Metal used as mask for etching vias

Industry

CPC
H05K2203/0554

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0554Metal used as mask for etching vias

Industries

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 12,133,329
- Issue date Oct 29, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Su Min Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resist layer forming method, method for manufacturing wiring board,...
- Patent number 11,818,847
- Issue date Nov 14, 2023
- Shinko Electric Industries Co., Ltd.
- Yoshihisa Kanbe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and method of manufacturing the same
- Patent number 11,690,178
- Issue date Jun 27, 2023
- Toppan Printing Co., Ltd.
- Hiroshi Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit electrode array and method of manufacturing the same
- Patent number 11,627,664
- Issue date Apr 11, 2023
- Cortigent, Inc.
- Robert Jay Greenberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of processed resin substrate and laser process...
- Patent number 11,338,393
- Issue date May 24, 2022
- LASER SYSTEMS INC.
- Kock Khuen Seet
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterning and removal of circuit board material using ultrafast la...
- Patent number 11,064,611
- Issue date Jul 13, 2021
- IPG Photonics Corporation
- David C. Clark
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer rigid flexible printed circuit board and method for manu...
- Patent number 10,674,610
- Issue date Jun 2, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer rigid flexible printed circuit board and method for manu...
- Patent number 10,602,616
- Issue date Mar 24, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer rigid flexible printed circuit board and method for manu...
- Patent number 10,368,445
- Issue date Jul 30, 2019
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit electrode array and method of manufacturing the same
- Patent number 10,362,681
- Issue date Jul 23, 2019
- Second Sight Medical Products, Inc.
- Robert Greenberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 10,219,383
- Issue date Feb 26, 2019
- Ibiden Co., Ltd.
- Katsutoshi Kitagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of dielectric with smooth surface
- Patent number 10,070,537
- Issue date Sep 4, 2018
- Intel Corporation
- Deepak Arora
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multilayer rigid flexible printed circuit board and method for manu...
- Patent number 9,743,529
- Issue date Aug 22, 2017
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 9,661,748
- Issue date May 23, 2017
- FANUC CORPORATION
- Norihiro Saidou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,603,248
- Issue date Mar 21, 2017
- Ibiden Co., Ltd.
- Teruyoshi Hisada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multi-layer circuit board and multi-layer c...
- Patent number 9,532,466
- Issue date Dec 27, 2016
- HAESUNG DS CO., LTD.
- Sang-min Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate
- Patent number 9,532,467
- Issue date Dec 27, 2016
- Via Technologies, Inc.
- Chen-Yueh Kung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a printed circuit board
- Patent number 9,491,866
- Issue date Nov 8, 2016
- LG Innotek Co., Ltd
- Sang Myung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for plug-in board replacement and method for manufacturing m...
- Patent number 9,370,101
- Issue date Jun 14, 2016
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a rigid-flexible printed circuit board
- Patent number 9,338,899
- Issue date May 10, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with built-in electronic component and method for manufac...
- Patent number 9,307,643
- Issue date Apr 5, 2016
- Ibiden Co., Ltd.
- Hisayuki Nakagome
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing circuit board and chip package and circuit...
- Patent number 9,257,310
- Issue date Feb 9, 2016
- HAESUNG DS CO., LTD.
- Sang-Min Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board and method for manufacturing the same
- Patent number 9,204,541
- Issue date Dec 1, 2015
- MURATA MANUFACTURING CO., LTD.
- Shunsuke Chisaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for fabricating wiring board
- Patent number 9,084,379
- Issue date Jul 14, 2015
- Unimicron Technology Corp.
- Tsung-Yuan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of circuit board
- Patent number 9,084,342
- Issue date Jul 14, 2015
- Unimicron Technology Corp.
- Chen-Chuan Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 8,925,192
- Issue date Jan 6, 2015
- Ibiden Co., Ltd.
- Kota Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for integrating an electronic component into a printed circu...
- Patent number 8,914,974
- Issue date Dec 23, 2014
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Wolfgang Schrittwieser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Double-sided circuit board and manufacturing method thereof
- Patent number 8,766,106
- Issue date Jul 1, 2014
- Ibiden Co., Ltd.
- Kota Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 8,698,009
- Issue date Apr 15, 2014
- Ibiden Co., Ltd.
- Kota Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of processing cavity of core substrate
