Method for plating stud vias

Industry

CPC
H05K2203/0733

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0733Method for plating stud vias

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic device
- Patent number 10,879,227
- Issue date Dec 29, 2020
- Renesas Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of double layer circuit board
- Patent number 10,779,418
- Issue date Sep 15, 2020
- Kinsus Interconnect Technology Corp.
- Ting-Hao Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component-embedded substrate, method of manufacturing the same, and...
- Patent number 10,707,172
- Issue date Jul 7, 2020
- Murata Manufacturing Co., Ltd.
- Hiroshi Somada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,600,728
- Issue date Mar 24, 2020
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 10,580,763
- Issue date Mar 3, 2020
- Renesas Electronics Corporation
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing mode converter
- Patent number 10,511,077
- Issue date Dec 17, 2019
- Fujikura Ltd.
- Yusuke Uemichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double layer circuit board
- Patent number 10,440,836
- Issue date Oct 8, 2019
- Kinsus Interconnect Technology Corp.
- Ting-Hao Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of double layer circuit board
- Patent number 10,440,837
- Issue date Oct 8, 2019
- Kinsus Interconnect Technology Corp.
- Ting-Hao Lin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated electronic components and methods of formation thereof
- Patent number 10,431,521
- Issue date Oct 1, 2019
- Cubic Corporation
- Jean-Marc Rollin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Manufacturing method and wiring substrate with through electrode
- Patent number 10,256,117
- Issue date Apr 9, 2019
- Sony Corporation
- Shun Mitarai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,224,318
- Issue date Mar 5, 2019
- Renesas Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package structure
- Patent number 10,211,139
- Issue date Feb 19, 2019
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Biocompatible bonding method and electronics package suitable for i...
- Patent number 10,159,845
- Issue date Dec 25, 2018
- Second Sight Medical Products, Inc.
- Robert J. Greenberg
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,157,900
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Robust multi-layer wiring elements and assemblies with embedded mic...
- Patent number 10,032,646
- Issue date Jul 24, 2018
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect formed through buildup process
- Patent number 10,028,394
- Issue date Jul 17, 2018
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,014,244
- Issue date Jul 3, 2018
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electronic components and methods of formation thereof
- Patent number 10,002,818
- Issue date Jun 19, 2018
- NUVOTRONICS, INC.
- Jean-Marc Rollin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect formed through buildup process
- Patent number 9,955,589
- Issue date Apr 24, 2018
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper pillar full metal via electrical circuit structure
- Patent number 9,930,775
- Issue date Mar 27, 2018
- HSIO Technologies, LLC
- Jim Rathburn
- G02 - OPTICS
Information Patent Grant
Manufacturing method of interposed substrate
- Patent number 9,859,130
- Issue date Jan 2, 2018
- Unimicron Technology Corp.
- Dyi-Chung Hu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Biocompatible bonding method and electronics package suitable for i...
- Patent number 9,849,297
- Issue date Dec 26, 2017
- Second Sight Medical Products, Inc.
- Robert J Greenberg
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Manufacturing method of interposed substrate
- Patent number 9,831,103
- Issue date Nov 28, 2017
- Unimicron Technology Corp.
- Dyi-Chung Hu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Biocompatible bonding method and electronics package suitable for i...
- Patent number 9,592,396
- Issue date Mar 14, 2017
- Second Sight Medical Products, Inc.
- Robert J. Greenberg
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Security mesh and method of making
- Patent number 9,565,777
- Issue date Feb 7, 2017
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 9,543,373
- Issue date Jan 10, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Biocompatible bonding method and electronics package suitable for i...
- Patent number 9,532,451
- Issue date Dec 27, 2016
- Second Sight Medical Products, Inc.
- Robert Greenberg
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method for copper plating
- Patent number 9,506,158
- Issue date Nov 29, 2016
- Atotech Deutschland GmbH
- Dirk Rohde
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Three dimensional organic or glass interposer
- Patent number 9,490,197
- Issue date Nov 8, 2016
- GLOBALFOUNDRIES Inc.
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing printed circuit boards with stacked micro...
- Patent number 9,485,876
- Issue date Nov 1, 2016
- Viasystems Technologies Corp., L.L.C.
- Raj Kumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20200118994
- Publication date Apr 16, 2020
- RENESAS ELECTRONICS CORPORATION
