Metallic blocks or heatsinks completely inserted in a PCB

Industry

CPC
H05K2201/10416

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10416Metallic blocks or heatsinks completely inserted in a PCB

Industries

Patents Grantslast 30 patents

Information Patent Grant
Axial field rotary energy device with PCB stator with thermal expan...
- Patent number 12,046,966
- Issue date Jul 23, 2024
- INFINITUM ELECTRIC INC.
- Rich Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for mounting electronic element, electronic device, and e...
- Patent number 12,004,293
- Issue date Jun 4, 2024
- Kyocera Corporation
- Yukio Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods providing high-density memory arrangements with...
- Patent number 11,997,792
- Issue date May 28, 2024
- TORmem Inc.
- Steven White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 11,924,961
- Issue date Mar 5, 2024
- Unimicron Technology Corp.
- Ai Jing Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with an embedded thermally conductive block and m...
- Patent number 11,864,306
- Issue date Jan 2, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Erich Schlaffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inductor and power module
- Patent number 11,800,633
- Issue date Oct 24, 2023
- Chilisin Electronics Corp.
- Hung-Chih Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Axial field rotary energy device having PCB stator with non-linear...
- Patent number 11,777,354
- Issue date Oct 3, 2023
- Infinitum Electric, Inc.
- Paulo Guedes-Pinto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Axial field rotary energy device with segmented PCB stator having t...
- Patent number 11,710,995
- Issue date Jul 25, 2023
- Infinitum Electric, Inc.
- Rich Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal member-equipped circuit board, circuit assembly, and electric...
- Patent number 11,665,812
- Issue date May 30, 2023
- Autonetworks Technologies, Ltd.
- Koki Uchida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Illumination assembly including thermal energy management
- Patent number 11,619,376
- Issue date Apr 4, 2023
- INNOTEC, CORP.
- Thomas J. Veenstra
- F21 - LIGHTING
Information Patent Grant
Substrate for mounting electronic element, electronic device, and e...
- Patent number 11,612,056
- Issue date Mar 21, 2023
- Kyocera Corporation
- Yukio Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink and circuit device
- Patent number 11,557,521
- Issue date Jan 17, 2023
- Mitsubishi Electric Corporation
- Keiji Harada
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Shape memory thermal capacitor and methods for same
- Patent number 11,558,957
- Issue date Jan 17, 2023
- Raytheon Company
- David H. Altman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board heat sink structure and method therefor
- Patent number 11,523,498
- Issue date Dec 6, 2022
- HELLA GMBH & CO. KGAA
- Frank Grueter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel-to-reel lamination methods and devices in FPC fabrication
- Patent number 11,516,921
- Issue date Nov 29, 2022
- MANAFLEX, LLC
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel-to-reel laser ablation methods and devices in FPC fabrication
- Patent number 11,490,523
- Issue date Nov 1, 2022
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board having heat-dissipation block and method of manufactu...
- Patent number 11,445,596
- Issue date Sep 13, 2022
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-stack cooling structure for radiofrequency component
- Patent number 11,382,206
- Issue date Jul 5, 2022
- Comet AG
- André Grede
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Axial field rotary energy device with PCB stator panel having therm...
- Patent number 11,336,139
- Issue date May 17, 2022
- Infinitum Electric, Inc.
- Rich Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Axial field rotary energy device with PCB stator having interleaved...
- Patent number 11,283,319
- Issue date Mar 22, 2022
- Infinitum Electric, Inc.
- Jerad Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power distribution from point-of-load with cooling
- Patent number 11,252,811
- Issue date Feb 15, 2022
- Cisco Technology, Inc.
- Joel Richard Goergen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module and method for manufacturing the same
- Patent number 11,191,150
- Issue date Nov 30, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hong Seok Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Voltage regulator module
- Patent number 11,166,373
- Issue date Nov 2, 2021
- Delta Electronics, Inc.
- Yahong Xiong
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
High-speed hybrid circuit
- Patent number 11,057,984
- Issue date Jul 6, 2021
- II-VI DELAWARE, INC.
- Steven C. Bird
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly and sub-assembly for thermal control of electronic devices
- Patent number 11,039,528
- Issue date Jun 15, 2021
- Delta Design, Inc.
- Jerry Ihor Tustaniwskyj
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Reel-to-reel laser sintering methods and devices in FPC fabrication
- Patent number 11,026,333
- Issue date Jun 1, 2021
- MANAFLEX, LLC
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel-to-reel flexible printed circuit fabrication methods and devices
- Patent number 11,026,332
- Issue date Jun 1, 2021
- MANAFLEX, LLC
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combination parallel path heatsink and EMI shield
- Patent number 10,963,024
- Issue date Mar 30, 2021
- Apple Inc.
- Jonathan A. Matheson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Secondary side heatsink techniques for optical and electrical modules
- Patent number 10,939,536
- Issue date Mar 2, 2021
- Ciena Corporation
- Mitchell O'Leary
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and optical module having such circuit board
- Patent number 10,880,987
- Issue date Dec 29, 2020
- InnoLight Technology (Suzhou) LTD.