- Patent number 8,633,397
- Issue date Jan 21, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jin-Soo Jeong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD AND STACKED STRUCTURE
- Publication number 20230371189
- Publication date Nov 16, 2023
- Unimicron Technology Corp.
- Chun-Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230209710
- Publication date Jun 29, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Su Min SONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIST LAYER FORMING METHOD, METHOD FOR MANUFACTURING WIRING BOARD,...
- Publication number 20220338354
- Publication date Oct 20, 2022
- Shinko Electric Industries Co., Ltd.
- Yoshihisa KANBE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNING AND REMOVAL OF CIRCUIT BOARD MATERIAL USING ULTRAFAST LA...
- Publication number 20200008305
- Publication date Jan 2, 2020
- IPG Photonics Corporation
- David C. Clark
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT ELECTRODE ARRAY AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190297729
- Publication date Sep 26, 2019
- Second Sight Medical Products, Inc.
- Robert Jay Greenberg
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180270958
- Publication date Sep 20, 2018
- IBIDEN CO., LTD.
- Katsutoshi KITAGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMATION OF DIELECTRIC WITH SMOOTH SURFACE
- Publication number 20140353019
- Publication date Dec 4, 2014
- Deepak Arora
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF PROCESSING CAVITY OF CORE SUBSTRATE
- Publication number 20140123486
- Publication date May 8, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jin-Soo Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD AND CHIP PACKAGE AND CIRCUIT...
- Publication number 20140113415
- Publication date Apr 24, 2014
- Sang-Min LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20140097009
- Publication date Apr 10, 2014
- Kentaro KANEKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING TH...
- Publication number 20140096383
- Publication date Apr 10, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PLUG-IN BOARD REPLACEMENT, METHOD FOR MANUFACTURING MULT...
- Publication number 20140063770
- Publication date Mar 6, 2014
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140041923
- Publication date Feb 13, 2014
- IBIDEN CO., LTD.
- Teruyoshi HISADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING A MULTILAYER RIGID FLEXIBLE PRINTED CIRCUI...
- Publication number 20140021164
- Publication date Jan 23, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANU...
- Publication number 20140008107
- Publication date Jan 9, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE
- Publication number 20140000953
- Publication date Jan 2, 2014
- VIA TECHNOLOGIES, INC.
- Chen-Yueh Kung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible Circuit Electrode Array and Method of Manufacturing the Same
- Publication number 20130319971
- Publication date Dec 5, 2013
- Second Sight Medical Products, Inc.
- Robert J Greenberg
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130299219
- Publication date Nov 14, 2013
- Shunsuke Chisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20130212877
- Publication date Aug 22, 2013
- Unimicron Technology Corp.
- Chen-Chuan Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME
- Publication number 20130192881
- Publication date Aug 1, 2013
- LG Innotek Co., Ltd.
- Sang Myung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD AND MULTI-LAYER C...
- Publication number 20130161073
- Publication date Jun 27, 2013
- Samsung Techwin Co., Ltd.
- Sang-min LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of manufacturing wire, TFT, and flat panel display device
- Publication number 20120315717
- Publication date Dec 13, 2012
- Samsung Mobile Display Co., Ltd.
- Dong-Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE
- Publication number 20120267155
- Publication date Oct 25, 2012
- VIA TECHNOLOGIES, INC.
- Chen-Yueh Kung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120186868
- Publication date Jul 26, 2012
- IBIDEN CO., LTD.
- Kota Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DOUBLE-SIDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20120181076
- Publication date Jul 19, 2012
- IBIDEN CO., LTD.
- Kota NODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR FABRICATING WIRING BOARD
- Publication number 20120174391
- Publication date Jul 12, 2012
- Unimicron Technology Corp.
- Tsung-Yuan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARDS WITH HOLES REQUIRING COPPER WRAP P...
- Publication number 20120144667
- Publication date Jun 14, 2012
- DDI GLOBAL CORP.
- Rajwant Singh Sidhu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120138337
- Publication date Jun 7, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Eung Soo KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20120125680
- Publication date May 24, 2012
- IBIDEN CO., LTD.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE AND FABRICATING PROCESS OF CIRCUIT SUBSTRATE
- Publication number 20120018207
- Publication date Jan 26, 2012
- VIA TECHNOLOGIES, INC.
- Chen-Yueh Kung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Metal used as mask for etching vias