- Yoichiro KURITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF DOUBLE LAYER CIRCUIT BOARD
- Publication number 20190387631
- Publication date Dec 19, 2019
- KINSUS INTERCONNECT TECHNOLOGY CORP.
- Ting-Hao LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20180277471
- Publication date Sep 27, 2018
- DAI NIPPON PRINTING CO., LTD.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT FORMED THROUGH BUILDUP PROCESS
- Publication number 20180213655
- Publication date Jul 26, 2018
- Intel Corporation
- MIHIR K. ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF
- Publication number 20180082923
- Publication date Mar 22, 2018
- Nuvotronics, INC
- Jean-Marc Rollin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Biocompatible Bonding Method and Electronics Package Suitable for I...
- Publication number 20170095671
- Publication date Apr 6, 2017
- Second Sight Medical Products, Inc.
- Robert J. Greenberg
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Biocompatible Bonding Method and Electronics Package Suitable for I...
- Publication number 20160255720
- Publication date Sep 1, 2016
- Second Sight Medical Products, Inc.
- Robert Greenberg
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
THREE DIMENSIONAL ORGANIC OR GLASS INTERPOSER
- Publication number 20160141237
- Publication date May 19, 2016
- International Business Machines Corporation
- Mukta G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20140346681
- Publication date Nov 27, 2014
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connection Component with Posts and Pads
- Publication number 20140262460
- Publication date Sep 18, 2014
- Tessera, Inc.
- YOICHI KUBOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR FULL METAL VIA ELECTRICAL CIRCUIT STRUCTURE
- Publication number 20140225255
- Publication date Aug 14, 2014
- HSIO TECHNOLOGIES, LLC
- JIM RATHBURN
- G02 - OPTICS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140182915
- Publication date Jul 3, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Sung HAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL INTERCONNECT FORMED THROUGH BUILDUP PROCESS
- Publication number 20140166353
- Publication date Jun 19, 2014
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSED SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20140138142
- Publication date May 22, 2014
- Unimicron Technology Corp.
- Dyi-Chung Hu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrode and Method of Forming the Master Electrode
- Publication number 20140110265
- Publication date Apr 24, 2014
- Centre de Recherche Public - Gabriel Lippmann
- Mikael Fredenberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20140103524
- Publication date Apr 17, 2014
- RENESAS ELECTRONICS CORPORATION
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR COPPER PLATING
- Publication number 20140102910
- Publication date Apr 17, 2014
- Atotech Deutschland GmbH
- Dirk Rohde
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MULTI-LAYER TYPE CORELESS SUBSTRATE AND METHOD OF MANUFACTURING THE...
- Publication number 20140102766
- Publication date Apr 17, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Da Hee Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package substrate and die spacer layers having a ceramic backbone
- Publication number 20130341076
- Publication date Dec 26, 2013
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SUPPRESSING POWER PLANE NOISE
- Publication number 20130326871
- Publication date Dec 12, 2013
- Micron Technology, Inc.
- Houfei Chen
- G11 - INFORMATION STORAGE
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20130328214
- Publication date Dec 12, 2013
- DAI NIPPON PRINTING CO., LTD.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSED SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20130313011
- Publication date Nov 28, 2013
- Unimicron Technology Corp.
- Dyi-Chung Hu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF
- Publication number 20130285218
- Publication date Oct 31, 2013
- Jean-Marc Rollin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD OF MANUFACTURING PRINTED WIRING BOARD
- Publication number 20130192880
- Publication date Aug 1, 2013
- Shinko Electric Industries Co., Ltd.
- Tsukasa NAKANISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A BASE LAYER CIRCUIT STRUCTURE
- Publication number 20130185935
- Publication date Jul 25, 2013
- EPIC TECHNOLOGIES, INC.
- Charles W. EICHELBEGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20130099390
- Publication date Apr 25, 2013
- RENESAS ELECTRONICS CORPORATION
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SUBSTRATE AND MANUFACTURING METHOD OF WIRIN...
- Publication number 20130062210
- Publication date Mar 14, 2013
- HOYA CORPORATION
- Takashi FUSHIE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGING HAVING PRE-ENCAPSULATION THROUGH VIA...
- Publication number 20130049218
- Publication date Feb 28, 2013
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THEREOF
- Publication number 20130033837
- Publication date Feb 7, 2013
- Sotaro Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL WAVEGUIDE LAMINATED WIRING BOARD
- Publication number 20130011096
- Publication date Jan 10, 2013
- Shinko Electric Industries Co., Ltd.
- Kenji Yanagisawa
- G02 - OPTICS