- Xigui Fang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
AXIAL FIELD ROTARY ENERGY DEVICE WITH PCB STATOR WITH THERMAL EXPAN...
- Publication number 20240372426
- Publication date Nov 7, 2024
- INFINITUM ELECTRIC INC.
- Rich Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods Providing High-Density Memory Arrangements with...
- Publication number 20240306305
- Publication date Sep 12, 2024
- TORmem Inc.
- Steven White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MAKING THE SAME
- Publication number 20240284592
- Publication date Aug 22, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHENG-YU CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME
- Publication number 20240237189
- Publication date Jul 11, 2024
- Meiko Electronics Co., Ltd.
- Tohru MATSUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SAFETY AND EMC COMPLIANT INTERNAL POWER PLANE HEAT SINK CAPACITOR
- Publication number 20240224411
- Publication date Jul 4, 2024
- International Business Machines Corporation
- John S. Werner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME
- Publication number 20240138053
- Publication date Apr 25, 2024
- Meiko Electronics Co., Ltd.
- Tohru MATSUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With an Embedded Thermally Conductive Block and M...
- Publication number 20240090118
- Publication date Mar 14, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Erich Schlaffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20240046965
- Publication date Feb 8, 2024
- KIOXIA Corporation
- Kosuke AWAGA
- G11 - INFORMATION STORAGE
Information Patent Application
Systems and Methods Providing High-Density Memory Arrangements with...
- Publication number 20240015890
- Publication date Jan 11, 2024
- TORmem Inc.
- Steven White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR MOUNTING ELECTRONIC ELEMENT, ELECTRONIC DEVICE, AND E...
- Publication number 20230328885
- Publication date Oct 12, 2023
- Kyocera Corporation
- Yukio MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230292428
- Publication date Sep 14, 2023
- Unimicron Technology Corp.
- Ai Jing LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Embedded Semiconductor Component and Embedde...
- Publication number 20230055435
- Publication date Feb 23, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes STAHR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20220377874
- Publication date Nov 24, 2022
- Unimicron Technology Corp.
- Chin-Sheng WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AXIAL FIELD ROTARY ENERGY DEVICE WITH PCB STATOR PANEL HAVING THERM...
- Publication number 20220271592
- Publication date Aug 25, 2022
- INFINITUM ELECTRIC, INC.
- Rich Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL MEMBER-EQUIPPED CIRCUIT BOARD, CIRCUIT ASSEMBLY, AND ELECTRIC...
- Publication number 20220183140
- Publication date Jun 9, 2022
- AutoNetworks Technolgies, Ltd.
- Koki UCHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INDUCTOR AND POWER MODULE
- Publication number 20220183142
- Publication date Jun 9, 2022
- CHILISIN ELECTRONICS CORP.
- HUNG-CHIH LIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ILLUMINATION ASSEMBLY INCLUDING THERMAL ENERGY MANAGEMENT
- Publication number 20220170622
- Publication date Jun 2, 2022
- INNOTEC, CORP.
- Thomas J. Veenstra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHAPE MEMORY THERMAL CAPACITOR AND METHODS FOR SAME
- Publication number 20210392737
- Publication date Dec 16, 2021
- David H. Altman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK AND CIRCUIT DEVICE
- Publication number 20210378084
- Publication date Dec 2, 2021
- MITSUBISHI ELECTRIC CORPORATION
- Keiji HARADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With an Embedded Thermally Conductive Block and M...
- Publication number 20210337653
- Publication date Oct 28, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Erich Schlaffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER DISTRIBUTION FROM POINT-OF-LOAD WITH COOLING
- Publication number 20210219415
- Publication date Jul 15, 2021
- Cisco Technology, Inc.
- Joel Richard Goergen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A KETTLE
- Publication number 20210204745
- Publication date Jul 8, 2021
- Con PSAROLOGOS
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Application
CIRCUIT BOARD HAVING HEAT-DISSIPATION BLOCK AND METHOD OF MANUFACTU...
- Publication number 20210144841
- Publication date May 13, 2021
- Unimicron Technology Corp.
- Chin-Sheng WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AXIAL FIELD ROTARY ENERGY DEVICE WITH SEGMENTED PCB STATOR HAVING T...
- Publication number 20210143691
- Publication date May 13, 2021
- INFINITUM ELECTRIC, INC.
- Rich Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL MEMBER-EQUIPPED CIRCUIT BOARD, CIRCUIT ASSEMBLY, AND ELECTRIC...
- Publication number 20210105891
- Publication date Apr 8, 2021
- AutoNetworks Technologies, Ltd.
- Koki Uchida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTOR
- Publication number 20210105915
- Publication date Apr 8, 2021
- DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
- XiaoKai WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATING DEVICE
- Publication number 20210100090
- Publication date Apr 1, 2021
- TEAM GROUP INC.
- CHIN FENG CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECONDARY SIDE HEATSINK TECHNIQUES FOR OPTICAL AND ELECTRICAL MODULES
- Publication number 20210084746
- Publication date Mar 18, 2021
- CIENA CORPORATION
- Mitchell O'Leary
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210045225
- Publication date Feb 11, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Hong Seok LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD HEAT SINK STRUCTURE AND METHOD THEREFOR
- Publication number 20200352021
- Publication date Nov 5, 2020
- HELLA GmbH & Co. KGaA
- Frank GRUETER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Metallic blocks or heatsinks completely inserted in a PCB