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board and method for manufacturing the same

Resist layer forming method, method for manufacturing wiring board,...

Multilayer printed wiring board and method of manufacturing the same

Flexible circuit electrode array and method of manufacturing the same

Manufacturing method of processed resin substrate and laser process...

Patterning and removal of circuit board material using ultrafast la...

Multilayer rigid flexible printed circuit board and method for manu...

Multilayer rigid flexible printed circuit board and method for manu...

Multilayer rigid flexible printed circuit board and method for manu...

Flexible circuit electrode array and method of manufacturing the same

Printed wiring board and method for manufacturing the same

Formation of dielectric with smooth surface

Multilayer rigid flexible printed circuit board and method for manu...

Printed circuit board and method of manufacturing the same

Wiring board and method for manufacturing the same

Method of manufacturing multi-layer circuit board and multi-layer c...

Circuit substrate

Method for manufacturing a printed circuit board

Method for plug-in board replacement and method for manufacturing m...

Method of manufacturing a rigid-flexible printed circuit board

Substrate with built-in electronic component and method for manufac...

Method of manufacturing circuit board and chip package and circuit...

Multilayer circuit board and method for manufacturing the same

Process for fabricating wiring board

Manufacturing method of circuit board

Printed wiring board and method for manufacturing the same

Method for integrating an electronic component into a printed circu...

Double-sided circuit board and manufacturing method thereof

Printed wiring board and method for manufacturing the same

Method of processing cavity of core substrate

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING CIRCUIT BOARD AND STACKED STRUCTURE

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

RESIST LAYER FORMING METHOD, METHOD FOR MANUFACTURING WIRING BOARD,...

PATTERNING AND REMOVAL OF CIRCUIT BOARD MATERIAL USING ULTRAFAST LA...

FLEXIBLE CIRCUIT ELECTRODE ARRAY AND METHOD OF MANUFACTURING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

FORMATION OF DIELECTRIC WITH SMOOTH SURFACE

METHOD OF PROCESSING CAVITY OF CORE SUBSTRATE

METHOD OF MANUFACTURING CIRCUIT BOARD AND CHIP PACKAGE AND CIRCUIT...

WIRING SUBSTRATE

RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING TH...

METHOD FOR PLUG-IN BOARD REPLACEMENT, METHOD FOR MANUFACTURING MULT...

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MANUFACTURING A MULTILAYER RIGID FLEXIBLE PRINTED CIRCUI...

MULTILAYER RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANU...

CIRCUIT SUBSTRATE

Flexible Circuit Electrode Array and Method of Manufacturing the Same

MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

MANUFACTURING METHOD OF CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD AND MULTI-LAYER C...

Methods of manufacturing wire, TFT, and flat panel display device

CIRCUIT SUBSTRATE

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

DOUBLE-SIDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PROCESS FOR FABRICATING WIRING BOARD

MULTILAYER PRINTED WIRING BOARDS WITH HOLES REQUIRING COPPER WRAP P...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CIRCUIT SUBSTRATE AND FABRICATING PROCESS OF CIRCUIT SUBSTRATE