Method for plating stud vias

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device

Manufacturing method of double layer circuit board

Component-embedded substrate, method of manufacturing the same, and...

Through-hole electrode substrate

Electronic device

Method for manufacturing mode converter

Double layer circuit board

Manufacturing method of double layer circuit board

Integrated electronic components and methods of formation thereof

Manufacturing method and wiring substrate with through electrode

Electronic device

Chip package structure

Biocompatible bonding method and electronics package suitable for i...

Semiconductor structure and manufacturing method thereof

Robust multi-layer wiring elements and assemblies with embedded mic...

Electrical interconnect formed through buildup process

Through-hole electrode substrate

Integrated electronic components and methods of formation thereof

Electrical interconnect formed through buildup process

Copper pillar full metal via electrical circuit structure

Manufacturing method of interposed substrate

Biocompatible bonding method and electronics package suitable for i...

Manufacturing method of interposed substrate

Biocompatible bonding method and electronics package suitable for i...

Security mesh and method of making

Semiconductor structure and manufacturing method thereof

Biocompatible bonding method and electronics package suitable for i...

Method for copper plating

Three dimensional organic or glass interposer

Methods of manufacturing printed circuit boards with stacked micro...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

MANUFACTURING METHOD OF DOUBLE LAYER CIRCUIT BOARD

THROUGH-HOLE ELECTRODE SUBSTRATE

ELECTRICAL INTERCONNECT FORMED THROUGH BUILDUP PROCESS

INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF

Biocompatible Bonding Method and Electronics Package Suitable for I...

Biocompatible Bonding Method and Electronics Package Suitable for I...

THREE DIMENSIONAL ORGANIC OR GLASS INTERPOSER

ELECTRONIC DEVICE

Connection Component with Posts and Pads

COPPER PILLAR FULL METAL VIA ELECTRICAL CIRCUIT STRUCTURE

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

ELECTRICAL INTERCONNECT FORMED THROUGH BUILDUP PROCESS

INTERPOSED SUBSTRATE AND MANUFACTURING METHOD THEREOF

Electrode and Method of Forming the Master Electrode

ELECTRONIC DEVICE

METHOD FOR COPPER PLATING

MULTI-LAYER TYPE CORELESS SUBSTRATE AND METHOD OF MANUFACTURING THE...

Package substrate and die spacer layers having a ceramic backbone

METHODS FOR SUPPRESSING POWER PLANE NOISE

THROUGH-HOLE ELECTRODE SUBSTRATE

INTERPOSED SUBSTRATE AND MANUFACTURING METHOD THEREOF

INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF

PRINTED WIRING BOARD AND METHOD OF MANUFACTURING PRINTED WIRING BOARD

METHOD OF FABRICATING A BASE LAYER CIRCUIT STRUCTURE

ELECTRONIC DEVICE

MANUFACTURING METHOD OF SUBSTRATE AND MANUFACTURING METHOD OF WIRIN...

SEMICONDUCTOR DEVICE PACKAGING HAVING PRE-ENCAPSULATION THROUGH VIA...

MULTILAYER PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THEREOF

OPTICAL WAVEGUIDE LAMINATED WIRING BOARD