Wire bonding

Industry

CPC
Y10S228/904

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S228/00Metal fusion bonding

Current Industry

Y10S228/904Wire bonding

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wire loop forming systems and methods of using the same
- Patent number 8,998,063
- Issue date Apr 7, 2015
- Orthodyne Electronics Corporation
- Jonathan Michael Byars
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device, and wire bonder
- Patent number 8,881,966
- Issue date Nov 11, 2014
- Renesas Electronics Corporation
- Kazuyuki Misumi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wire bonding apparatus with a textured capillary surface enabling h...
- Patent number 8,267,303
- Issue date Sep 18, 2012
- National Semiconductor Corporation
- Ken Pham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual capillary IC wirebonding
- Patent number 8,225,982
- Issue date Jul 24, 2012
- Texas Instruments Incorporated
- Rex W Pirkle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical bond connection system
- Patent number 8,181,845
- Issue date May 22, 2012
- Robert Bosch GmbH
- Manfred Reinold
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Conductive bumps, wire loops, and methods of forming the same
- Patent number 8,152,046
- Issue date Apr 10, 2012
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of teaching eyepoints for wire bonding and related semicondu...
- Patent number 8,100,317
- Issue date Jan 24, 2012
- Kulicke and Soffa Industries, Inc.
- Michael T. Deley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual capillary IC wirebonding
- Patent number 8,008,183
- Issue date Aug 30, 2011
- Texas Instruments Incorporated
- Rex Warren Pirkle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Work clamp and wire bonding apparatus
- Patent number 7,975,899
- Issue date Jul 12, 2011
- Kaijo Corporation
- Riki Jindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vacuum wire tensioner for wire bonder
- Patent number 7,954,689
- Issue date Jun 7, 2011
- ASM Technology Singapore Pte. Ltd.
- Ka Shing Kenny Kwan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of teaching eyepoints for wire bonding and related semicondu...
- Patent number 7,931,186
- Issue date Apr 26, 2011
- Kulicke and Soffa Industries, Inc.
- Michael T. Deley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding deflector for a wire bonder
- Patent number 7,918,378
- Issue date Apr 5, 2011
- National Semiconductor Corporation
- Ken Pham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compliant wirebond pedestal
- Patent number 7,847,378
- Issue date Dec 7, 2010
- Texas Instruments Incorporated
- Jeffrey W. Marsh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of correcting bonding coordinates using reference bond pads
- Patent number 7,817,846
- Issue date Oct 19, 2010
- Samsung Techwin Co., Ltd.
- Yong-bok Chung
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Holding tool for fixing an electronic component and circular table...
- Patent number 7,789,289
- Issue date Sep 7, 2010
- Smartrac Technology Germany GmbH
- Frank Bajahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer thermal insulation for a bonding system
- Patent number 7,681,775
- Issue date Mar 23, 2010
- ASM Technology Singapore Pte. Ltd.
- Ka Shing Kenny Kwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concave face wire bond capillary and method
- Patent number 7,677,429
- Issue date Mar 16, 2010
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tail wire cutting method and bonding apparatus
- Patent number 7,658,314
- Issue date Feb 9, 2010
- Kabushiki Kaisha Shinkawa
- Shinsuke Tei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method
- Patent number 7,621,436
- Issue date Nov 24, 2009
- Kabushiki Kaisha Shinkawa
- Tatsunari Mii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal insulation for a bonding tool
- Patent number 7,614,540
- Issue date Nov 10, 2009
- ASM Technology Singapore Pte. Ltd.
- Ka Shing Kenny Kwan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Horn-holder pivot type bonding apparatus
- Patent number 7,578,421
- Issue date Aug 25, 2009
- Kabushiki Kaisha Shinkawa
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compliant wirebond pedestal
- Patent number 7,575,147
- Issue date Aug 18, 2009
- Texas Instruments Incorporated
- Jeffrey W. Marsh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Roller wire brake for wire bonding machine
- Patent number 7,565,995
- Issue date Jul 28, 2009
- Texas Instruments Incorporated
- Scott Anthony Delmont
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire clamp gap control mechanism and method
- Patent number 7,549,569
- Issue date Jun 23, 2009
- ASM Technology Singapore Pte. Ltd.
- Ka Shing Kenny Kwan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for mapping a position of a capillary tool tip...
- Patent number 7,527,186
- Issue date May 5, 2009
- Kulicke and Soffa Industries, Inc.
- David T. Beatson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Concave face wire bond capillary and method
- Patent number 7,416,107
- Issue date Aug 26, 2008
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding arm swinging type bonding apparatus
- Patent number 7,389,805
- Issue date Jun 24, 2008
- Kabushiki Kaisha Shinkawa
- Osamu Kakutani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire loop, semiconductor device having same, wire bonding method an...
- Patent number 7,262,124
- Issue date Aug 28, 2007
- Kaijo Corporation
- Hiromi Fujisawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compliant wirebond pedestal
- Patent number 7,214,607
- Issue date May 8, 2007
- Texas Instruments Incorporated
- Jeffrey W. Marsh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged IC using insulated wire
- Patent number 7,138,328