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Axial field rotary energy device with PCB stator with thermal expan...

Substrate for mounting electronic element, electronic device, and e...

Systems and methods providing high-density memory arrangements with...

Circuit board and method of manufacturing the same

Component carrier with an embedded thermally conductive block and m...

Inductor and power module

Axial field rotary energy device having PCB stator with non-linear...

Axial field rotary energy device with segmented PCB stator having t...

Metal member-equipped circuit board, circuit assembly, and electric...

Illumination assembly including thermal energy management

Substrate for mounting electronic element, electronic device, and e...

Heat sink and circuit device

Shape memory thermal capacitor and methods for same

Circuit board heat sink structure and method therefor

Reel-to-reel lamination methods and devices in FPC fabrication

Reel-to-reel laser ablation methods and devices in FPC fabrication

Circuit board having heat-dissipation block and method of manufactu...

Multi-stack cooling structure for radiofrequency component

Axial field rotary energy device with PCB stator panel having therm...

Axial field rotary energy device with PCB stator having interleaved...

Power distribution from point-of-load with cooling

Electronic component module and method for manufacturing the same

Voltage regulator module

High-speed hybrid circuit

Assembly and sub-assembly for thermal control of electronic devices

Reel-to-reel laser sintering methods and devices in FPC fabrication

Reel-to-reel flexible printed circuit fabrication methods and devices

Combination parallel path heatsink and EMI shield

Secondary side heatsink techniques for optical and electrical modules

Circuit board and optical module having such circuit board

Patents Applicationslast 30 patents

AXIAL FIELD ROTARY ENERGY DEVICE WITH PCB STATOR WITH THERMAL EXPAN...

Systems and Methods Providing High-Density Memory Arrangements with...

PRINTED CIRCUIT BOARD AND METHOD FOR MAKING THE SAME

DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME

SAFETY AND EMC COMPLIANT INTERNAL POWER PLANE HEAT SINK CAPACITOR

DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME

Component Carrier With an Embedded Thermally Conductive Block and M...

SEMICONDUCTOR STORAGE DEVICE

Systems and Methods Providing High-Density Memory Arrangements with...

SUBSTRATE FOR MOUNTING ELECTRONIC ELEMENT, ELECTRONIC DEVICE, AND E...

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Component Carrier With Embedded Semiconductor Component and Embedde...

METHOD OF MANUFACTURING CIRCUIT BOARD

AXIAL FIELD ROTARY ENERGY DEVICE WITH PCB STATOR PANEL HAVING THERM...

METAL MEMBER-EQUIPPED CIRCUIT BOARD, CIRCUIT ASSEMBLY, AND ELECTRIC...

INDUCTOR AND POWER MODULE

ILLUMINATION ASSEMBLY INCLUDING THERMAL ENERGY MANAGEMENT

SHAPE MEMORY THERMAL CAPACITOR AND METHODS FOR SAME

HEAT SINK AND CIRCUIT DEVICE

Component Carrier With an Embedded Thermally Conductive Block and M...

POWER DISTRIBUTION FROM POINT-OF-LOAD WITH COOLING

A KETTLE

CIRCUIT BOARD HAVING HEAT-DISSIPATION BLOCK AND METHOD OF MANUFACTU...

AXIAL FIELD ROTARY ENERGY DEVICE WITH SEGMENTED PCB STATOR HAVING T...

METAL MEMBER-EQUIPPED CIRCUIT BOARD, CIRCUIT ASSEMBLY, AND ELECTRIC...

ELECTRICAL CONNECTOR

HEAT DISSIPATING DEVICE

SECONDARY SIDE HEATSINK TECHNIQUES FOR OPTICAL AND ELECTRICAL MODULES

ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT BOARD HEAT SINK STRUCTURE AND METHOD THEREFOR