clamp and Wire Bonding Apparatus
- Publication number 20090134201
- Publication date May 28, 2009
- Riki Jindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dual Capillary IC Wirebonding
- Publication number 20090091006
- Publication date Apr 9, 2009
- Rex Warren Pirkle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW TEMPERATURE REACTIVE COMPOSITE JOINING
- Publication number 20090035542
- Publication date Feb 5, 2009
- Timothy P. Weihs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONCAVE FACE WIRE BOND CAPILLARY AND METHOD
- Publication number 20080302862
- Publication date Dec 11, 2008
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL INSULATION FOR A BONDING TOOL
- Publication number 20080272179
- Publication date Nov 6, 2008
- Ka Shing Kenny Kwan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER THERMAL INSULATION FOR A BONDING SYSTEM
- Publication number 20080274325
- Publication date Nov 6, 2008
- Ka Shing Kenny KWAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM WIRE TENSIONER FOR WIRE BONDER
- Publication number 20080272178
- Publication date Nov 6, 2008
- Ka Shing Kenny KWAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Source blank for stainless steel three-ply clad sheet, production m...
- Publication number 20080220308
- Publication date Sep 11, 2008
- Motomichi Kanbe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead plate-attached coin-type battery whose lead plate is attached...
- Publication number 20080081253
- Publication date Apr 3, 2008
- Sanyo Electric Co., Ltd.
- Tomoyuki Shose
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Wire clamp gap control mechanism and method
- Publication number 20080000946
- Publication date Jan 3, 2008
- ASM Technology Singapore Pte Ltd
- Ka Shing Kenny Kwan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tail wire cutting method and bonding apparatus
- Publication number 20070246513
- Publication date Oct 25, 2007
- KABUSHIKI KAISHA SHINKAWA
- Shinsuke Tei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of correcting bonding coordinates using reference bond pads
- Publication number 20070230771
- Publication date Oct 4, 2007
- Samsung Techwin Co., Ltd.
- Yong-bok Chung
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Compliant Wirebond Pedestal
- Publication number 20070205249
- Publication date Sep 6, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey W. Marsh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Metal fusion bonding

Industry

Parent Industries

Current Industry

Sub Industries

Patents Grantslast 30 patents

Method for forming non-bonded regions in multi-layered metallic armor

Wire loop forming systems and methods of using the same

Automated brazing system

Method for bonding refractory ceramic and metal

Method of manufacturing semiconductor device, and wire bonder

Systems and methods for joining metal

Selective cure of adhesive in modular assemblies

Wire bonding apparatus with a textured capillary surface enabling h...

Dual capillary IC wirebonding

Systems and methods for joining metal

Electrical bond connection system

Conductive bumps, wire loops, and methods of forming the same

Source blank for stainless steel three-ply clad sheet, production m...

Method of teaching eyepoints for wire bonding and related semicondu...

Selective cure of adhesive in modular assemblies

Dual capillary IC wirebonding

Work clamp and wire bonding apparatus

Vacuum wire tensioner for wire bonder

Method of teaching eyepoints for wire bonding and related semicondu...

Wire bonding deflector for a wire bonder

Method and apparatus for ultrasonic welding of terminals

Compliant wirebond pedestal

Method of correcting bonding coordinates using reference bond pads

Holding tool for fixing an electronic component and circular table...

Multi-layer thermal insulation for a bonding system

Concave face wire bond capillary and method

Tail wire cutting method and bonding apparatus

Lead plate-attached coin-type battery whose lead plate is attached...

Wire bonding method

Thermal insulation for a bonding tool

Patents Applicationslast 30 patents

BONDED REFRACTORY CERAMIC AND METAL ARTICLE

AUTOMATED BRAZING SYSTEM

WIRE LOOP FORMING SYSTEMS AND METHODS OF USING THE SAME

Systems and Methods For Joining Metal

SELECTIVE CURE OF ADHESIVE IN MODULAR ASSEMBLIES

WIRE BONDING METHOD AND CAPILLARY ENABLING HIGH-SPEED WEDGE BONDING...

CONDUCTIVE BUMPS, WIRE LOOPS, AND METHODS OF FORMING THE SAME

Dual Capillary IC Wirebonding

SELECTIVE CURE OF ADHESIVE IN MODULAR ASSEMBLIES

METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDU...

ELECTRICAL BOND CONNECTION SYSTEM

Method and Apparatus for Ultrasonic Welding of Terminals

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND WIRE BONDER

METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDU...

Compliant Wirebond Pedestal

Horn-holder pivot type bonding apparatus

Method for bonding refractory ceramic and metal

Work Clamp and Wire Bonding Apparatus

Dual Capillary IC Wirebonding

LOW TEMPERATURE REACTIVE COMPOSITE JOINING

CONCAVE FACE WIRE BOND CAPILLARY AND METHOD

THERMAL INSULATION FOR A BONDING TOOL

MULTI-LAYER THERMAL INSULATION FOR A BONDING SYSTEM

VACUUM WIRE TENSIONER FOR WIRE BONDER

Source blank for stainless steel three-ply clad sheet, production m...

Lead plate-attached coin-type battery whose lead plate is attached...

Wire clamp gap control mechanism and method

Tail wire cutting method and bonding apparatus

Method of correcting bonding coordinates using reference bond pads

Compliant Wirebond Pedestal