- Issue date Nov 21, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRE LOOP FORMING SYSTEMS AND METHODS OF USING THE SAME
- Publication number 20130200134
- Publication date Aug 8, 2013
- Orthodyne Electronics Corporation
- Jonathan Michael Byars
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING METHOD AND CAPILLARY ENABLING HIGH-SPEED WEDGE BONDING...
- Publication number 20120031955
- Publication date Feb 9, 2012
- National Semiconductor Corporation
- Ken Pham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BUMPS, WIRE LOOPS, AND METHODS OF FORMING THE SAME
- Publication number 20120006882
- Publication date Jan 12, 2012
- KULICKE AND SOFFA INDUSTRIES, INC.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dual Capillary IC Wirebonding
- Publication number 20110272449
- Publication date Nov 10, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Rex Warren PIRKLE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDU...
- Publication number 20110174865
- Publication date Jul 21, 2011
- KULICKE AND SOFFA INDUSTRIES, INC.
- Michael T. Deley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL BOND CONNECTION SYSTEM
- Publication number 20110121059
- Publication date May 26, 2011
- Manfred Reinold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND WIRE BONDER
- Publication number 20100203681
- Publication date Aug 12, 2010
- RENEASAS TECHNOLOGY CORP.
- KAZUYUKI MISUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDU...
- Publication number 20100181365
- Publication date Jul 22, 2010
- KULICKE AND SOFFA INDUSTRIES, INC.
- Michael T. Deley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Compliant Wirebond Pedestal
- Publication number 20090309211
- Publication date Dec 17, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey W. Marsh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Horn-holder pivot type bonding apparatus
- Publication number 20090272498
- Publication date Nov 5, 2009
- KABUSHIKI KAISHA SHINKAWA
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Work Clamp and Wire Bonding Apparatus
- Publication number 20090134201
- Publication date May 28, 2009
- Riki Jindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dual Capillary IC Wirebonding
- Publication number 20090091006
- Publication date Apr 9, 2009
- Rex Warren Pirkle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONCAVE FACE WIRE BOND CAPILLARY AND METHOD
- Publication number 20080302862
- Publication date Dec 11, 2008
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL INSULATION FOR A BONDING TOOL
- Publication number 20080272179
- Publication date Nov 6, 2008
- Ka Shing Kenny Kwan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER THERMAL INSULATION FOR A BONDING SYSTEM
- Publication number 20080274325
- Publication date Nov 6, 2008
- Ka Shing Kenny KWAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM WIRE TENSIONER FOR WIRE BONDER
- Publication number 20080272178
- Publication date Nov 6, 2008
- Ka Shing Kenny KWAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire clamp gap control mechanism and method
- Publication number 20080000946
- Publication date Jan 3, 2008
- ASM Technology Singapore Pte Ltd
- Ka Shing Kenny Kwan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tail wire cutting method and bonding apparatus
- Publication number 20070246513
- Publication date Oct 25, 2007
- KABUSHIKI KAISHA SHINKAWA
- Shinsuke Tei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of correcting bonding coordinates using reference bond pads
- Publication number 20070230771
- Publication date Oct 4, 2007
- Samsung Techwin Co., Ltd.
- Yong-bok Chung
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Compliant Wirebond Pedestal
- Publication number 20070205249
- Publication date Sep 6, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey W. Marsh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Horn-holder pivot type bonding apparatus
- Publication number 20070205252
- Publication date Sep 6, 2007
- KABUSHIKI KAISHA SHINKAWA
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HOLDING TOOL FOR FIXING AN ELECTRONIC COMPONENT AND CIRCULAR TABLE...
- Publication number 20070125830
- Publication date Jun 7, 2007
- SOKYMAT AUTOMOTIVE GMBH
- Frank BAJAHR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding method
- Publication number 20070108256
- Publication date May 17, 2007
- KABUSHIKI KAISHA SHINKAWA
- Tatsunari Mii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Roller wire brake for wire bonding machine
- Publication number 20060118597
- Publication date Jun 8, 2006
- Scott Anthony Delmont
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Concave face wire bond capillary and method
- Publication number 20060032888
- Publication date Feb 16, 2006
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for mapping a position of a capillary tool tip...
- Publication number 20050286060
- Publication date Dec 29, 2005
- David T. Beatson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire loop, semiconductor device having same, wire bonding method an...
- Publication number 20050189567
- Publication date Sep 1, 2005
- Hiromi Fujisawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding arm swinging type bonding apparatus
- Publication number 20050184127
- Publication date Aug 25, 2005
- KABUSHIKI KAISHA SHINKAWA
- Osamu Kakutani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Compliant wirebond pedestal
- Publication number 20050170556
- Publication date Aug 4, 2005
- Jeffrey W. Marsh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Roller wire brake for wire bonding machine
- Publication number 20050127137
- Publication date Jun 16, 2005
- Scott Anthony Delmont
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Wire bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wire loop forming systems and methods of using the same

Method of manufacturing semiconductor device, and wire bonder

Wire bonding apparatus with a textured capillary surface enabling h...

Dual capillary IC wirebonding

Electrical bond connection system

Conductive bumps, wire loops, and methods of forming the same

Method of teaching eyepoints for wire bonding and related semicondu...

Dual capillary IC wirebonding

Work clamp and wire bonding apparatus

Vacuum wire tensioner for wire bonder

Method of teaching eyepoints for wire bonding and related semicondu...

Wire bonding deflector for a wire bonder

Compliant wirebond pedestal

Method of correcting bonding coordinates using reference bond pads

Holding tool for fixing an electronic component and circular table...

Multi-layer thermal insulation for a bonding system

Concave face wire bond capillary and method

Tail wire cutting method and bonding apparatus

Wire bonding method

Thermal insulation for a bonding tool

Horn-holder pivot type bonding apparatus

Compliant wirebond pedestal

Roller wire brake for wire bonding machine

Wire clamp gap control mechanism and method

Method and apparatus for mapping a position of a capillary tool tip...

Concave face wire bond capillary and method

Bonding arm swinging type bonding apparatus

Wire loop, semiconductor device having same, wire bonding method an...

Compliant wirebond pedestal

Packaged IC using insulated wire

Patents Applicationslast 30 patents

WIRE LOOP FORMING SYSTEMS AND METHODS OF USING THE SAME

WIRE BONDING METHOD AND CAPILLARY ENABLING HIGH-SPEED WEDGE BONDING...

CONDUCTIVE BUMPS, WIRE LOOPS, AND METHODS OF FORMING THE SAME

Dual Capillary IC Wirebonding

METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDU...

ELECTRICAL BOND CONNECTION SYSTEM

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND WIRE BONDER

METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDU...

Compliant Wirebond Pedestal

Horn-holder pivot type bonding apparatus

Work Clamp and Wire Bonding Apparatus

Dual Capillary IC Wirebonding

CONCAVE FACE WIRE BOND CAPILLARY AND METHOD

THERMAL INSULATION FOR A BONDING TOOL

MULTI-LAYER THERMAL INSULATION FOR A BONDING SYSTEM

VACUUM WIRE TENSIONER FOR WIRE BONDER

Wire clamp gap control mechanism and method

Tail wire cutting method and bonding apparatus

Method of correcting bonding coordinates using reference bond pads

Compliant Wirebond Pedestal

Horn-holder pivot type bonding apparatus

HOLDING TOOL FOR FIXING AN ELECTRONIC COMPONENT AND CIRCULAR TABLE...

Wire bonding method

Roller wire brake for wire bonding machine

Concave face wire bond capillary and method

Method and apparatus for mapping a position of a capillary tool tip...

Wire loop, semiconductor device having same, wire bonding method an...

Bonding arm swinging type bonding apparatus

Compliant wirebond pedestal

Roller wire brake for wire bonding machine